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1 | US2020301254A1 |
METALLIZED CAMERA WINDOWS
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Publication/Patent Number: US2020301254A1 | Publication Date: 2020-09-24 | Application Number: 16/356,735 | Filing Date: 2019-03-18 | Inventor： Nguyen, Thuc-uyen | Assignee: Sensors unlimited inc | IPC: G03B17/12 | Abstract: An optical assembly includes a window having an interior surface and an opposed exterior surface. A perimeter surface connects between the interior surface and the exterior surface. A metal layer is bonded to the perimeter surface of the window. An anti-reflective coating (ARC) is bonded to the interior surface of the window. A metallic lid is joined to the metal layer for enclosing a focal plane array (FPA) aligned with the window. | |||
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2 | US10645348B2 |
Data communication between image sensors and image displays
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Publication/Patent Number: US10645348B2 | Publication Date: 2020-05-05 | Application Number: 16/029,583 | Filing Date: 2018-07-07 | Inventor： Moseman, Samuel Canahuati, Mathew | Assignee: Sensors unlimited inc | IPC: H04N5/232 | Abstract: An imaging method includes determining heading of a digital weapon sight, determining heading of a helmet mounted display, and calculating difference between the heading of the digital weapon sight and the heading of the helmet mounted display. When the difference between the heading of the digital weapon sight and the heading of the helmet mounted display is outside of a predetermined range image data communication between the digital weapon sight and the helmet mounted display is disabled. Imaging systems and weapons assemblies having imaging systems are also described. | |||
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3 | US2020051224A1 |
SCALED TWO-BAND HISTOGRAM PROCESS FOR IMAGE ENHANCEMENT
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Publication/Patent Number: US2020051224A1 | Publication Date: 2020-02-13 | Application Number: 16/057,280 | Filing Date: 2018-08-07 | Inventor： Nguyen, Thuc-uyen | Assignee: Sensors unlimited inc | IPC: G06T5/40 | Abstract: A method of image enhancement includes constructing an input histogram corresponding to an input image received at a focal plane array. The method includes performing histogram equalization on a first band of the input histogram starting from a zero value and ending at a division value representing a pixel bin value where a predetermined fraction of the input histogram by pixel hound is reached to produce a first portion of an equalization curve. The method includes performing histogram equalization on a second band of the input histogram starting from the division value and ending at a pixel bin value where all of the input histogram by pixel count is reached to produce a second portion of the equalization curve. The method includes applying the equalization curve to the input image to produce a corresponding enhanced image. | |||
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4 | US10753709B2 |
Tactical rails, tactical rail systems, and firearm assemblies having tactical rails
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Publication/Patent Number: US10753709B2 | Publication Date: 2020-08-25 | Application Number: 15/983,048 | Filing Date: 2018-05-17 | Inventor： Neal, Henry William | Assignee: Sensors unlimited inc | IPC: F41G11/00 | Abstract: A tactical rail for a firearm includes a rail body having a receiver end and a muzzle end, a non-contact optical connection, and a high speed data spoke. The non-contact optical connection is arranged at an end of the rail body and is configured to interface with a corresponding non-contact optical interface. The high speed data spoke is connected to the non-contact optical connection for high speed data communication through the non-contact optical connection and the corresponding non-contact optical interface. Tactical rail arrangements and firearm with tactical rails and tactical rail arrangements are also described. | |||
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5 | US10529753B2 |
Pixels
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Publication/Patent Number: US10529753B2 | Publication Date: 2020-01-07 | Application Number: 14/931,569 | Filing Date: 2015-11-03 | Inventor： Mushini, Prabhu Huang, Wei | Assignee: Sensors unlimited inc | IPC: H01L27/146 | Abstract: A photodiode has an absorption layer and a cap layer operatively connected to the absorption layer. A pixel is formed in the cap layer and extends into the absorption layer to receive charge generated from photons therefrom. The pixel defines an annular diffused area to reduce dark current and capacitance. A photodetector includes the photodiode. The photodiode includes an array of pixels formed in the cap layer. At least one of the pixels extends into the absorption layer to receive charge generated from photons therefrom. At least one of the pixels defines an annular diffused area to reduce dark current and capacitance. | |||
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6 | US2020052012A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: US2020052012A1 | Publication Date: 2020-02-13 | Application Number: 16/057,191 | Filing Date: 2018-08-07 | Inventor： Zhang, Wei Evans, Michael J. Malchow, Douglas Stewart Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors unlimited inc | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection. | |||
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7 | US2020003987A1 |
LASER ALIGNMENT SYSTEMS
