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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1 US202027834A1
INTERCONNECTION STRUCTURE AND SENSOR PACKAGE
Publication/Patent Number: US202027834A1 Publication Date: 2020-01-23 Application Number: 20/191,651 Filing Date: 2019-07-17 Inventor: Chan hsun wei   Tang, Shih-chieh   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H05K1/18 Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.
2 US2020027834A1
INTERCONNECTION STRUCTURE AND SENSOR PACKAGE
Publication/Patent Number: US2020027834A1 Publication Date: 2020-01-23 Application Number: 16/514,962 Filing Date: 2019-07-17 Inventor: Chan hsun wei   Tang, Shih-chieh   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/528 Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.
3 US2020035851A1
OPTICAL DEVICE
Publication/Patent Number: US2020035851A1 Publication Date: 2020-01-30 Application Number: 16/518,792 Filing Date: 2019-07-22 Inventor: Tsai, Chang Chin   Huang, Yu-che   Chan hsun wei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L31/12 Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.
4 US10689249B2
Semiconductor device package including a wall and a grounding ring exposed from the wall
Publication/Patent Number: US10689249B2 Publication Date: 2020-06-23 Application Number: 14/855,684 Filing Date: 2015-09-16 Inventor: Huang, Ching-han   Chan hsun wei   Lai, Lu-ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: B81B7/00 Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.
5 US10526200B2
Semiconductor device package including cover including tilted inner sidewall
Publication/Patent Number: US10526200B2 Publication Date: 2020-01-07 Application Number: 15/815,432 Filing Date: 2017-11-16 Inventor: Huang, Ching-han   Chan hsun wei   Tsai, Yu-hsuan   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L31/0232 Abstract: A semiconductor device package includes: (1) a carrier; (2) a sensor element disposed on or within the carrier; and (3) a cover including a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface, and the penetrating hole exposing the sensor element. The semiconductor device package is characterized such that (i) the inner sidewall is divided into an upper portion and a lower portion, the upper portion is substantially perpendicular to the top surface, and the lower portion is tilted; or (ii) the entire inner sidewall is tilted. The lower portion of the inner sidewall or the entire inner sidewall is tilted at an angle of between about 10° to less than about 90°, relative to the top surface.
6 US2020140262A1
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020140262A1 Publication Date: 2020-05-07 Application Number: 16/735,006 Filing Date: 2020-01-06 Inventor: Huang, Ching-han   Chan hsun wei   Tsai, Yu-hsuan   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: B81B7/00 Abstract: A semiconductor device package includes a carrier; a sensor element disposed on or within the carrier; a cover disposed above the carrier and comprising a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface; and a light transmissive element covering the penetrating hole, wherein the sensor element senses or detects light passing through the light transmissive element.
7 US202035851A1
OPTICAL DEVICE
Publication/Patent Number: US202035851A1 Publication Date: 2020-01-30 Application Number: 20/191,651 Filing Date: 2019-07-22 Inventor: Chan hsun wei   Tsai, Chang Chin   Huang, Yu-che   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L31/12 Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.
8 US10804173B2
Lid structure and semiconductor device package including the same
Publication/Patent Number: US10804173B2 Publication Date: 2020-10-13 Application Number: 15/294,598 Filing Date: 2016-10-14 Inventor: Chen, Chun-han   Chan hsun wei   Wu, Mei-yi   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L23/10 Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.
9 US10629787B2
Lid and an optical device package having the same
Publication/Patent Number: US10629787B2 Publication Date: 2020-04-21 Application Number: 15/466,502 Filing Date: 2017-03-22 Inventor: Ho, Hsin-ying   Chan hsun wei   Chen, Ying-chung   Lai, Lu-ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L33/58 Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.
10 US2020328322A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020328322A1 Publication Date: 2020-10-15 Application Number: 16/384,847 Filing Date: 2019-04-15 Inventor: Tsai, Hsiang-chen   Lai, Lu-ming   Chan hsun wei   Chen, Ying-chung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L31/12 Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
11 US2020080841A1
OPTICAL MODULE AND METHOD OF MAKING THE SAME
Publication/Patent Number: US2020080841A1 Publication Date: 2020-03-12 Application Number: 16/683,117 Filing Date: 2019-11-13 Inventor: Chen, Ying-chung   Chan hsun wei   Lai, Lu-ming   Chen, Kuang-hsiung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: G01C3/08 Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
12 US10752494B2
Semiconductor device package
Publication/Patent Number: US10752494B2 Publication Date: 2020-08-25 Application Number: 16/212,609 Filing Date: 2018-12-06 Inventor: Tseng, Chi Sheng   Lai, Lu-ming   Tang, Shih-chieh   Ho, Hsin-ying   Chan hsun wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: B81B7/02 Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.
13 US10381294B2
Semiconductor package device
Publication/Patent Number: US10381294B2 Publication Date: 2019-08-13 Application Number: 15/396,087 Filing Date: 2016-12-30 Inventor: Chan hsun wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L23/495 Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.
14 US10396783B2
Optical module, manufacturing method thereof and electronic apparatus
Publication/Patent Number: US10396783B2 Publication Date: 2019-08-27 Application Number: 14/947,177 Filing Date: 2015-11-20 Inventor: Chan hsun wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: G01S7/481 Abstract: An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.
15 US10177283B2
LED packages and related methods
Publication/Patent Number: US10177283B2 Publication Date: 2019-01-08 Application Number: 15/492,808 Filing Date: 2017-04-20 Inventor: Chan hsun wei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/46 Abstract: An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion.
16 US10347570B2
Semiconductor package device
Publication/Patent Number: US10347570B2 Publication Date: 2019-07-09 Application Number: 15/396,087 Filing Date: 2016-12-30 Inventor: Chan hsun wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG   IPC: H01L23/495 Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.
17 US2019181311A1
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2019181311A1 Publication Date: 2019-06-13 Application Number: 16/198,511 Filing Date: 2018-11-21 Inventor: Ho, Hsin-ying   Chan hsun wei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/58 Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.
18 TW201926744A
Semiconductor device package and method of manufacturing the same
Publication/Patent Number: TW201926744A Publication Date: 2019-07-01 Application Number: 107143572 Filing Date: 2018-12-05 Inventor: Ho, Hsin-ying   Chan hsun wei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: G01S7/481 Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.
19 US10424566B2
Semiconductor package device and method of manufacturing the same
Publication/Patent Number: US10424566B2 Publication Date: 2019-09-24 Application Number: 15/396,079 Filing Date: 2016-12-30 Inventor: Hsu, Chung-wei   Ho, Hsin-ying   Chan hsun wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L25/16 Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.
20 US10453760B2
Lid array panel, package with lid and method of making the same
Publication/Patent Number: US10453760B2 Publication Date: 2019-10-22 Application Number: 15/094,178 Filing Date: 2016-04-08 Inventor: Tsai, Chang Chin   Chan hsun wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L23/32 Abstract: A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.