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1 | US10889694B2 |
Method and composition for preparing polyamide powders
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Publication/Patent Number: US10889694B2 | Publication Date: 2021-01-12 | Application Number: 16/458,770 | Filing Date: 2019-07-01 | Inventor: Yang, Chia-hung Huang, Yu-pao Yeh, Hsing-fu Ke, Yao-tang Chen, Feng-lin Chen, Yung-chih Su, Yi-chung | Assignee: Taiwan green point enterprises co ltd | IPC: C08J3/14 | Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent. | |||
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2 | US202010626A1 |
Method and Composition for Preparing Polyamide Powders
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Publication/Patent Number: US202010626A1 | Publication Date: 2020-01-09 | Application Number: 20/191,645 | Filing Date: 2019-07-01 | Inventor: Chen, Yung-chih Su, Yi-chung Chen, Feng-lin Yang, Chia-hung Huang, Yu-pao Yeh, Hsing-fu Ke, Yao-tang | Assignee: Taiwan green point enterprises co ltd | IPC: C08K3/36 | Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent. | |||
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3 | US10710287B2 |
Injection molding method and mold mechanism
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Publication/Patent Number: US10710287B2 | Publication Date: 2020-07-14 | Application Number: 15/880,950 | Filing Date: 2018-01-26 | Inventor: Tsai, Ray-long Liao, Chi-hung Li, Yan-hua Hsu, Chien-jung Hu, Chun-hao Yen, Chia-yu | Assignee: Taiwan green point enterprises co ltd | IPC: B29C45/14 | Abstract: An injection molding method includes the steps of positioning a core piece in a mold cavity through a plurality of positioning pins; injecting a molten plastic material into the mold cavity to surround and cover the core piece; maintaining the pressure inside the mold cavity at a predetermined maintaining time so that the core piece is positioned by the molten plastic material; retracting the positioning pins from the mold cavity when a predetermined retraction time is reached, so that spaces occupied by the positioning pins in the mold cavity can be filled with the molten plastic material; and completely curing the molten plastic material to form a finished product. | |||
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4 | US10781982B2 |
Method for making an LED lighting fixture
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Publication/Patent Number: US10781982B2 | Publication Date: 2020-09-22 | Application Number: 15/964,989 | Filing Date: 2018-04-27 | Inventor: Yi, Sheng-hung Tseng, I-lin Huang, Po-cheng Yang, Hui-ju | Assignee: Taiwan green point enterprises co ltd | IPC: H05K3/30 | Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell. | |||
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5 | US2020197933A1 |
METHOD OF MANUFACTURING MICROFLUIDIC CHIP AND A MICROFLUIDIC CHIP MADE THEREBY
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Publication/Patent Number: US2020197933A1 | Publication Date: 2020-06-25 | Application Number: 16/802,762 | Filing Date: 2020-02-27 | Inventor: Lin, Yi-cheng Yang, Sung-yi | Assignee: Taiwan green point enterprises co ltd | IPC: B01L3/00 | Abstract: A method of manufacturing a microfluidic chip includes: providing an upper mold having multiple upper ribs extending along a second direction, and a lower mold having multiple lower ribs extending along a first direction different from the second direction; forming a forming material in a filling space defined by the upper and lower molds to provide a channeled plate having multiple upper microfluidic channels complementary in shape to the upper ribs, lower microfluidic channels complementary in shape to the lower ribs, and multiple thin film valves formed at intersections where the upper microfluidic channels intersect the lower microfluidic channels; separating the upper and lower molds; and covering the lower and upper microfluidic channels. | |||
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6 | US10573975B2 |
Method of making a conformal array antenna
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Publication/Patent Number: US10573975B2 | Publication Date: 2020-02-25 | Application Number: 15/866,907 | Filing Date: 2018-01-10 | Inventor: Yi, Sheng-hung Liao, Pen-yi Wu, Tsung-han Huang, Po-cheng | Assignee: Taiwan green point enterprises co ltd | IPC: H01Q21/20 | Abstract: A method for making a conformal array antenna includes: providing a substrate having a non-conductive curved surface; roughening the curved surface; forming an activation layer containing an active metal on the roughened curved surface; forming a first metal layer on the activation layer by chemical plating process; and defining a plurality of spaced-apart antenna pattern regions on the first metal layer, by forming a gap along an outer periphery of each of the antenna pattern regions to isolate the antenna pattern regions from a remainder of the first metal layer. The curved surface is roughened by blasting a plurality of particles thereonto, or the spaced-apart antenna pattern regions are substantially evenly distributed. | |||