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Publication/Patent Number: US2020003987A1 | Publication Date: 2020-01-02 | Application Number: 16/565,050 | Filing Date: 2019-09-09 | Inventor： Kovacs, Laszlo | Assignee: Sensors unlimited inc | IPC: G02B7/02 | Abstract: A laser alignment arrangement includes a first stage configured to structurally support a laser at a first longitudinal position of the laser, the first stage being configured to adjust the first longitudinal position of the laser in at least one direction orthogonal to an axis of the laser, and a second stage configured to structurally support the laser at a second longitudinal position of the laser, the second stage being configured to adjust the second longitudinal position of the laser in at least one direction orthogonal to the axis of the laser. | |||
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8 | US2020227370A1 |
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
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Publication/Patent Number: US2020227370A1 | Publication Date: 2020-07-16 | Application Number: 16/838,322 | Filing Date: 2020-04-02 | Inventor： Zhang, Wei Huang, Wei Lund, Joshua Paik, Namwoong | Assignee: Sensors unlimited inc | IPC: H01L23/00 | Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket. | |||
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9 | US2020116834A1 |
PIXELS FOR TIME OF FLIGHT (TOF) IMAGING
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Publication/Patent Number: US2020116834A1 | Publication Date: 2020-04-16 | Application Number: 16/156,423 | Filing Date: 2018-10-10 | Inventor： Wieners, John Angelo | Assignee: Sensors unlimited inc | IPC: G01S7/486 | Abstract: A pixel includes a constant current source electrically connected to a first node. An integrating capacitor is electrically connected between the first node and a ground. A sampling transistor is electrically connected between the first node and a second node. A photodiode is electrically connected between a base terminal of the sampling transistor and the ground for switching electrical connectivity through the sampling transistor in response to radiation incident on the photodiode. | |||
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10 | EP3089236B1 |
BATTERY PACK
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Publication/Patent Number: EP3089236B1 | Publication Date: 2020-06-17 | Application Number: 16167978.2 | Filing Date: 2016-05-02 | Inventor： Wieners, John A. | Assignee: Sensors unlimited inc | IPC: H01M2/10 | ||||
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11 | US202003987A1 |
LASER ALIGNMENT SYSTEMS
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Publication/Patent Number: US202003987A1 | Publication Date: 2020-01-02 | Application Number: 20/191,656 | Filing Date: 2019-09-09 | Inventor： Kovacs, Laszlo | Assignee: Sensors unlimited inc | IPC: G02B7/02 | Abstract: A laser alignment arrangement includes a first stage configured to structurally support a laser at a first longitudinal position of the laser, the first stage being configured to adjust the first longitudinal position of the laser in at least one direction orthogonal to an axis of the laser, and a second stage configured to structurally support the laser at a second longitudinal position of the laser, the second stage being configured to adjust the second longitudinal position of the laser in at least one direction orthogonal to the axis of the laser. | |||
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12 | US202052012A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: US202052012A1 | Publication Date: 2020-02-13 | Application Number: 20/181,605 | Filing Date: 2018-08-07 | Inventor： Zhang, Wei Malchow, Douglas Stewart Evans, Michael J. Paik, Namwoong Bereznycky, Paul L. | Assignee: Sensors unlimited inc | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection. | |||
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13 | US2020081242A1 |
EYECUPS FOR OPTICS
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Publication/Patent Number: US2020081242A1 | Publication Date: 2020-03-12 | Application Number: 16/125,481 | Filing Date: 2018-09-07 | Inventor： Kuczek, Andrzej Ernest Hansell, Eric | Assignee: Sensors unlimited inc | IPC: G02B25/00 | Abstract: An eyecup for an optic can include an elastic body forming an eye receiver and a viewing cavity, the elastic body configured to move between a relaxed state and a compressed state. The eyecup can include a diaphragm formed from or attached to an inner surface of the elastic body, the diaphragm including one or more flaps configured to be in a closed position when the elastic body is in the relaxed state such that the one or more flaps block sight of an optic through the viewing cavity, and to be in an open position when the elastic body is in the compressed state such that the one or more flaps allow sight of an optic through the viewing cavity. The eyecup can include one or more magnets disposed on at least one of the one or more flaps to move with the one or more flaps, and one or more sensors disposed in a fixed location and configured to sense a magnetic field or flux thereof of the one or more magnets to sense the one or more magnets when the flaps are in or near or moving toward the open position. | |||
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14 | US2020119079A1 |
SENSORS FOR SIMULTANEOUS PASSIVE IMAGING AND RANGE FINDING
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Publication/Patent Number: US2020119079A1 | Publication Date: 2020-04-16 | Application Number: 16/156,392 | Filing Date: 2018-10-10 | Inventor： Wieners, John Angelo | Assignee: Sensors unlimited inc | IPC: H01L27/146 | Abstract: A sensor includes a sensor array. The sensor array includes a plurality of passive imaging pixels and a plurality of time of flight (TOF) imaging pixels. A method of imaging includes collecting passive imaging data from a sensor array and collecting time of flight (TOF) imaging data from the sensor array. Collecting passive imaging data and collecting TOF imaging data can be performed at least partially at the same time and along a single optical axis without parallax. | |||
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15 | US10783111B2 |
