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1
US2020161347A1
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2020161347A1 Publication Date: 2020-05-21 Application Number: 16/688,234 Filing Date: 2019-11-19 Inventor: Ishiwata, Hiroaki   Tanaka, Harumi   Ando, Atsuhiro   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable warping of a substrate to be suppressed. A first structural body including a pixel array unit is layered with a second structural body including an input/output circuit unit and outputting a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; and a signal output external terminal and a signal input external terminal are arranged below the pixel array unit, the signal output external terminal being connected to the outside via a first through-via penetrating through a semiconductor substrate in the second structural body, the signal input external terminal being connected to the outside via a second through-via connected to an input circuit unit and penetrating through the semiconductor substrate. The signal output external terminal is electrically connected to the first through-via via a first rewiring line, the signal input external terminal is electrically connected to the second through-via via a second rewiring line, and a third rewiring line being electrically independent is arranged in a layer in which the first rewiring line and the second rewiring line are arranged. The present disclosure can be applied to, for example, the image pickup device, and the like.
2
US10529752B2
Image pickup device and electronic apparatus
Publication/Patent Number: US10529752B2 Publication Date: 2020-01-07 Application Number: 16/085,452 Filing Date: 2017-03-10 Inventor: Ishiwata, Hiroaki   Tanaka, Harumi   Ando, Atsuhiro   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable warping of a substrate to be suppressed. A first structural body including a pixel array unit is layered with a second structural body including an input/output circuit unit and outputting a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; and a signal output external terminal and a signal input external terminal are arranged below the pixel array unit, the signal output external terminal being connected to the outside via a first through-via penetrating through a semiconductor substrate in the second structural body, the signal input external terminal being connected to the outside via a second through-via connected to an input circuit unit and penetrating through the semiconductor substrate. The signal output external terminal is electrically connected to the first through-via via a first rewiring line, the signal input external terminal is electrically connected to the second through-via via a second rewiring line, and a third rewiring line being electrically independent is arranged in a layer in which the first rewiring line and the second rewiring line are arranged. The present disclosure can be applied to, for example, the image pickup device, and the like.
3
US10748947B2
Imaging device, manufacturing method, and electronic apparatus
Publication/Patent Number: US10748947B2 Publication Date: 2020-08-18 Application Number: 16/322,307 Filing Date: 2017-07-25 Inventor: Masuda, Yoshiaki   Ando, Atsuhiro   Kubo, Norihiro   Arai, Chihiro   Saito, Sotetsu   Tada, Masahiro   Miyazawa, Shinji   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L31/0203 Abstract: The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus. An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.
4
US10236311B2
Solid-state imaging element and electronic device to improve quality of an image
Publication/Patent Number: US10236311B2 Publication Date: 2019-03-19 Application Number: 15/518,483 Filing Date: 2015-10-07 Inventor: Suzuki, Ryoji   Moriya, Hitoshi   Ando, Atsuhiro   Masagaki, Atsushi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L31/00 Abstract: The present technology relates to a solid-state imaging element and an electronic device capable of improving image quality of the solid-state imaging element. The solid-state imaging element includes a photoelectric conversion unit adapted to photoelectrically convert incident light incident from a predetermined incident surface. Also, the solid-state imaging element includes a wire arranged on a bottom surface side that is an opposite surface of the incident surface of the photoelectric conversion unit, and formed with a protruding pattern on a surface facing the photoelectric conversion unit. The present technology can be applied to, for example, a solid-state imaging element such as a CMOS image sensor, and an electronic device including the solid-state imaging element.
5
US2019057989A1
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2019057989A1 Publication Date: 2019-02-21 Application Number: 16/085,452 Filing Date: 2017-03-10 Inventor: Ishiwata, Hiroaki   Tanaka, Harumi   Ando, Atsuhiro   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable warping of a substrate to be suppressed. A first structural body including a pixel array unit is layered with a second structural body including an input/output circuit unit and outputting a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; and a signal output external terminal and a signal input external terminal are arranged below the pixel array unit, the signal output external terminal being connected to the outside via a first through-via penetrating through a semiconductor substrate in the second structural body, the signal input external terminal being connected to the outside via a second through-via connected to an input circuit unit and penetrating through the semiconductor substrate. The signal output external terminal is electrically connected to the first through-via via a first rewiring line, the signal input external terminal is electrically connected to the second through-via via a second rewiring line, and a third rewiring line being electrically independent is arranged in a layer in which the first rewiring line and the second rewiring line are arranged. The present disclosure can be applied to, for example, the image pickup device, and the like.
6
US2019172863A1
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2019172863A1 Publication Date: 2019-06-06 Application Number: 16/322,307 Filing Date: 2017-07-25 Inventor: Masuda, Yoshiaki   Ando, Atsuhiro   Kubo, Norihiro   Arai, Chihiro   Saito, Sotetsu   Tada, Masahiro   Miyazawa, Shinji   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus—An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.