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7 | US10648940B2 |
Electrochemical biosensor and method for producing the same
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Publication/Patent Number: US10648940B2 | Publication Date: 2020-05-12 | Application Number: 15/588,215 | Filing Date: 2017-05-05 | Inventor: Lin, Yu-chuan Yang, Sung-yi Lin, Yi-cheng | Assignee: Taiwan green point enterprises co ltd | IPC: G01N27/327 | Abstract: An electrochemical biosensor includes a substrate, a plurality of layered active metal parts, a plurality of layered electrodes, a reaction confinement layer, an electrochemical reactive layer and a cover piece. The substrate is formed with through holes each of which is defined by an interior wall surface and penetrates top and bottom surfaces. Each of the layered active metal parts is formed at least upon a respective one of the interior wall surfaces. The layered electrodes are formed on the layered active metal parts. The reaction confinement layer confines a reactor space over a region where the through holes are formed. The electrochemical reactive layer is disposed in the reactor space and is electrically coupled to the layered electrodes. | |||
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8 | US2020010626A1 |
Method and Composition for Preparing Polyamide Powders
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Publication/Patent Number: US2020010626A1 | Publication Date: 2020-01-09 | Application Number: 16/458,770 | Filing Date: 2019-07-01 | Inventor: Yang, Chia-hung Huang, Yu-pao Yeh, Hsing-fu Ke, Yao-tang Chen, Feng-lin Chen, Yung-chih Su, Yi-chung | Assignee: Taiwan green point enterprises co ltd | IPC: C08J3/14 | Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent. | |||
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9 | US2020153118A1 |
CONFORMAL ARRAY ANTENNA
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Publication/Patent Number: US2020153118A1 | Publication Date: 2020-05-14 | Application Number: 16/742,327 | Filing Date: 2020-01-14 | Inventor: Yi, Sheng-hung Liao, Pen-yi Wu, Tsung-han Huang, Po-cheng | Assignee: Taiwan green point enterprises co ltd | IPC: H01Q21/20 | Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer. | |||
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10 | US10646867B2 |
Method of manufacturing microfluidic chip and a microfluidic chip made thereby
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Publication/Patent Number: US10646867B2 | Publication Date: 2020-05-12 | Application Number: 15/670,645 | Filing Date: 2017-08-07 | Inventor: Lin, Yi-cheng Yang, Sung-yi | Assignee: Taiwan green point enterprises co ltd | IPC: B01L3/00 | Abstract: A method of manufacturing a microfluidic chip includes providing an upper mold having multiple upper ribs extending along a second direction, and a lower mold having multiple lower ribs extending along a first direction different from the second direction, forming a forming material in a filling space defined by the upper and lower molds to provide a channeled plate having multiple upper microfluidic channels complementary in shape to the upper ribs, lower microfluidic channels complementary in shape to the lower ribs, and multiple thin film valves formed at intersections where the upper microfluidic channels intersect the lower microfluidic channels, separating the upper and lower molds, and covering the lower and upper microfluidic channels. | |||
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11 | TW201907769A |
Method for manufacturing substrate with conductive pattern and substrate with conductive pattern
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Publication/Patent Number: TW201907769A | Publication Date: 2019-02-16 | Application Number: 106122708 | Filing Date: 2017-07-06 | Inventor: Liao, Pen-yi Wu, Tsung-han Hsieh, Chia-ling Lai, Kuei-hung Tang, Fu-pin | Assignee: Taiwan green point enterprises co ltd | IPC: H05K3/38 | Abstract: A method for manufacturing a substrate with conductive pattern comprises the steps as follows: preparing a coating material which includes a base material and a plurality of high temperature resistant particles; forming a coating by coating the coating material on a surface of a base plate made of a non-thermal plastic material; defining a predetermined pattern region in the coating, and heating the predetermined pattern region to cause a part of the base material of the coating to be vaporized and a part of the high temperature resistant particles to be exposed so as to form a rough surface in the predetermined pattern region; forming an active layer containing an active metal on the rough surface; and forming a metal layer on the active layer by an electroless process. | |||