Peripheral module validation for modular digital optical gunsight systems
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Publication/Patent Number: US10783111B2 | Publication Date: 2020-09-22 | Application Number: 15/824,988 | Filing Date: 2017-11-28 | Inventor： Moseman, Samuel L. | Assignee: Sensors unlimited inc | IPC: G06F16/11 | Abstract: A modular digital optical gunsight (MDOG) peripheral module validation device includes an MDOG data connector configured to connect to an MDOG peripheral module and to receive and/or transmit MDOG data in a first format to or from the MDOG peripheral module, a translation module configured to translate the MDOG data in the first format to a second format that is compatible with a personal computer (PC), and a PC data connector configured to connect the validation device to a PC and to receive and/or transmit the MDOG data in the second format to the PC. The translation module can be configured to translate data in the second format to the first format. | |||
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16 | US10879204B2 |
Bump structures for high density flip chip interconnection
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Publication/Patent Number: US10879204B2 | Publication Date: 2020-12-29 | Application Number: 16/838,322 | Filing Date: 2020-04-02 | Inventor： Zhang, Wei Huang, Wei Lund, Joshua Paik, Namwoong | Assignee: Sensors unlimited inc | IPC: H01L23/00 | Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket. | |||
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17 | US10622324B2 |
Bump structures for high density flip chip interconnection
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Publication/Patent Number: US10622324B2 | Publication Date: 2020-04-14 | Application Number: 15/891,889 | Filing Date: 2018-02-08 | Inventor： Zhang, Wei Huang, Wei Lund, Joshua Paik, Namwoong | Assignee: Sensors unlimited inc | IPC: H01L23/00 | Abstract: A method of forming bump structures for interconnecting components includes applying an insulating layer over a device substrate, coating the insulating layer with a dielectric material layer, forming a pattern with photolithography on the dielectric material layer, etching the dielectric material layer to transfer the pattern to the insulating layer, etching the insulating layer to form pockets in the insulating layer following the pattern, applying photolithography to and etching the dielectric material layer to reduce overhang of the dielectric material layer relative to the insulating layer, removing material from top and side walls of the pockets in the insulating layer, and depositing electrically conductive bump material in the pattern so a respective bump is formed in each pocket. | |||
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18 | EP3608962A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: EP3608962A1 | Publication Date: 2020-02-12 | Application Number: 19189836.0 | Filing Date: 2019-08-02 | Inventor： Zhang, Wei Evans, Michael J. Malchow, Douglas Stewart Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors unlimited inc | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer (102) on a surface (104) of an absorption layer (106). The method includes forming a plurality of spaced apart pixel diffusion areas (116) in the cap layer (102). The method includes forming a mesa trench (124) with opposed sidewalls (126) through the cap layer (102), wherein the mesa trench (124) surrounds each of the pixel diffusion areas (116) separating the pixel diffusion areas (116) from one another. The method includes forming a sidewall passivation layer (128) over the sidewalls (126) of the mesa trench (124) and removing a portion of the sidewall passivation layer (128) to expose a respective contact (118) electrically connected to each of the pixel diffusion areas (116), but leaving the sidewalls (126) of the mesa trench covered with the sidewall passivation layer (128) wherein the contact (118) is open and uncovered for electrical connection. | |||
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19 | EP3618037A1 |
SYSTEMS AND METHODS FOR IDENTIFYING AIR TRAFFIC OBJECTS
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Publication/Patent Number: EP3618037A1 | Publication Date: 2020-03-04 | Application Number: 19191012.4 | Filing Date: 2019-08-09 | Inventor： Dvonch, Curt | Assignee: Sensors unlimited inc | IPC: G08G5/00 | Abstract: An identification system for a digital air traffic control center includes a sensor (102) with a field of view (104) and having a pulse detection array (103), a user interface (112) to display air traffic objects (18) in the field of view (104) of the sensor (102), and a controller. The controller includes a pulse detection module disposed in communication with the pulse detection array (103) to identify an air traffic object (18) using pulsed illumination emitted by a pulsed illuminator (116) carried by the air traffic object (18) within the field of view (104) of the sensor (102). Digital air traffic control centers, airfields, and air traffic object identification methods are also described. | |||
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20 | EP3713208A1 |
METALLIZED CAMERA WINDOWS
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Publication/Patent Number: EP3713208A1 | Publication Date: 2020-09-23 | Application Number: 19216021.6 | Filing Date: 2019-12-13 | Inventor： Nguyen, Thuc-uyen | Assignee: Sensors unlimited inc | IPC: H04N5/225 | Abstract: An optical assembly includes a window having an interior surface and an opposed exterior surface. A perimeter surface connects between the interior surface and the exterior surface. A metal layer is bonded to the perimeter surface of the window. An anti-reflective coating (ARC) is bonded to the interior surface of the window. A metallic lid is joined to the metal layer for enclosing a focal plane array (FPA) aligned with the window. |
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