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CN112185919A
用于集成电路的背侧集成电压调节器
Substantial Examination
Publication/Patent Number: CN112185919A Publication Date: 2021-01-05 Application Number: 202011056882.5 Filing Date: 2020-09-30 Inventor: 金楠勋   权云成   甘后乐     米哈伊尔·波波维奇   特克久·康   Assignee: 谷歌有限责任公司   IPC: H01L23/48 Abstract: 本公开涉及用于集成电路的背侧集成电压调节器。该技术涉及集成电路(IC)封装。IC封装可以包括封装基板、IC裸片和集成电压调节器裸片。IC裸片可以包括金属层和硅层。金属层可以连接到封装基板。集成电压调节器裸片可以邻近于硅层定位,并且经由一个或多个穿模通孔(TMV)或穿电介质通孔(TDV)连接到封装基板。IC裸片可以是专用集成电路(ASIC)裸片。