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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US10884289B2
Backlight module
Publication/Patent Number: US10884289B2 Publication Date: 2021-01-05 Application Number: 16/697,192 Filing Date: 2019-11-27 Inventor: Chang, Wei-jung   Chen hsiao yun   Assignee: Qisda Corporation   IPC: G09F13/04 Abstract: A backlight module includes a light-guiding plate, a plurality of reflection spots, and a light source. The reflection spots are disposed on a back surface of the light-guiding plate. Light emitted by the light source enters the light-guiding plate through a light input side surface of the light-guiding plate, and is reflected by the reflection spots to emit out of the light-guiding plate through a light output surface of the light-guiding plate. The back surface includes a central portion and a fringe portion. The fringe portion extends along an edge of the back surface. The distribution density of the reflection spots on the fringe portion gradually decreases in a direction from the central portion toward the fringe portion.
2
US10983266B2
Light bar and display device
Publication/Patent Number: US10983266B2 Publication Date: 2021-04-20 Application Number: 16/698,972 Filing Date: 2019-11-28 Inventor: Chen hsiao yun   Sung, Hsiao-ping   Kuo, Yi-cheng   Assignee: Qisda Corporation   IPC: G02B6/00 Abstract: A light bar includes a circuit board, a plurality of light emitting units, a connector and a frame module. The light emitting units are disposed on the circuit board. The connector is disposed on the circuit board. The frame module includes a plurality of frames arranged side by side. Each of the frames includes an accommodating recess. The circuit board is accommodated in the accommodating recess of each frame. The connector is located between a first end and a second end of the frame module, wherein the first end is opposite to the second end.
3
US10816718B2
Display device and assembling method thereof
Publication/Patent Number: US10816718B2 Publication Date: 2020-10-27 Application Number: 16/560,941 Filing Date: 2019-09-04 Inventor: Chen hsiao yun   Assignee: Qisda Corporation   IPC: F21V8/00 Abstract: A display device including a back plate, a light emitting module, a light guide plate and a fixing member is provided. The back plate has an inner surface and an outer surface opposite to the inner surface. The light emitting module is disposed on a side of the inner surface of the back plate. The light guide plate is disposed opposite to the inner surface of the back plate. The fixing member includes a portion, which leans on the outer surface of the back plate.
4
US2020116922A1
DISPLAY DEVICE AND ASSEMBLING METHOD THEREOF
Publication/Patent Number: US2020116922A1 Publication Date: 2020-04-16 Application Number: 16/560,941 Filing Date: 2019-09-04 Inventor: Chen hsiao yun   Assignee: Qisda Corporation   IPC: F21V8/00 Abstract: A display device including a back plate, a light emitting module, a light guide plate and a fixing member is provided. The back plate has an inner surface and an outer surface opposite to the inner surface. The light emitting module is disposed on a side of the inner surface of the back plate. The light guide plate is disposed opposite to the inner surface of the back plate. The fixing member includes a portion, which leans on the outer surface of the back plate.
5
US2020183229A1
BACKLIGHT MODULE
Publication/Patent Number: US2020183229A1 Publication Date: 2020-06-11 Application Number: 16/697,192 Filing Date: 2019-11-27 Inventor: Chang, Wei-jung   Chen hsiao yun   Assignee: QISDA CORPORATION   IPC: G02F1/1335 Abstract: A backlight module includes a light-guiding plate, a plurality of reflection spots, and a light source. The reflection spots are disposed on a back surface of the light-guiding plate. Light emitted by the light source enters the light-guiding plate through a light input side surface of the light-guiding plate, and is reflected by the reflection spots to emit out of the light-guiding plate through a light output surface of the light-guiding plate. The back surface includes a central portion and a fringe portion. The fringe portion extends along an edge of the back surface. The distribution density of the reflection spots on the fringe portion gradually decreases in a direction from the central portion toward the fringe portion.
6
US2020078441A1
METHOD FOR BLOCKING STRESS-INDUCED TUMOR PROGRESSION
Publication/Patent Number: US2020078441A1 Publication Date: 2020-03-12 Application Number: 16/387,300 Filing Date: 2019-04-17 Inventor: Wang, Mong-lien   Chen hsiao yun   Chiou, Shih-hwa   Assignee: Taipei Veterans General Hospital   IPC: A61K38/17 Abstract: The disclosure of the preset invention relates to a new method for preventing or treating tumor progression or tumor recurrence comprising administering to a subject in need thereof a therapeutically effective amount of an agent disrupting Musashi-1 (MSI1)/Argonaute 2 (AGO2) interaction. A composition or pharmaceutical composition for preventing or treating tumor progression or tumor recurrence is also provided, which comprises an agent disrupting Musashi-1 (MSI1)/Argonaute 2 (AGO2) interaction.
