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1
JP2019117619A
OPTICAL FINGERPRINT SENSOR
Publication/Patent Number: JP2019117619A Publication Date: 2019-07-18 Application Number: 2018086476 Filing Date: 2018-04-27 Inventor: Chen, Hao-min   Mao, Hsin-wei   Wu, Han Lin   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G06T1/00 Abstract: To provide an optical fingerprint sensor reducing optical transmission loss and having a light guide layer emitting light uniformly into a sensing area.SOLUTION: An optical fingerprint sensor includes an image sensor array, a collimator layer disposed on the image sensor array and having an array of a first hole, a light guide layer disposed on the collimator layer, a light source emitting light into the light guide layer, and a sensing area disposed on the light guide layer. The light guide layer makes a part of the light from the light source incident into the sensing area as well as guides the remaining part of the light forward.SELECTED DRAWING: Figure 1
2
JP2019186515A
IMAGE SENSORS AND METHODS FOR FORMING THE SAME
Publication/Patent Number: JP2019186515A Publication Date: 2019-10-24 Application Number: 2018193436 Filing Date: 2018-10-12 Inventor: Chin, Hirohito   Chen, Chang Xiong   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H01L27/146 Abstract: To provide image sensors including a resonator structure.SOLUTION: An image sensor includes a substrate having a first pixel region and a second pixel region and a resonator structure disposed over the substrate. The resonator structure includes: a first metal layer disposed over the first pixel region and the second pixel region; a first insulating layer disposed over the first metal layer and the first pixel region and having first thickness; a second insulating layer disposed over the first metal layer and the second pixel region and having second thickness that is greater than the first thickness; and a second metal layer disposed over the first insulating layer and the second insulating layer.SELECTED DRAWING: Figure 1F
3
JP2019139203A
OPTICAL ELEMENT
Publication/Patent Number: JP2019139203A Publication Date: 2019-08-22 Application Number: 2018109692 Filing Date: 2018-06-07 Inventor: Hsu, Chung-jung   Hsieh, Chin-chuan   Lin, Kuo Feng   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B3/00 Abstract: To provide a color filter of an optical element or an optical element in which a light guiding structure is formed on a micro-lens.SOLUTION: An optical element includes an array structure having an injection area and a non-injection area adjacent to the injection area. The injection area has injection concentration of 1×10cmor more. The array structure is a color filter array 14 including a plurality of color filters. At least one of the color filters has the injection area 16. In the optical element 10, the injection area 16 has width which is 50 to 95% of width of the color filter.SELECTED DRAWING: Figure 1
4
JP2019186516A
OPTICAL SENSOR AND METHOD OF FORMING THE SAME
Publication/Patent Number: JP2019186516A Publication Date: 2019-10-24 Application Number: 2018193438 Filing Date: 2018-10-12 Inventor: Sano, Masafumi   Hayashi, Kazuyasu   Wu, Qing Qiang   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H01L31/0232 Abstract: To provide an optical sensor having a polymer material layer filling an opening of a light shielding layer.SOLUTION: The optical sensor includes: an optical layer disposed on a substrate; a light shielding layer disposed on the optical layer and including a first opening that partially exposes the optical layer; a polymer material layer filling the first opening, an upper surface of which is higher than an upper surface of the light shielding layer; an adhesive layer disposed on the light shielding layer and the polymer material layer; and a surface component disposed on the adhesive layer.SELECTED DRAWING: Figure 3D
5
JP2019113519A
SPECTRUM MEASURING DEVICE AND MANUFACTURING METHOD THEREOF
