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1
US10889694B2
Method and composition for preparing polyamide powders
Publication/Patent Number: US10889694B2 Publication Date: 2021-01-12 Application Number: 16/458,770 Filing Date: 2019-07-01 Inventor: Yang, Chia-hung   Huang, Yu-pao   Yeh, Hsing-fu   Ke, Yao-tang   Chen, Feng-lin   Chen, Yung-chih   Su, Yi-chung   Assignee: Taiwan green point enterprises co ltd   IPC: C08J3/14 Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.
2
US202010626A1
Method and Composition for Preparing Polyamide Powders
Publication/Patent Number: US202010626A1 Publication Date: 2020-01-09 Application Number: 20/191,645 Filing Date: 2019-07-01 Inventor: Chen, Yung-chih   Su, Yi-chung   Chen, Feng-lin   Yang, Chia-hung   Huang, Yu-pao   Yeh, Hsing-fu   Ke, Yao-tang   Assignee: Taiwan green point enterprises co ltd   IPC: C08K3/36 Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.
3
US10710287B2
Injection molding method and mold mechanism
Publication/Patent Number: US10710287B2 Publication Date: 2020-07-14 Application Number: 15/880,950 Filing Date: 2018-01-26 Inventor: Tsai, Ray-long   Liao, Chi-hung   Li, Yan-hua   Hsu, Chien-jung   Hu, Chun-hao   Yen, Chia-yu   Assignee: Taiwan green point enterprises co ltd   IPC: B29C45/14 Abstract: An injection molding method includes the steps of positioning a core piece in a mold cavity through a plurality of positioning pins; injecting a molten plastic material into the mold cavity to surround and cover the core piece; maintaining the pressure inside the mold cavity at a predetermined maintaining time so that the core piece is positioned by the molten plastic material; retracting the positioning pins from the mold cavity when a predetermined retraction time is reached, so that spaces occupied by the positioning pins in the mold cavity can be filled with the molten plastic material; and completely curing the molten plastic material to form a finished product.
4
US10781982B2
Method for making an LED lighting fixture
Publication/Patent Number: US10781982B2 Publication Date: 2020-09-22 Application Number: 15/964,989 Filing Date: 2018-04-27 Inventor: Yi, Sheng-hung   Tseng, I-lin   Huang, Po-cheng   Yang, Hui-ju   Assignee: Taiwan green point enterprises co ltd   IPC: H05K3/30 Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.
5
US2020197933A1
METHOD OF MANUFACTURING MICROFLUIDIC CHIP AND A MICROFLUIDIC CHIP MADE THEREBY
Publication/Patent Number: US2020197933A1 Publication Date: 2020-06-25 Application Number: 16/802,762 Filing Date: 2020-02-27 Inventor: Lin, Yi-cheng   Yang, Sung-yi   Assignee: Taiwan green point enterprises co ltd   IPC: B01L3/00 Abstract: A method of manufacturing a microfluidic chip includes: providing an upper mold having multiple upper ribs extending along a second direction, and a lower mold having multiple lower ribs extending along a first direction different from the second direction; forming a forming material in a filling space defined by the upper and lower molds to provide a channeled plate having multiple upper microfluidic channels complementary in shape to the upper ribs, lower microfluidic channels complementary in shape to the lower ribs, and multiple thin film valves formed at intersections where the upper microfluidic channels intersect the lower microfluidic channels; separating the upper and lower molds; and covering the lower and upper microfluidic channels.
6
US10573975B2
Method of making a conformal array antenna
Publication/Patent Number: US10573975B2 Publication Date: 2020-02-25 Application Number: 15/866,907 Filing Date: 2018-01-10 Inventor: Yi, Sheng-hung   Liao, Pen-yi   Wu, Tsung-han   Huang, Po-cheng   Assignee: Taiwan green point enterprises co ltd   IPC: H01Q21/20 Abstract: A method for making a conformal array antenna includes: providing a substrate having a non-conductive curved surface; roughening the curved surface; forming an activation layer containing an active metal on the roughened curved surface; forming a first metal layer on the activation layer by chemical plating process; and defining a plurality of spaced-apart antenna pattern regions on the first metal layer, by forming a gap along an outer periphery of each of the antenna pattern regions to isolate the antenna pattern regions from a remainder of the first metal layer. The curved surface is roughened by blasting a plurality of particles thereonto, or the spaced-apart antenna pattern regions are substantially evenly distributed.
7
US10648940B2
Electrochemical biosensor and method for producing the same
Publication/Patent Number: US10648940B2 Publication Date: 2020-05-12 Application Number: 15/588,215 Filing Date: 2017-05-05 Inventor: Lin, Yu-chuan   Yang, Sung-yi   Lin, Yi-cheng   Assignee: Taiwan green point enterprises co ltd   IPC: G01N27/327 Abstract: An electrochemical biosensor includes a substrate, a plurality of layered active metal parts, a plurality of layered electrodes, a reaction confinement layer, an electrochemical reactive layer and a cover piece. The substrate is formed with through holes each of which is defined by an interior wall surface and penetrates top and bottom surfaces. Each of the layered active metal parts is formed at least upon a respective one of the interior wall surfaces. The layered electrodes are formed on the layered active metal parts. The reaction confinement layer confines a reactor space over a region where the through holes are formed. The electrochemical reactive layer is disposed in the reactor space and is electrically coupled to the layered electrodes.
