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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2020301254A1
METALLIZED CAMERA WINDOWS
Publication/Patent Number: US2020301254A1 Publication Date: 2020-09-24 Application Number: 16/356,735 Filing Date: 2019-03-18 Inventor: Nguyen, Thuc-uyen   Assignee: Sensors unlimited inc   IPC: G03B17/12 Abstract: An optical assembly includes a window having an interior surface and an opposed exterior surface. A perimeter surface connects between the interior surface and the exterior surface. A metal layer is bonded to the perimeter surface of the window. An anti-reflective coating (ARC) is bonded to the interior surface of the window. A metallic lid is joined to the metal layer for enclosing a focal plane array (FPA) aligned with the window.
2
US10645348B2
Data communication between image sensors and image displays
Publication/Patent Number: US10645348B2 Publication Date: 2020-05-05 Application Number: 16/029,583 Filing Date: 2018-07-07 Inventor: Moseman, Samuel   Canahuati, Mathew   Assignee: Sensors unlimited inc   IPC: H04N5/232 Abstract: An imaging method includes determining heading of a digital weapon sight, determining heading of a helmet mounted display, and calculating difference between the heading of the digital weapon sight and the heading of the helmet mounted display. When the difference between the heading of the digital weapon sight and the heading of the helmet mounted display is outside of a predetermined range image data communication between the digital weapon sight and the helmet mounted display is disabled. Imaging systems and weapons assemblies having imaging systems are also described.
3
US2020051224A1
SCALED TWO-BAND HISTOGRAM PROCESS FOR IMAGE ENHANCEMENT
Publication/Patent Number: US2020051224A1 Publication Date: 2020-02-13 Application Number: 16/057,280 Filing Date: 2018-08-07 Inventor: Nguyen, Thuc-uyen   Assignee: Sensors unlimited inc   IPC: G06T5/40 Abstract: A method of image enhancement includes constructing an input histogram corresponding to an input image received at a focal plane array. The method includes performing histogram equalization on a first band of the input histogram starting from a zero value and ending at a division value representing a pixel bin value where a predetermined fraction of the input histogram by pixel hound is reached to produce a first portion of an equalization curve. The method includes performing histogram equalization on a second band of the input histogram starting from the division value and ending at a pixel bin value where all of the input histogram by pixel count is reached to produce a second portion of the equalization curve. The method includes applying the equalization curve to the input image to produce a corresponding enhanced image.
4
US10753709B2
Tactical rails, tactical rail systems, and firearm assemblies having tactical rails
Publication/Patent Number: US10753709B2 Publication Date: 2020-08-25 Application Number: 15/983,048 Filing Date: 2018-05-17 Inventor: Neal, Henry William   Assignee: Sensors unlimited inc   IPC: F41G11/00 Abstract: A tactical rail for a firearm includes a rail body having a receiver end and a muzzle end, a non-contact optical connection, and a high speed data spoke. The non-contact optical connection is arranged at an end of the rail body and is configured to interface with a corresponding non-contact optical interface. The high speed data spoke is connected to the non-contact optical connection for high speed data communication through the non-contact optical connection and the corresponding non-contact optical interface. Tactical rail arrangements and firearm with tactical rails and tactical rail arrangements are also described.
5
US10529753B2
Pixels
Publication/Patent Number: US10529753B2 Publication Date: 2020-01-07 Application Number: 14/931,569 Filing Date: 2015-11-03 Inventor: Mushini, Prabhu   Huang, Wei   Assignee: Sensors unlimited inc   IPC: H01L27/146 Abstract: A photodiode has an absorption layer and a cap layer operatively connected to the absorption layer. A pixel is formed in the cap layer and extends into the absorption layer to receive charge generated from photons therefrom. The pixel defines an annular diffused area to reduce dark current and capacitance. A photodetector includes the photodiode. The photodiode includes an array of pixels formed in the cap layer. At least one of the pixels extends into the absorption layer to receive charge generated from photons therefrom. At least one of the pixels defines an annular diffused area to reduce dark current and capacitance.
6
US2020052012A1
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
Publication/Patent Number: US2020052012A1 Publication Date: 2020-02-13 Application Number: 16/057,191 Filing Date: 2018-08-07 Inventor: Zhang, Wei   Evans, Michael J.   Malchow, Douglas Stewart   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors unlimited inc   IPC: H01L27/146 Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection.