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12 | TWM577628U |
Case of electronic device
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Publication/Patent Number: TWM577628U | Publication Date: 2019-05-01 | Application Number: 107217353 | Filing Date: 2018-12-20 | Inventor: Yi, Sheng-hung Chen, Tzu-chun Ji, Yu-ting | Assignee: Taiwan green point enterprises co ltd | IPC: H05K5/00 | ||||
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13 | TW201927513A |
Feeding device and injection molding equipment having the same, and method of feeding liquid material to an injection molding machine
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Publication/Patent Number: TW201927513A | Publication Date: 2019-07-16 | Application Number: 106145494 | Filing Date: 2017-12-25 | Inventor: Lin, Che-yu Tseng, Chien-chia Liao, Ying-lun Sung, Cheng-yu Lin, Ke-yu | Assignee: Taiwan green point enterprises co ltd | IPC: B29C45/18 | Abstract: A feeding device includes a material storage mechanism, and a driving mechanism. The material storage mechanism includes a carrying assembly, a storage container is detachably assembled positioning in the carrying assembly, and a piston. The storage container is disposable and formed with a storage space, and a through hole communicating with the storage space. The storage space is used for containing a liquid material. The piston is movably disposed in the storage space. The driving mechanism is used for pushing the piston to move toward the through hole so that the piston extrudes the liquid material through the through hole. Thus, cleaning time and cost can be saved, and can provide the mixed uniform liquid material to an injection molding machine. | |||
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14 | TW201940034A |
Electronic module and manufacturing method thereof and housing of electronic device and manufacturing method thereof
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Publication/Patent Number: TW201940034A | Publication Date: 2019-10-01 | Application Number: 107107852 | Filing Date: 2018-03-08 | Inventor: Guo, Wen-i Yang, Yao-long Liu, Yen-pin Chen, Hsiao-tzu Chien, Huai-liang Ho, Chi-neng | Assignee: Taiwan green point enterprises co ltd | IPC: H05K5/02 | Abstract: A method of manufacturing an electronic module includes the following steps: Providing a substrate, a conductive circuits is formed on a surface of the substrate, the conductive circuits has at least one contact. Fixedly connected a first end of a conductive elastic member to the contact. And forming an insulating package covering at least a portion of the conductive elastic member and exposing a second end of the conductive elastic member. Thus, the conductive elastic member can be used as a conductive contact for the electrical connection of an electronic component. The foregoing manufacturing method simplifies the manufacturing process, greatly shortens the total processing time and reduces the manufacturing cost. In addition, the reliability of the fixed connection between the conductive elastic member, the contact of the substrate and the pins of the electronic component can be improved so as not to affect the electrical signal transmission between the electronic component and the substrate. | |||
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15 | TWI660654B |
Method for manufacturing a lamp and products thereof,method for manufacturing a three-dimensional circuit board and products thereof
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Publication/Patent Number: TWI660654B | Publication Date: 2019-05-21 | Application Number: 106134857 | Filing Date: 2017-10-12 | Inventor: Chen, Chih-hao Liao, Pen-yi Yi, Sheng-hung Yang, Jing-yi Tsai, Wen-chia | Assignee: Taiwan green point enterprises co ltd | IPC: H05K3/00 | Abstract: A method for manufacturing a lamp comprises the steps as follows: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; forming an active layer patterned on the insulating layer and containing an active material; bending the metal plate to form at least one bent portion passing through the patterned active layer; forming a first metal layer on the patterned active layer to form a conductive line; providing a plurality of luminous elements on the conductive line, the luminous elements being distributed in different regions separated by the at least one bent portion and electrically connected to the conductive line. | |||