7
KR20190034553A
촬상 소자, 제조 방법, 및 전자 기기
Publication/Patent Number: KR20190034553A Publication Date: 2019-04-02 Application Number: 20197003594 Filing Date: 2017-07-25 Inventor: Miyazawa, Shinji   Arai, Chihiro   Ando, Atsuhiro   Saito, Sotetsu   Kubo, Norihiro   Masuda, Yoshiaki   Tada, Masahiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: 본 개시는, 보다 양호한 특성을 구비할 수 있도록 하는 촬상 소자, 제조 방법, 및 전자 기기에 관한 것이다. 촬상 소자는, 복수의 화소가 어레이 형상으로 배치된 유효 화소 영역이 설치되는 센서 기판과, 센서 기판의 유효 화소 영역측의 면을 봉지하는 투명한 봉지 부재와, 적어도 유효 화소 영역을 포함하는 영역에 있어서 센서 기판 및 봉지 부재를 접착하는 시일 수지와, 평면적으로 보았을 때에 유효 화소 영역보다 외측이 되는 외주 영역에 있어서 센서 기판 및 봉지 부재를 접착하며, 시일 수지보다 강성이 높은 보강 수지를 구비한다. 그리고, 외주 영역에 있어서의 시일 수지 및 보강 수지에 의한 단위면적당의 접착력과, 외주 영역에 있어서 접착되는 접착 면적과의 적이, 유효 화소 영역에 있어서의 시일 수지에 의한 단위면적당의 접착력과, 유효 화소 영역에 있어서 접착되는 접착 면적과의 적보다 크게 설정된다. 본 기술은, 예를 들어, WCSP의 CMOS 이미지 센서에 적용할 수 있다.
8
US2017229503A1
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
Publication/Patent Number: US2017229503A1 Publication Date: 2017-08-10 Application Number: 15/518,483 Filing Date: 2015-10-07 Inventor: Suzuki, Ryoji   Moriya, Hitoshi   Ando, Atsuhiro   Masagaki, Atsushi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to a solid-state imaging element and an electronic device capable of improving image quality of the solid-state imaging element. The solid-state imaging element includes a photoelectric conversion unit adapted to photoelectrically convert incident light incident from a predetermined incident surface. Also, the solid-state imaging element includes a wire arranged on a bottom surface side that is an opposite surface of the incident surface of the photoelectric conversion unit, and formed with a protruding pattern on a surface facing the photoelectric conversion unit. The present technology can be applied to, for example, a solid-state imaging element such as a CMOS image sensor, and an electronic device including the solid-state imaging element.
9
JP2017174994A
IMAGING APPARATUS AND ELECTRONIC APPARATUS
Publication/Patent Number: JP2017174994A Publication Date: 2017-09-28 Application Number: 2016059978 Filing Date: 2016-03-24 Inventor: Tanaka, Harumi   Ando, Atsuhiro   Ishiwatari, Hiroaki   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To hinder warping of a substrate.SOLUTION: An imaging apparatus comprises a stack of a first structure in which a pixel array part is formed; and a second structure in which an input/output circuit part and a signal processing circuit are formed
10
WO2017163924A1
IMAGING DEVICE AND ELECTRONIC DEVICE
Publication/Patent Number: WO2017163924A1 Publication Date: 2017-09-28 Application Number: 2017009667 Filing Date: 2017-03-10 Inventor: Ishiwata, Hiroaki   Tanaka, Harumi   Ando, Atsuhiro   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to: an imaging device which is capable of suppressing a warp of a substrate; and an electronic device. According to the present disclosure
11
JP2016082133A
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: JP2016082133A Publication Date: 2016-05-16 Application Number: 2014213767 Filing Date: 2014-10-20 Inventor: Suzuki, Ryoji   Masagaki, Atsushi   Ando, Atsuhiro   Moriya, Jin   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To improve image quality of a solid-state imaging device.SOLUTION: A solid-state imaging device includes a photoelectric conversion part for photoelectrically converting incident light incident from a predetermined incident surface. The solid-state imaging device also includes wiring which is arranged on the side of a bottom surface opposite to the incident surface of the photoelectric conversion part and which has a projecting pattern formed on a surface thereof facing the photoelectric conversion part. This technology is applicable
12
WO2016063727A1
SOLID-STATE IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE
Publication/Patent Number: WO2016063727A1 Publication Date: 2016-04-28 Application Number: 2015078495 Filing Date: 2015-10-07 Inventor: Suzuki, Ryoji   Moriya, Hitoshi   Masagaki, Atsushi   Ando, Atsuhiro   Assignee: Sony Corporation   IPC: H01L27/14 Abstract: The present technique relates to a solid-state image pickup element and an electronic device for enabling the picture quality of solid-state image pickup elements to be improved. A solid-state image pickup element comprises a photoelectric conversion part for performing photoelectric conversion of an incident light that is incident from a predetermined incidence surface. The solid-state image pickup element further comprises a wiring which is arranged on a bottom side
13
JP5651986B2
SOLID-STATE IMAGE PICKUP DEVICE
Publication/Patent Number: JP5651986B2 Publication Date: 2015-01-14 Application Number: 2010086162 Filing Date: 2010-04-02 Inventor: Ando, Atsuhiro   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To reduce the intensity of diffraction light spreading to parts other than a photoelectric conversion unit by diffraction effect of light incident upon an opening in the photoelectric conversion unit serving as a light-receiving unit to increase the sensitivity
14
US8736727B2
Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module
Publication/Patent Number: US8736727B2 Publication Date: 2014-05-27 Application Number: 13/071,703 Filing Date: 2011-03-25 Inventor: Ando, Atsuhiro   Assignee: Sony Corporation   IPC: H04N3/14 Abstract: A solid-state imaging device includes a photoelectric conversion portion, a charge-receiving portion to which charges are transferred from the photoelectric conversion portion, and a light control film having a reverse tapered opening over the photoelectric conversion portion to reduce the intensity of diffracted light diffusing to regions other than the photoelectric conversion portion.
15
JP2013168546A
IMAGE SENSOR
Publication/Patent Number: JP2013168546A Publication Date: 2013-08-29 Application Number: 2012031518 Filing Date: 2012-02-16 Inventor: Ando, Atsuhiro   Okuno, Jun   Asazuma, Tomohiko   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To suppress loss of light more effectively.SOLUTION: In an image sensor