7
US2020003987A1
LASER ALIGNMENT SYSTEMS
Publication/Patent Number: US2020003987A1 Publication Date: 2020-01-02 Application Number: 16/565,050 Filing Date: 2019-09-09 Inventor: Kovacs, Laszlo   Assignee: Sensors unlimited inc   IPC: G02B7/02 Abstract: A laser alignment arrangement includes a first stage configured to structurally support a laser at a first longitudinal position of the laser, the first stage being configured to adjust the first longitudinal position of the laser in at least one direction orthogonal to an axis of the laser, and a second stage configured to structurally support the laser at a second longitudinal position of the laser, the second stage being configured to adjust the second longitudinal position of the laser in at least one direction orthogonal to the axis of the laser.
8
US2020227370A1
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
Publication/Patent Number: US2020227370A1 Publication Date: 2020-07-16 Application Number: 16/838,322 Filing Date: 2020-04-02 Inventor: Zhang, Wei   Huang, Wei   Lund, Joshua   Paik, Namwoong   Assignee: Sensors unlimited inc   IPC: H01L23/00 Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket.
9
US2020116834A1
PIXELS FOR TIME OF FLIGHT (TOF) IMAGING
Publication/Patent Number: US2020116834A1 Publication Date: 2020-04-16 Application Number: 16/156,423 Filing Date: 2018-10-10 Inventor: Wieners, John Angelo   Assignee: Sensors unlimited inc   IPC: G01S7/486 Abstract: A pixel includes a constant current source electrically connected to a first node. An integrating capacitor is electrically connected between the first node and a ground. A sampling transistor is electrically connected between the first node and a second node. A photodiode is electrically connected between a base terminal of the sampling transistor and the ground for switching electrical connectivity through the sampling transistor in response to radiation incident on the photodiode.
10
EP3089236B1
BATTERY PACK
Publication/Patent Number: EP3089236B1 Publication Date: 2020-06-17 Application Number: 16167978.2 Filing Date: 2016-05-02 Inventor: Wieners, John A.   Assignee: Sensors unlimited inc   IPC: H01M2/10
11
US202003987A1
LASER ALIGNMENT SYSTEMS
Publication/Patent Number: US202003987A1 Publication Date: 2020-01-02 Application Number: 20/191,656 Filing Date: 2019-09-09 Inventor: Kovacs, Laszlo   Assignee: Sensors unlimited inc   IPC: G02B7/02 Abstract: A laser alignment arrangement includes a first stage configured to structurally support a laser at a first longitudinal position of the laser, the first stage being configured to adjust the first longitudinal position of the laser in at least one direction orthogonal to an axis of the laser, and a second stage configured to structurally support the laser at a second longitudinal position of the laser, the second stage being configured to adjust the second longitudinal position of the laser in at least one direction orthogonal to the axis of the laser.
12
US202052012A1
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
Publication/Patent Number: US202052012A1 Publication Date: 2020-02-13 Application Number: 20/181,605 Filing Date: 2018-08-07 Inventor: Zhang, Wei   Malchow, Douglas Stewart   Evans, Michael J.   Paik, Namwoong   Bereznycky, Paul L.   Assignee: Sensors unlimited inc   IPC: H01L27/146 Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection.
13
US2020081242A1
EYECUPS FOR OPTICS
Publication/Patent Number: US2020081242A1 Publication Date: 2020-03-12 Application Number: 16/125,481 Filing Date: 2018-09-07 Inventor: Kuczek, Andrzej Ernest   Hansell, Eric   Assignee: Sensors unlimited inc   IPC: G02B25/00 Abstract: An eyecup for an optic can include an elastic body forming an eye receiver and a viewing cavity, the elastic body configured to move between a relaxed state and a compressed state. The eyecup can include a diaphragm formed from or attached to an inner surface of the elastic body, the diaphragm including one or more flaps configured to be in a closed position when the elastic body is in the relaxed state such that the one or more flaps block sight of an optic through the viewing cavity, and to be in an open position when the elastic body is in the compressed state such that the one or more flaps allow sight of an optic through the viewing cavity. The eyecup can include one or more magnets disposed on at least one of the one or more flaps to move with the one or more flaps, and one or more sensors disposed in a fixed location and configured to sense a magnetic field or flux thereof of the one or more magnets to sense the one or more magnets when the flaps are in or near or moving toward the open position.
14
US2020119079A1
SENSORS FOR SIMULTANEOUS PASSIVE IMAGING AND RANGE FINDING
Publication/Patent Number: US2020119079A1 Publication Date: 2020-04-16 Application Number: 16/156,392 Filing Date: 2018-10-10 Inventor: Wieners, John Angelo   Assignee: Sensors unlimited inc   IPC: H01L27/146 Abstract: A sensor includes a sensor array. The sensor array includes a plurality of passive imaging pixels and a plurality of time of flight (TOF) imaging pixels. A method of imaging includes collecting passive imaging data from a sensor array and collecting time of flight (TOF) imaging data from the sensor array. Collecting passive imaging data and collecting TOF imaging data can be performed at least partially at the same time and along a single optical axis without parallax.