Publication/Patent Number: JP2019113519A Publication Date: 2019-07-11 Application Number: 2018116135 Filing Date: 2018-06-19 Inventor: Wang, Wei-ko   Chin, Hirohito   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H01L31/10 Abstract: To provide a spectrum measuring device having an absorption type filter and an interference type filter for improving a spectrometer, and to provide its measurement method.SOLUTION: A spectrum measuring device includes: a board including a first photodiode and a second photodiode; an interference type filter that is disposed on the first photodiode and the second photodiode and allows first rays having a multiband wavelength including a first wavelength band (a), a second wavelength band (b), a third wavelength band (c), and a fourth wavelength band (d); a first absorption type filter that is disposed on the first photodiode and the second photodiode and allows second rays having a wavelength in a first area to pass; and a second absorption type filter that is disposed on the second photodiode and is disposed on the first absorption type filter, and allows third rays having a wavelength in a second area overlapping with the first area to pass.SELECTED DRAWING: Figure 4
6
JP2019033467A
LENS-FREE IMAGE SENSOR USING HOLOGRAM OF PHASE SHIFT
Publication/Patent Number: JP2019033467A Publication Date: 2019-02-28 Application Number: 2017214953 Filing Date: 2017-11-07 Inventor: Hsieh, Chin-chuan   Lin, Kuo Feng   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H04N9/07 Abstract: To provide a lens-free image sensor using hologram of phase shift.SOLUTION: An image sensor includes a plurality of photoelectric elements for receiving incident light. The photoelectric element is arranged in a plurality of unit cells. Each unit cell contains a first photoelectric element and a second photoelectric element. The first photoelectric element of each unit cell images a first pixel of a first phase. The second photoelectric element of each unit cell images a second pixel of a second phase. The first phase is different from the second phase.SELECTED DRAWING: Figure 2A
7
JP6616447B2
OPTICAL FINGERPRINT SENSOR
Publication/Patent Number: JP6616447B2 Publication Date: 2019-12-04 Application Number: 2018086476 Filing Date: 2018-04-27 Inventor: Chen, Hao-min   Mao, Hsin-wei   Wu, Han Lin   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G06T1/00 Abstract: To provide an optical fingerprint sensor reducing optical transmission loss and having a light guide layer emitting light uniformly into a sensing area.SOLUTION: An optical fingerprint sensor includes an image sensor array, a collimator layer disposed on the image sensor array and having an array of a first hole, a light guide layer disposed on the collimator layer, a light source emitting light into the light guide layer, and a sensing area disposed on the light guide layer. The light guide layer makes a part of the light from the light source incident into the sensing area as well as guides the remaining part of the light forward.SELECTED DRAWING: Figure 1
8
JP2018141766A
SPECTRUM INSPECTION DEVICE
Publication/Patent Number: JP2018141766A Publication Date: 2018-09-13 Application Number: 2017121934 Filing Date: 2017-06-22 Inventor: Wang, Wei-ko   Chin, Hirohito   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G01J3/36 Abstract: PROBLEM TO BE SOLVED: To provide a spectrum inspection device capable of sensing at least two peak wavelengths of an incident light beam with a simple structure.SOLUTION: A spectrum-inspection device 1 includes: a sensor unit array 10 including a first sensor unit 10a and a second sensor unit 10b; a dual-band pass filter 20a disposed on the sensor unit array to cover the first sensor unit and the second sensor unit and configured to pass a light beam in a first waveband and a second waveband; and a filter 30a disposed on the dual-band pass filter to cover the second sensor unit and configured to pass a light beam of wavelengths longer than a first wavelength, where the first wavelength is longer than a peak wavelength of the first waveband and shorter than a peak wavelength of the second waveband.SELECTED DRAWING: Figure 3
9
JP6259044B2
カメラモジュール
Title (English): Camera module
Publication/Patent Number: JP6259044B2 Publication Date: 2018-01-10 Application Number: 2016210297 Filing Date: 2016-10-27 Inventor: Chen, Chin-fu   Liu, I-pei   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B5/22 Abstract: 【課題】感光度を改善したイメージセンサおよび画像取込装置のカメラモジュールを提供する。【解決手段】カメラモジュールA30は光透過板31、上感知層32、および光カット層33を含む。光透過板31は、下面311および下面311に対向する上面312を含む。上感知層32は下面311上に形成されている。光カット層33は上面312上に形成され、ブロック材331、およびブロック材331を貫いて設けられた複数の透光孔332を含む。【選択図】図1