8
US2020010626A1
Method and Composition for Preparing Polyamide Powders
Publication/Patent Number: US2020010626A1 Publication Date: 2020-01-09 Application Number: 16/458,770 Filing Date: 2019-07-01 Inventor: Yang, Chia-hung   Huang, Yu-pao   Yeh, Hsing-fu   Ke, Yao-tang   Chen, Feng-lin   Chen, Yung-chih   Su, Yi-chung   Assignee: Taiwan green point enterprises co ltd   IPC: C08J3/14 Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.
9
US2020153118A1
CONFORMAL ARRAY ANTENNA
Publication/Patent Number: US2020153118A1 Publication Date: 2020-05-14 Application Number: 16/742,327 Filing Date: 2020-01-14 Inventor: Yi, Sheng-hung   Liao, Pen-yi   Wu, Tsung-han   Huang, Po-cheng   Assignee: Taiwan green point enterprises co ltd   IPC: H01Q21/20 Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.
10
US10646867B2
Method of manufacturing microfluidic chip and a microfluidic chip made thereby
Publication/Patent Number: US10646867B2 Publication Date: 2020-05-12 Application Number: 15/670,645 Filing Date: 2017-08-07 Inventor: Lin, Yi-cheng   Yang, Sung-yi   Assignee: Taiwan green point enterprises co ltd   IPC: B01L3/00 Abstract: A method of manufacturing a microfluidic chip includes providing an upper mold having multiple upper ribs extending along a second direction, and a lower mold having multiple lower ribs extending along a first direction different from the second direction, forming a forming material in a filling space defined by the upper and lower molds to provide a channeled plate having multiple upper microfluidic channels complementary in shape to the upper ribs, lower microfluidic channels complementary in shape to the lower ribs, and multiple thin film valves formed at intersections where the upper microfluidic channels intersect the lower microfluidic channels, separating the upper and lower molds, and covering the lower and upper microfluidic channels.
11
TW201907769A
Method for manufacturing substrate with conductive pattern and substrate with conductive pattern
Publication/Patent Number: TW201907769A Publication Date: 2019-02-16 Application Number: 106122708 Filing Date: 2017-07-06 Inventor: Liao, Pen-yi   Wu, Tsung-han   Hsieh, Chia-ling   Lai, Kuei-hung   Tang, Fu-pin   Assignee: Taiwan green point enterprises co ltd   IPC: H05K3/38 Abstract: A method for manufacturing a substrate with conductive pattern comprises the steps as follows: preparing a coating material which includes a base material and a plurality of high temperature resistant particles; forming a coating by coating the coating material on a surface of a base plate made of a non-thermal plastic material; defining a predetermined pattern region in the coating, and heating the predetermined pattern region to cause a part of the base material of the coating to be vaporized and a part of the high temperature resistant particles to be exposed so as to form a rough surface in the predetermined pattern region; forming an active layer containing an active metal on the rough surface; and forming a metal layer on the active layer by an electroless process.
12
TWM577628U
Case of electronic device
Publication/Patent Number: TWM577628U Publication Date: 2019-05-01 Application Number: 107217353 Filing Date: 2018-12-20 Inventor: Yi, Sheng-hung   Chen, Tzu-chun   Ji, Yu-ting   Assignee: Taiwan green point enterprises co ltd   IPC: H05K5/00
13
TW201927513A
Feeding device and injection molding equipment having the same, and method of feeding liquid material to an injection molding machine
Publication/Patent Number: TW201927513A Publication Date: 2019-07-16 Application Number: 106145494 Filing Date: 2017-12-25 Inventor: Lin, Che-yu   Tseng, Chien-chia   Liao, Ying-lun   Sung, Cheng-yu   Lin, Ke-yu   Assignee: Taiwan green point enterprises co ltd   IPC: B29C45/18 Abstract: A feeding device includes a material storage mechanism, and a driving mechanism. The material storage mechanism includes a carrying assembly, a storage container is detachably assembled positioning in the carrying assembly, and a piston. The storage container is disposable and formed with a storage space, and a through hole communicating with the storage space. The storage space is used for containing a liquid material. The piston is movably disposed in the storage space. The driving mechanism is used for pushing the piston to move toward the through hole so that the piston extrudes the liquid material through the through hole. Thus, cleaning time and cost can be saved, and can provide the mixed uniform liquid material to an injection molding machine.
