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1 | EP3608962A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: EP3608962A1 | Publication Date: 2020-02-12 | Application Number: 19189836.0 | Filing Date: 2019-08-02 | Inventor： Zhang, Wei Evans, Michael J. Malchow, Douglas Stewart Bereznycky paul l Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer (102) on a surface (104) of an absorption layer (106). The method includes forming a plurality of spaced apart pixel diffusion areas (116) in the cap layer (102). The method includes forming a mesa trench (124) with opposed sidewalls (126) through the cap layer (102), wherein the mesa trench (124) surrounds each of the pixel diffusion areas (116) separating the pixel diffusion areas (116) from one another. The method includes forming a sidewall passivation layer (128) over the sidewalls (126) of the mesa trench (124) and removing a portion of the sidewall passivation layer (128) to expose a respective contact (118) electrically connected to each of the pixel diffusion areas (116), but leaving the sidewalls (126) of the mesa trench covered with the sidewall passivation layer (128) wherein the contact (118) is open and uncovered for electrical connection. | |||
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2 | US2020052012A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: US2020052012A1 | Publication Date: 2020-02-13 | Application Number: 16/057,191 | Filing Date: 2018-08-07 | Inventor： Zhang, Wei Evans, Michael J. Malchow, Douglas Stewart Bereznycky paul l Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection. | |||
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3 | US202052012A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: US202052012A1 | Publication Date: 2020-02-13 | Application Number: 20/181,605 | Filing Date: 2018-08-07 | Inventor： Zhang, Wei Malchow, Douglas Stewart Evans, Michael J. Paik, Namwoong Bereznycky paul l | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection. | |||
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4 | US2020083272A1 |
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
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Publication/Patent Number: US2020083272A1 | Publication Date: 2020-03-12 | Application Number: 16/129,402 | Filing Date: 2018-09-12 | Inventor： Zhang, Wei Malchow, Douglas Stewart Evans, Michael J. Huang, Wei Bereznycky paul l Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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5 | US10727267B2 |
Interconnect bump structures for photo detectors
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Publication/Patent Number: US10727267B2 | Publication Date: 2020-07-28 | Application Number: 16/129,402 | Filing Date: 2018-09-12 | Inventor： Zhang, Wei Malchow, Douglas Stewart Evans, Michael J. Huang, Wei Bereznycky paul l Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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6 | US2020312900A1 |
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
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Publication/Patent Number: US2020312900A1 | Publication Date: 2020-10-01 | Application Number: 16/902,318 | Filing Date: 2020-06-16 | Inventor： Zhang, Wei Malchow, Douglas Stewart Evans, Michael J. Huang, Wei Bereznycky paul l Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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7 | EP3624191A1 |
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
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Publication/Patent Number: EP3624191A1 | Publication Date: 2020-03-18 | Application Number: 19197065.6 | Filing Date: 2019-09-12 | Inventor： Zhang, Wei Malchow, Douglas Stewart Evans, Michael J. Huang, Wei Bereznycky paul l Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. |
3.Current Quota