7
US2020209465A1
LIGHT BAR AND DISPLAY DEVICE
Publication/Patent Number: US2020209465A1 Publication Date: 2020-07-02 Application Number: 16/698,972 Filing Date: 2019-11-28 Inventor: Chen hsiao yun   Sung, Hsiao-ping   Kuo, Yi-cheng   Assignee: QISDA CORPORATION   IPC: F21V8/00 Abstract: A light bar includes a circuit board, a plurality of light emitting units, a connector and a frame module. The light emitting units are disposed on the circuit board. The connector is disposed on the circuit board. The frame module includes a plurality of frames arranged side by side. Each of the frames includes an accommodating recess. The circuit board is accommodated in the accommodating recess of each frame. The connector is located between a first end and a second end of the frame module, wherein the first end is opposite to the second end.
8
US10684649B2
Display device
Publication/Patent Number: US10684649B2 Publication Date: 2020-06-16 Application Number: 16/383,754 Filing Date: 2019-04-15 Inventor: Chen, Chun-jung   Chang, Yung-yeh   Lin, Shih-an   Chen hsiao yun   Assignee: Qisda Corporation   IPC: G06F1/16 Abstract: A display device including a casing, a frame member, a plate member and a display panel is provided. The frame member includes a frame body and a protruding column disposed on the frame body and protruded in a direction from the frame body towards the casing. The plate member is disposed on the frame body and has an opening, which allows the protruding column to pass through, wherein the protruding column fixes relative position between the frame body and the plate member. The display panel is disposed on the frame body.
9
US2020117236A1
DISPLAY DEVICE
Publication/Patent Number: US2020117236A1 Publication Date: 2020-04-16 Application Number: 16/383,754 Filing Date: 2019-04-15 Inventor: Chen, Chun-jung   Chang, Yung-yeh   Lin, Shih-an   Chen hsiao yun   Assignee: Qisda Corporation   IPC: G06F1/16 Abstract: A display device including a casing, a frame member, a plate member and a display panel is provided. The frame member includes a frame body and a protruding column disposed on the frame body and protruded in a direction from the frame body towards the casing. The plate member is disposed on the frame body and has an opening, which allows the protruding column to pass through, wherein the protruding column fixes relative position between the frame body and the plate member. The display panel is disposed on the frame body.
10
WO2019201277A1
METHOD FOR BLOCKING STRESS-INDUCED TUMOR PROGRESSION
Publication/Patent Number: WO2019201277A1 Publication Date: 2019-10-24 Application Number: 2019083044 Filing Date: 2019-04-17 Inventor: Chiou, Shih-hwa   Wang, Mong-lien   Chen hsiao yun   Assignee: WANG, Mong-Lien   IPC: C07K7/08 Abstract: Provided is a method for preventing or treating tumor progression or tumor recurrence comprising administering to a subject in need thereof a therapeutically effective amount of an agent disrupting Musashi-1 (MSI1) /Argonaute 2 (AGO2) interaction. Also provided is a composition or pharmaceutical composition for preventing or treating tumor progression or tumor recurrence, which comprises an agent disrupting Musashi-1 (MSI1) /Argonaute 2 (AGO2) interaction.
11
US10229901B2
Immersion interconnections for semiconductor devices and methods of manufacture thereof
Publication/Patent Number: US10229901B2 Publication Date: 2019-03-12 Application Number: 15/194,170 Filing Date: 2016-06-27 Inventor: Shao, Tung-liang   Hsiao, Yi-li   Chen hsiao yun   Tung, Chih-hang   Yu, Chen-hua   Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.   IPC: H01L21/4763 Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.
12
US10068868B2
Multi-strike process for bonding packages and the packages thereof
Publication/Patent Number: US10068868B2 Publication Date: 2018-09-04 Application Number: 15/433,421 Filing Date: 2017-02-15 Inventor: Shao, Tung-liang   Tung, Chih-hang   Shih, Wen-lin   Chen hsiao yun   Yu, Chen-hua   Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.   IPC: H01L23/00 Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
13
US9978709B2
Solder bump stretching method for forming a solder bump joint in a device
Publication/Patent Number: US9978709B2 Publication Date: 2018-05-22 Application Number: 15/276,196 Filing Date: 2016-09-26 Inventor: Yu, Chen-hua   Shih, Da-yuan   Tung, Chih-hang   Hsiao, Yi-li   Chen hsiao yun   Wu, Chung-jung   Yang, Su-chun   Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.   IPC: B23K103/08 Abstract: A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump.
