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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1 US10770625B1
Semiconductor device packages
Publication/Patent Number: US10770625B1 Publication Date: 2020-09-08 Application Number: 16/413,472 Filing Date: 2019-05-15 Inventor: Chen ying chung   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L33/48 Abstract: A semiconductor device package includes a substrate, a heat dissipation structure disposed on the substrate, and a first optical module disposed on the heat dissipation structure. The heat dissipation structure includes a housing, an optical component disposed on the housing, and a light-emitting device disposed in the housing and capable of emitting light toward the first optical component.
2 US10680366B1
Connector assembly and jumper connector thereof
Publication/Patent Number: US10680366B1 Publication Date: 2020-06-09 Application Number: 16/533,785 Filing Date: 2019-08-07 Inventor: Huang, Mu-jung   Chen ying chung   Assignee: TARNG YU ENTERPRISE CO., LTD.   IPC: H01R31/08 Abstract: A connector assembly and a jumper connector thereof are provided. The jumper connector includes a first jumper connector body case for being coupled to a first board edge connector, a second jumper connector body case for being coupled to a second board edge connector, and conductive terminals. The first and second jumper connector body cases are coupled to each other to form an internal receiving space for accommodating the conductive terminals, and the conductive terminals are movable to correspond in position to the first and second board edge connectors respectively. By such structural design, even if circuit boards incur problems like poor processing quality or position offset, the jumper connector according to the present invention can still effectively bridge and join the board edge connectors on the circuit boards, thereby desirably accomplishing electrical connection between multiple circuit boards on electronic equipment.
3 US2020212609A1
CONNECTOR ASSEMBLY AND JUMPER CONNECTOR THEREOF
Publication/Patent Number: US2020212609A1 Publication Date: 2020-07-02 Application Number: 16/533,785 Filing Date: 2019-08-07 Inventor: Huang, Mu-jung   Chen ying chung   Assignee: Tarng Yu Enterprise co., ltd.   IPC: H01R12/73 Abstract: A connector assembly and a jumper connector thereof are provided. The jumper connector includes a first jumper connector body case for being coupled to a first board edge connector, a second jumper connector body case for being coupled to a second board edge connector, and conductive terminals. The first and second jumper connector body cases are coupled to each other to form an internal receiving space for accommodating the conductive terminals, and the conductive terminals are movable to correspond in position to the first and second board edge connectors respectively. By such structural design, even if circuit boards incur problems like poor processing quality or position offset, the jumper connector according to the present invention can still effectively bridge and join the board edge connectors on the circuit boards, thereby desirably accomplishing electrical connection between multiple circuit boards on electronic equipment.
4 US2020020827A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020020827A1 Publication Date: 2020-01-16 Application Number: 16/505,331 Filing Date: 2019-07-08 Inventor: Ho, Hsin-ying   Chen ying chung   Lai, Lu-ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/08 Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.
5 US10686105B2
Optical package device
Publication/Patent Number: US10686105B2 Publication Date: 2020-06-16 Application Number: 16/011,555 Filing Date: 2018-06-18 Inventor: Wu, Mei-yi   Chen ying chung   Ho, Hsin-ying   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L33/56 Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.
6 US202020827A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US202020827A1 Publication Date: 2020-01-16 Application Number: 20/191,650 Filing Date: 2019-07-08 Inventor: Chen ying chung   Lai, Lu-ming   Ho, Hsin-ying   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/26 Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.
7 US2020194328A1
DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020194328A1 Publication Date: 2020-06-18 Application Number: 16/218,422 Filing Date: 2018-12-12 Inventor: Huang, Cheng-ling   Chen ying chung   Lai, Lu-ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/31 Abstract: A device package includes a first carrier, a lid and a chip. The first carrier includes a substrate having a first surface and a second surface opposite to the first surface. The substrate defines a through-hole extended from the first surface to the second surface. The through-hole includes a first opening proximal to the first surface, and a second opening proximal to the second surface. The first barrier dam is disposed on the first surface and surrounds the first opening of the through-hole. The second barrier dam is disposed on the second surface and surrounds the second opening of the through-hole. The lid is disposed on the first surface. The lid and the first carrier define a chamber. The chip is disposed on the first surface and in the chamber.
8 US2020144734A1
Cable Connector
Publication/Patent Number: US2020144734A1 Publication Date: 2020-05-07 Application Number: 16/672,238 Filing Date: 2019-11-01 Inventor: Huang, Mu-jung   Chen ying chung   Chen, Po-shen   Assignee: Tarng Yu Enterprise co., ltd.   IPC: H01R4/2433 Abstract: A cable connector includes a conductive terminal having a positioning wall and a piercing wall. The piercing wall can pierce an outer insulating sheath of a thin cable to be electrically connected to an inner core of the cable. The positioning wall can position the thin cable to reduce bending or dislocation of the thin cable caused by a force and thus minimize pulling of the core. This ensures electrical connection between the piercing wall and the core of the thin cable, and also prevents the core from being damaged or broken by any pulling force.