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16 | TWI676544B |
Feeding device and injection molding equipment having the same, and method of feeding liquid material to an injection molding machine
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Publication/Patent Number: TWI676544B | Publication Date: 2019-11-11 | Application Number: 106145494 | Filing Date: 2017-12-25 | Inventor: Lin, Che-yu Tseng, Chien-chia Liao, Ying-lun Sung, Cheng-yu Lin, Ke-yu | Assignee: Taiwan green point enterprises co ltd | IPC: B29C45/18 | Abstract: A feeding device includes a material storage mechanism, and a driving mechanism. The material storage mechanism includes a carrying assembly, a storage container is detachably assembled positioning in the carrying assembly, and a piston. The storage container is disposable and formed with a storage space, and a through hole communicating with the storage space. The storage space is used for containing a liquid material. The piston is movably disposed in the storage space. The driving mechanism is used for pushing the piston to move toward the through hole so that the piston extrudes the liquid material through the through hole. Thus, cleaning time and cost can be saved, and can provide the mixed uniform liquid material to an injection molding machine. | |||
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17 | US2019126273A1 |
SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES
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Publication/Patent Number: US2019126273A1 | Publication Date: 2019-05-02 | Application Number: 16/176,348 | Filing Date: 2018-10-31 | Inventor: Yang, Sung-yi Wang, Pao-chuan | Assignee: Taiwan green point enterprises co ltd | IPC: B01L3/00 | Abstract: A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together. | |||
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18 | TW201900476A |
Handlebar and image capturing device and event data recorder thereof
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Publication/Patent Number: TW201900476A | Publication Date: 2019-01-01 | Application Number: 106116822 | Filing Date: 2017-05-22 | Inventor: Chen, Yi-te Lin, Jun-yi Lo, I-wei | Assignee: Taiwan green point enterprises co ltd | IPC: B62K21/26 | Abstract: A handlebar includes a handlebar body and an image capturing device. The handlebar body includes two handles located on left and right sides respectively and extending rearward. Each handle has a free end. The image capturing device disposed on the free end of one of the handles, to capturing the image behind the handle. Thus, the rights of the rider in the event of an accident can be guaranteed, and the safety of the rider in the process of riding a bicycle can be enhanced. | |||
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19 | US201945638A1 |
DOUBLE-SIDED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME
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Publication/Patent Number: US201945638A1 | Publication Date: 2019-02-07 | Application Number: 20/181,615 | Filing Date: 2018-10-09 | Inventor: Tseng, I Lin Chen, Tzu Chun | Assignee: Taiwan green point enterprises co ltd | IPC: H05K3/38 | Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region. | |||
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20 | TW201909531A |
Power converter and power conversion method
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Publication/Patent Number: TW201909531A | Publication Date: 2019-03-01 | Application Number: 106123280 | Filing Date: 2017-07-12 | Inventor: Chen, Chia-tai | Assignee: Taiwan green point enterprises co ltd | IPC: H02M1/44 | Abstract: A power converter comprises a primary circuit, two first Y capacitors, and a secondary circuit. The primary circuit receives an AC input voltage and generates a first primary power and a second primary power. The two first Y capacitors couple to the primary circuit to receive the first primary power and the second primary power. The two first Y capacitors respectively generate a first coupling voltage and a second coupling voltage based on the electric coupling of the first primary power and the second primary power. The secondary side circuit electrically connecting the two first Y capacitors to receive the first coupling voltage and the second coupling voltage. The two first Y capacitors are used to maintain the insulation between the primary circuit and the secondary circuit. |