14
TW201940034A
Electronic module and manufacturing method thereof and housing of electronic device and manufacturing method thereof
Publication/Patent Number: TW201940034A Publication Date: 2019-10-01 Application Number: 107107852 Filing Date: 2018-03-08 Inventor: Guo, Wen-i   Yang, Yao-long   Liu, Yen-pin   Chen, Hsiao-tzu   Chien, Huai-liang   Ho, Chi-neng   Assignee: Taiwan green point enterprises co ltd   IPC: H05K5/02 Abstract: A method of manufacturing an electronic module includes the following steps: Providing a substrate, a conductive circuits is formed on a surface of the substrate, the conductive circuits has at least one contact. Fixedly connected a first end of a conductive elastic member to the contact. And forming an insulating package covering at least a portion of the conductive elastic member and exposing a second end of the conductive elastic member. Thus, the conductive elastic member can be used as a conductive contact for the electrical connection of an electronic component. The foregoing manufacturing method simplifies the manufacturing process, greatly shortens the total processing time and reduces the manufacturing cost. In addition, the reliability of the fixed connection between the conductive elastic member, the contact of the substrate and the pins of the electronic component can be improved so as not to affect the electrical signal transmission between the electronic component and the substrate.
15
TWI660654B
Method for manufacturing a lamp and products thereof,method for manufacturing a three-dimensional circuit board and products thereof
Publication/Patent Number: TWI660654B Publication Date: 2019-05-21 Application Number: 106134857 Filing Date: 2017-10-12 Inventor: Chen, Chih-hao   Liao, Pen-yi   Yi, Sheng-hung   Yang, Jing-yi   Tsai, Wen-chia   Assignee: Taiwan green point enterprises co ltd   IPC: H05K3/00 Abstract: A method for manufacturing a lamp comprises the steps as follows: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; forming an active layer patterned on the insulating layer and containing an active material; bending the metal plate to form at least one bent portion passing through the patterned active layer; forming a first metal layer on the patterned active layer to form a conductive line; providing a plurality of luminous elements on the conductive line, the luminous elements being distributed in different regions separated by the at least one bent portion and electrically connected to the conductive line.
16
TWI676544B
Feeding device and injection molding equipment having the same, and method of feeding liquid material to an injection molding machine
Publication/Patent Number: TWI676544B Publication Date: 2019-11-11 Application Number: 106145494 Filing Date: 2017-12-25 Inventor: Lin, Che-yu   Tseng, Chien-chia   Liao, Ying-lun   Sung, Cheng-yu   Lin, Ke-yu   Assignee: Taiwan green point enterprises co ltd   IPC: B29C45/18 Abstract: A feeding device includes a material storage mechanism, and a driving mechanism. The material storage mechanism includes a carrying assembly, a storage container is detachably assembled positioning in the carrying assembly, and a piston. The storage container is disposable and formed with a storage space, and a through hole communicating with the storage space. The storage space is used for containing a liquid material. The piston is movably disposed in the storage space. The driving mechanism is used for pushing the piston to move toward the through hole so that the piston extrudes the liquid material through the through hole. Thus, cleaning time and cost can be saved, and can provide the mixed uniform liquid material to an injection molding machine.
17
US2019126273A1
SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES
Publication/Patent Number: US2019126273A1 Publication Date: 2019-05-02 Application Number: 16/176,348 Filing Date: 2018-10-31 Inventor: Yang, Sung-yi   Wang, Pao-chuan   Assignee: Taiwan green point enterprises co ltd   IPC: B01L3/00 Abstract: A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.
18
TW201900476A
Handlebar and image capturing device and event data recorder thereof
Publication/Patent Number: TW201900476A Publication Date: 2019-01-01 Application Number: 106116822 Filing Date: 2017-05-22 Inventor: Chen, Yi-te   Lin, Jun-yi   Lo, I-wei   Assignee: Taiwan green point enterprises co ltd   IPC: B62K21/26 Abstract: A handlebar includes a handlebar body and an image capturing device. The handlebar body includes two handles located on left and right sides respectively and extending rearward. Each handle has a free end. The image capturing device disposed on the free end of one of the handles, to capturing the image behind the handle. Thus, the rights of the rider in the event of an accident can be guaranteed, and the safety of the rider in the process of riding a bicycle can be enhanced.
19
US201945638A1
DOUBLE-SIDED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME
Publication/Patent Number: US201945638A1 Publication Date: 2019-02-07 Application Number: 20/181,615 Filing Date: 2018-10-09 Inventor: Tseng, I Lin   Chen, Tzu Chun   Assignee: Taiwan green point enterprises co ltd   IPC: H05K3/38 Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.
20
TW201909531A
Power converter and power conversion method
Publication/Patent Number: TW201909531A Publication Date: 2019-03-01 Application Number: 106123280 Filing Date: 2017-07-12 Inventor: Chen, Chia-tai   Assignee: Taiwan green point enterprises co ltd   IPC: H02M1/44 Abstract: A power converter comprises a primary circuit, two first Y capacitors, and a secondary circuit. The primary circuit receives an AC input voltage and generates a first primary power and a second primary power. The two first Y capacitors couple to the primary circuit to receive the first primary power and the second primary power. The two first Y capacitors respectively generate a first coupling voltage and a second coupling voltage based on the electric coupling of the first primary power and the second primary power. The secondary side circuit electrically connecting the two first Y capacitors to receive the first coupling voltage and the second coupling voltage. The two first Y capacitors are used to maintain the insulation between the primary circuit and the secondary circuit.
Total 22 pages