10
JP2018006725A
カメラモジュール
Title (English): Camera module
Publication/Patent Number: JP2018006725A Publication Date: 2018-01-11 Application Number: 2016210297 Filing Date: 2016-10-27 Inventor: Chen, Chin-fu   Liu, I-pei   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B5/22 Abstract: 【課題】感光度を改善したイメージセンサおよび画像取込装置のカメラモジュールを提供する。【解決手段】カメラモジュールA30は光透過板31、上感知層32、および光カット層33を含む。光透過板31は、下面311および下面311に対向する上面312を含む。上感知層32は下面311上に形成されている。光カット層33は上面312上に形成され、ブロック材331、およびブロック材331を貫いて設けられた複数の透光孔332を含む。【選択図】図1
11
JP2018005876A
3D画像センサおよび3D撮像装置
Title (English): 3D image sensor and 3D imaging equipment
Publication/Patent Number: JP2018005876A Publication Date: 2018-01-11 Application Number: 2016205190 Filing Date: 2016-10-19 Inventor: Chen, Chin-fu   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B3/00 Abstract: 【課題】 3D撮像装置のセキュリティを向上させる3D撮像装置および3D画像センサを提供する。【解決手段】 本発明の3D画像センサは、複数の感知ユニットを含む感知層、前記感知層上に配置され、不透光性材料と前記不透光性材料を貫通する複数の透光性素子を含む格子層、および前記格子層上に配置され、それぞれが2つの隣接する透光性素子の上に配置された複数のマイクロレンズを含む。【選択図】 図2
12
JP2018190946A
IMAGE SENSOR
Publication/Patent Number: JP2018190946A Publication Date: 2018-11-29 Application Number: 2017145445 Filing Date: 2017-07-27 Inventor: Hsieh, Chin-chuan   Kuo, Wu-cheng   Lin, Kuo Feng   Wu, Tsung-lin   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H04N5/369 Abstract: PROBLEM TO BE SOLVED: To provide an image sensor.SOLUTION: The image sensor is provided. The image sensor includes a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion element disposed on the first region of the substrate. The first photoelectric conversion element includes: a first metal layer formed on the substrate; a first photoelectric conversion layer formed on the first metal layer; and a second metal layer formed on the first photoelectric conversion layer.SELECTED DRAWING: Figure 1B
13
JP2018014476A
画像センサ構造
Title (English): Image sensor structure
Publication/Patent Number: JP2018014476A Publication Date: 2018-01-25 Application Number: 2016205954 Filing Date: 2016-10-20 Inventor: Wang, Wei-ko   Hsieh, Chin-chuan   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B3/00 Abstract: 【課題】 位相差検出オートフォーカス(PDAF)機能を行うことができ、且つ高品質な撮像効果を有する新規な画像センサ構造を提供する。【解決手段】 画像センサ構造は、1つの緑色フィルターを含む第1のユニット、1つの緑色フィルターを含む第2のユニット、1つの青色フィルターを含む第3のユニット、および1つの赤色フィルターを含む第4のユニットに分けられ、第1のユニットは、第2のユニットに隣接している複数のカラーフィルターパターン、およびカラーフィルターパターン上に形成され、第1のユニットの1つの緑色フィルターと第2のユニットの1つの緑色フィルター上に1つのマイクロレンズを有する第1のマイクロレンズユニット、第3のユニットの1つの青色フィルター上の第2のマイクロレンズユニット、および第4のユニットの1つの赤色フィルター上の第3のマイクロレンズユニットに分けられた複数のマイクロレンズを含む。【選択図】 図2A
14
JP2018207086A
SOLID-STATE IMAGING ELEMENT INCLUDING MICROLENS LAYER WITH DUMMY STRUCTURE
Publication/Patent Number: JP2018207086A Publication Date: 2018-12-27 Application Number: 2017157805 Filing Date: 2017-08-18 Inventor: Lin, Chi-han   Huang, Tzu-wei   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H04N5/335 Abstract: To provide a solid-state imaging element including a microlens layer with a dummy structure.SOLUTION: A solid-state imaging element comprises a sensing region, a pad region, and a peripheral region arranged between the sensing region and the pad region. The solid-state imaging element includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and arranged in the sensing region, and a bond pad arranged on the semiconductor substrate and in the pad region. The solid-state imaging element further includes a microlens layer arranged on the semiconductor substrate. The microlens layer includes a microlens array arranged in the sensing region and a first dummy structure arranged in the pad region. The first dummy structure includes a plurality of first microlens elements arranged so as to surround a bond pad region. Moreover, the solid-state imaging element includes a protection film conformally formed on an upper surface of the microlens layer.SELECTED DRAWING: Figure 1
15
JP6162732B2
IMAGE SENSOR STRUCTURE
Publication/Patent Number: JP6162732B2 Publication Date: 2017-07-12 Application Number: 2015015187 Filing Date: 2015-01-29 Inventor: Hsu, Chung-jung   Tu, Zong-ru   Hsieh, Chin-chuan   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B5/20 Abstract: PROBLEM TO BE SOLVED: To provide an image sensor structure.SOLUTION: An image-sensor structure is provided. The image-sensor structure includes a substrate