15
US10783111B2
Peripheral module validation for modular digital optical gunsight systems
Publication/Patent Number: US10783111B2 Publication Date: 2020-09-22 Application Number: 15/824,988 Filing Date: 2017-11-28 Inventor: Moseman, Samuel L.   Assignee: Sensors unlimited inc   IPC: G06F16/11 Abstract: A modular digital optical gunsight (MDOG) peripheral module validation device includes an MDOG data connector configured to connect to an MDOG peripheral module and to receive and/or transmit MDOG data in a first format to or from the MDOG peripheral module, a translation module configured to translate the MDOG data in the first format to a second format that is compatible with a personal computer (PC), and a PC data connector configured to connect the validation device to a PC and to receive and/or transmit the MDOG data in the second format to the PC. The translation module can be configured to translate data in the second format to the first format.
16
US10879204B2
Bump structures for high density flip chip interconnection
Publication/Patent Number: US10879204B2 Publication Date: 2020-12-29 Application Number: 16/838,322 Filing Date: 2020-04-02 Inventor: Zhang, Wei   Huang, Wei   Lund, Joshua   Paik, Namwoong   Assignee: Sensors unlimited inc   IPC: H01L23/00 Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket.
17
US10622324B2
Bump structures for high density flip chip interconnection
Publication/Patent Number: US10622324B2 Publication Date: 2020-04-14 Application Number: 15/891,889 Filing Date: 2018-02-08 Inventor: Zhang, Wei   Huang, Wei   Lund, Joshua   Paik, Namwoong   Assignee: Sensors unlimited inc   IPC: H01L23/00 Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket.
18
EP3608962A1
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
Publication/Patent Number: EP3608962A1 Publication Date: 2020-02-12 Application Number: 19189836.0 Filing Date: 2019-08-02 Inventor: Zhang, Wei   Evans, Michael J.   Malchow, Douglas Stewart   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors unlimited inc   IPC: H01L27/146 Abstract: A method of forming an array of photodiodes includes forming a cap layer (102) on a surface (104) of an absorption layer (106). The method includes forming a plurality of spaced apart pixel diffusion areas (116) in the cap layer (102). The method includes forming a mesa trench (124) with opposed sidewalls (126) through the cap layer (102), wherein the mesa trench (124) surrounds each of the pixel diffusion areas (116) separating the pixel diffusion areas (116) from one another. The method includes forming a sidewall passivation layer (128) over the sidewalls (126) of the mesa trench (124) and removing a portion of the sidewall passivation layer (128) to expose a respective contact (118) electrically connected to each of the pixel diffusion areas (116), but leaving the sidewalls (126) of the mesa trench covered with the sidewall passivation layer (128) wherein the contact (118) is open and uncovered for electrical connection.
19
EP3618037A1
SYSTEMS AND METHODS FOR IDENTIFYING AIR TRAFFIC OBJECTS
Publication/Patent Number: EP3618037A1 Publication Date: 2020-03-04 Application Number: 19191012.4 Filing Date: 2019-08-09 Inventor: Dvonch, Curt   Assignee: Sensors unlimited inc   IPC: G08G5/00 Abstract: An identification system for a digital air traffic control center includes a sensor (102) with a field of view (104) and having a pulse detection array (103), a user interface (112) to display air traffic objects (18) in the field of view (104) of the sensor (102), and a controller. The controller includes a pulse detection module disposed in communication with the pulse detection array (103) to identify an air traffic object (18) using pulsed illumination emitted by a pulsed illuminator (116) carried by the air traffic object (18) within the field of view (104) of the sensor (102). Digital air traffic control centers, airfields, and air traffic object identification methods are also described.
20
EP3713208A1
METALLIZED CAMERA WINDOWS
Publication/Patent Number: EP3713208A1 Publication Date: 2020-09-23 Application Number: 19216021.6 Filing Date: 2019-12-13 Inventor: Nguyen, Thuc-uyen   Assignee: Sensors unlimited inc   IPC: H04N5/225 Abstract: An optical assembly includes a window having an interior surface and an opposed exterior surface. A perimeter surface connects between the interior surface and the exterior surface. A metal layer is bonded to the perimeter surface of the window. An anti-reflective coating (ARC) is bonded to the interior surface of the window. A metallic lid is joined to the metal layer for enclosing a focal plane array (FPA) aligned with the window.