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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2020365537A1
SEMICONDUCTOR DEVICES HAVING LANDING PADS
Publication/Patent Number: US2020365537A1 Publication Date: 2020-11-19 Application Number: 16/674,056 Filing Date: 2019-11-05 Inventor: Choi, Bowo   Kim, Youngtak   Park, Sangjine   Kim, Suji   Shin, Jaeuk   Lee, Hyunjung   Cheon, Jihun   Assignee: Samsung Electronics Co., Ltd.   IPC: H01L23/00 Abstract: A semiconductor device includes a landing pad, a first insulating pattern in contact with a lower portion of a side surface of the landing pad, a pad oxide layer having a lateral portion disposed on a portion of an upper surface of the landing pad and a vertical portion in contact with an upper portion of the side surface of the landing pad, a second insulating pattern in contact with an upper surface of the first insulating pattern and covering the first insulating pattern and the pad oxide layer, and a lower electrode that vertically passes through the second insulating pattern and is in contact with a portion of the upper surface and an upper portion of a side surface of the landing pad.
2
US2020373174A1
APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication/Patent Number: US2020373174A1 Publication Date: 2020-11-26 Application Number: 16/715,123 Filing Date: 2019-12-16 Inventor: Cheon, Jihun   Lee, Hyun Jung   Jeon, Pyojin   Cho, Yong-jhin   Lee, Wonjun   Assignee: Samsung Electronics Co., Ltd.   IPC: H01L21/67 Abstract: An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.