16
JP6091539B2
STACK FILTER AND IMAGE SENSOR INCLUDING THE SAME
Publication/Patent Number: JP6091539B2 Publication Date: 2017-03-08 Application Number: 2015051668 Filing Date: 2015-03-16 Inventor: Wang, Wei-ko   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B5/20 Abstract: PROBLEM TO BE SOLVED: To provide a stack filter and an image sensor including the same.SOLUTION: Provided is a stack filter of an image sensor including an infrared (IR) pixel. The stack filter includes a first filter layer installed in the IR pixel. The first filter layer transmits a light beam having wavelength of a first band. The stack filter further includes a second filter layer stacked with the first filter layer. The second filter layer transmits a light beam having wavelength of a second band. The first band is partly overlapped with the second band at wavelength of a third band. The third band is narrower than the first band and the second band. The stack filter transmits a light beam having wavelength of the third band. In addition
17
JP6105538B2
SOLID STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF THE SAME
Publication/Patent Number: JP6105538B2 Publication Date: 2017-03-29 Application Number: 2014194558 Filing Date: 2014-09-25 Inventor: Hsiao, Yu-kun   Lin, Chi-han   Tu, Zong-ru   Zhang, Zhi Guang   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B5/20 Abstract: PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus and a manufacturing method of the solid state imaging apparatus.SOLUTION: A solid state imaging apparatus includes a substrate including a first photoelectric conversion element and a second photoelectric conversion element. A color filter layer includes a first color filter element and a second color filter element which are respectively installed on the first and second photoelectric conversion elements. A light blocking partition is installed between the first and second color filter elements. A height of the light blocking partition is lower than the first and second color filter elements. A buffer layer is installed between the first and second color filter elements and positioned on the light blocking partition. A refraction index of the buffer layer is lower than the color filter layer.
18
JP2017076769A
IMAGE SENSOR WITH YELLOW FILTER UNIT
Publication/Patent Number: JP2017076769A Publication Date: 2017-04-20 Application Number: 2016010637 Filing Date: 2016-01-22 Inventor: Kuo, Wu-cheng   Wang, Wei-ko   Hsieh, Chin-chuan   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G02B5/20 Abstract: PROBLEM TO BE SOLVED: To provide an image sensor having a yellow filter for improving sensitivity and image quality.SOLUTION: The image sensor comprises: a detection layer 10 for detecting a light beam; and a plurality of pixel groups E1. Each of the pixel groups E1 includes: a yellow filter unit 20a for causing a green light component and a red light component of the light beam to pass; a green filter unit 20b for causing the green light component of the light beam to pass: and a blue filter unit 20c for causing a blue light component of the light beam to pass.SELECTED DRAWING: Figure 1
19
JP6165211B2
DETECTION DEVICE FOR ANALYTE
Publication/Patent Number: JP6165211B2 Publication Date: 2017-07-19 Application Number: 2015189199 Filing Date: 2015-09-28 Inventor: Wang, Wei-ko   Tu, Zong-ru   Hsieh, Chin-chuan   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G01N21/03 Abstract: PROBLEM TO BE SOLVED: To provide a detection device for an analyte.SOLUTION: There is provided a detection device for an analyte comprising: an image sensor; a light guide structure that is arranged on the image sensor and includes a light guide layer that arranged on the image sensor and an upper layer arranged on the light guide layer; and a plurality of wells that are arranged on the light guide structure and arranged above the upper layer in a second array
20
JP2017032537A
SPECTRAL MEASUREMENT DEVICE
Publication/Patent Number: JP2017032537A Publication Date: 2017-02-09 Application Number: 2016004981 Filing Date: 2016-01-14 Inventor: Wang, Wei-ko   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: G01N21/27 Abstract: PROBLEM TO BE SOLVED: To provide a small and light spectral measurement device
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