9 US2020235153A1
OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: US2020235153A1 Publication Date: 2020-07-23 Application Number: 16/254,389 Filing Date: 2019-01-22 Inventor: Hsu, Chia Yun   Chen ying chung   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L27/146 Abstract: An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1≥H3.
10 US10720751B2
Optical package structure, optical module, and method for manufacturing the same
Publication/Patent Number: US10720751B2 Publication Date: 2020-07-21 Application Number: 16/118,228 Filing Date: 2018-08-30 Inventor: Tsai, Yu-hsuan   Lai, Lu-ming   Chen ying chung   Tang, Shih-chieh   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: G02B6/02 Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
11 US10629787B2
Lid and an optical device package having the same
Publication/Patent Number: US10629787B2 Publication Date: 2020-04-21 Application Number: 15/466,502 Filing Date: 2017-03-22 Inventor: Ho, Hsin-ying   Chan, Hsun-wei   Chen ying chung   Lai, Lu-ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L33/58 Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.
12 US2020080841A1
OPTICAL MODULE AND METHOD OF MAKING THE SAME
Publication/Patent Number: US2020080841A1 Publication Date: 2020-03-12 Application Number: 16/683,117 Filing Date: 2019-11-13 Inventor: Chen ying chung   Chan, Hsun-wei   Lai, Lu-ming   Chen, Kuang-hsiung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: G01C3/08 Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
13 US2020328322A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020328322A1 Publication Date: 2020-10-15 Application Number: 16/384,847 Filing Date: 2019-04-15 Inventor: Tsai, Hsiang-chen   Lai, Lu-ming   Chan, Hsun-wei   Chen ying chung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L31/12 Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
14 KR102042917B1
ALTITUDE INCREASING CONNECTOR AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: KR102042917B1 Publication Date: 2019-11-08 Application Number: 20180026137 Filing Date: 2018-03-06 Inventor: Chen ying chung   Huang, Mu Jung   Assignee: TARNG YU ENTERPRISE CO., LTD.   IPC: H01R13/629 Abstract: 본 발명은 휴대용 전자 장치 내부에서 회로 기판과 센서 요소의 전기적 연결을 위한 고도 증가 커넥터 및 이를 제조하기 위한 방법으로, 상기 센서 요소의 정상 기능을 보장하기 위해, 상기 센서 요소가 고도 증가되고, 이로써 상기 센서 요소의 적절한 배치 고도가 조정되어, 휴대용 전자 장치의 수율이 증가된다. 고도 증가 커넥터는 복수의 도전 단자들을 가지고, 그 각각은 상기 센서 요소를 용접하기 위한 제1 용접 패드 및 상기 회로 기판을 용접하기 위한 제2 용접 패드를 가지고, 각각의 도전 단자의 상기 제1, 제2 용접 패드들 모두의 용접 표면들 사이의 거리는 고정되어, 상기 센서 요소와 상기 회로 기판 모두의 전기적 접합들 사이의 상대적 거리가 고정된다.
15 USD868700S1
Altitude increasing connector
Publication/Patent Number: USD868700S1 Publication Date: 2019-12-03 Application Number: 29/644,289 Filing Date: 2018-04-16 Inventor: Huang, Mu-jung   Chen ying chung   Assignee: TARNG YU ENTERPRISE CO., LTD.   IPC:
16 TWM578889U
Connector assembly
Publication/Patent Number: TWM578889U Publication Date: 2019-06-01 Application Number: 108200706 Filing Date: 2019-01-15 Inventor: Chen ying chung   Huang, Mu-jung   Assignee: TARNG YU ENTERPRISE CO., LTD.   IPC: H01R13/631
17 TWI674708B
Fabrication method of chip package structure semi-finished product, chip package structure module and chip package structure
Publication/Patent Number: TWI674708B Publication Date: 2019-10-11 Application Number: 107146556 Filing Date: 2018-12-21 Inventor: Chen ying chung   Huang, Mu-jung   Assignee: TARNG YU ENTERPRISE CO., LTD.   IPC: H01R12/70
18 US10508935B2
Optical module and manufacturing process thereof
Publication/Patent Number: US10508935B2 Publication Date: 2019-12-17 Application Number: 14/884,065 Filing Date: 2015-10-15 Inventor: Chang, Yung-yi   Chen ying chung   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: G01D5/34 Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.
19 US2019346305A1
OPTICAL SYSTEM AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2019346305A1 Publication Date: 2019-11-14 Application Number: 16/405,838 Filing Date: 2019-05-07 Inventor: Ho, Hsin-ying   Chen ying chung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: G01J1/02 Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.
20 TW201903999A
Semiconductor package device and method of manufacturing the same
Publication/Patent Number: TW201903999A Publication Date: 2019-01-16 Application Number: 107104230 Filing Date: 2018-02-07 Inventor: Chen ying chung   Huang, Cheng-ling   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L27/15 Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.