14
US2017194278A1
Multi-Strike Process for Bonding
Publication/Patent Number: US2017194278A1 Publication Date: 2017-07-06 Application Number: 15/433,421 Filing Date: 2017-02-15 Inventor: Shao, Tung-liang   Tung, Chih-hang   Shih, Wen-lin   Chen hsiao yun   Yu, Chen-hua   Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.   IPC: H01L23/00 Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
15
DE102016101089A1
Mehrfachaufprallprozess zum Bonden
Title (English): Multiple impact processes
Publication/Patent Number: DE102016101089A1 Publication Date: 2017-07-06 Application Number: 102016101089 Filing Date: 2016-01-22 Inventor: Yu, Chen-hua   Chen hsiao yun   Shao, Tung-liang   Tung, Chih-hang   Shih, Wen-lin   Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.   IPC: H01L21/58 Abstract: Ein Verfahren weist das Durchführen eines ersten Aufprallprozesses zum Schlagen eines Metallkontakthügels einer ersten Package-Komponente gegen eine Metall-Kontaktstelle einer zweiten Package-Komponente auf. Ein erster Metallkontakthügel oder eine erste Metall-Kontaktstelle umfasst Kupfer. Ein zweiter Metallkontakthügel oder eine zweite Metall-Kontaktstelle umfasst Aluminium. Das Verfahren weist weiterhin das Durchführen eines zweiten Aufprallprozesses zum Schlagen des Metallkontakthügels gegen die Metall-Kontaktstelle auf. Ein Glühprozess wird durchgeführt
16
TW201724296A
Multi-strike process for bonding
Publication/Patent Number: TW201724296A Publication Date: 2017-07-01 Application Number: 105120727 Filing Date: 2016-06-30 Inventor: Yu, Chen-hua   Chen hsiao yun   Shao, Tung-liang   Tung, Chih-hang   Shih, Wen-lin   Assignee: Taiwan Semiconductor Manufacturing Company Ltd.   IPC: H01L21/60 Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
17
US9576929B1
Multi-strike process for bonding
Publication/Patent Number: US9576929B1 Publication Date: 2017-02-21 Application Number: 14/997,727 Filing Date: 2016-01-18 Inventor: Shao, Tung-liang   Tung, Chih-hang   Shih, Wen-lin   Chen hsiao yun   Yu, Chen-hua   Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.   IPC: H01L23/52 Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
18
KR101727854B1
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE
Publication/Patent Number: KR101727854B1 Publication Date: 2017-04-17 Application Number: 20160025707 Filing Date: 2016-03-03 Inventor: Yu, Chen Hua   Hsiao, Yi Li   Tung, Chih Hang   Shih, Da Yuan   Chen, Hsiao Yun   Wu, Chung Jung   Yang, Su Chun   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: H01L23/00 Abstract: The present invention provides a solder bump drawing method for forming a solder bump joint in a device. The method includes a step of heating a solder bump at a temperature higher than a melting temperature of the solder bump. The solder bump is drawn to increase a height of the solder bump. The solder bump is cooled to form a solder bump joint in an electronic device. According to the present invention
19
US2017012019A1
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE
Publication/Patent Number: US2017012019A1 Publication Date: 2017-01-12 Application Number: 15/276,196 Filing Date: 2016-09-26 Inventor: Yang, Su-chun   Wu, Chung-jung   Chen hsiao yun   Hsiao, Yi-li   Tung, Chih-hang   Shih, Da-yuan   Yu, Chen-hua   Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.   IPC: H01L23/00 Abstract: A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn-Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump.
20
TWI515811B
Solder bump stretching method
Publication/Patent Number: TWI515811B Publication Date: 2016-01-01 Application Number: 102102788 Filing Date: 2013-01-25 Inventor: Yu, Chen Hua   Tung, Chih-hang   Wei, Cheng Chang   Shih, Da Yuan   Chen, Hsiao Yun   Yang, Su Chun   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: H01L21/60 Abstract: A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down.
Total 2 pages