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1 | US2020365537A1 |
SEMICONDUCTOR DEVICES HAVING LANDING PADS
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Publication/Patent Number: US2020365537A1 | Publication Date: 2020-11-19 | Application Number: 16/674,056 | Filing Date: 2019-11-05 | Inventor： Choi, Bowo Kim, Youngtak Park, Sangjine Kim, Suji Shin, Jaeuk Lee, Hyunjung Cheon, Jihun | Assignee: Samsung Electronics Co., Ltd. | IPC: H01L23/00 | Abstract: A semiconductor device includes a landing pad, a first insulating pattern in contact with a lower portion of a side surface of the landing pad, a pad oxide layer having a lateral portion disposed on a portion of an upper surface of the landing pad and a vertical portion in contact with an upper portion of the side surface of the landing pad, a second insulating pattern in contact with an upper surface of the first insulating pattern and covering the first insulating pattern and the pad oxide layer, and a lower electrode that vertically passes through the second insulating pattern and is in contact with a portion of the upper surface and an upper portion of a side surface of the landing pad. | |||
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2 | US2020373174A1 |
APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE
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Publication/Patent Number: US2020373174A1 | Publication Date: 2020-11-26 | Application Number: 16/715,123 | Filing Date: 2019-12-16 | Inventor： Cheon, Jihun Lee, Hyun Jung Jeon, Pyojin Cho, Yong-jhin Lee, Wonjun | Assignee: Samsung Electronics Co., Ltd. | IPC: H01L21/67 | Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle. |
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