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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
EP3761097A1
CAMERA MODULE
Publication/Patent Number: EP3761097A1 Publication Date: 2021-01-06 Application Number: 19760433.3 Filing Date: 2019-02-13 Inventor: Dobashi, Eiichiro   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B7/02 Abstract: The present technology relates to a camera module that is enabled to have a lower height. The camera module includes a supporting component that includes an opening through which light from a lens collecting the light passes, the supporting component supporting an optical component between the lens and an imaging element that performs photoelectric conversion of the light, the optical component being placed so as to cover the opening and being supported on a side of the supporting component closer to the imaging element. In addition, around the opening, there is disposed a sloped portion inclined in the thickness direction of the supporting component, and the supporting component is placed such that the slope of the sloped portion and the lens face each other. Furthermore, the camera module is configured such that a portion of the lens is placed closer to a first face of the supporting component beyond a second face of the supporting component, the portion facing the supporting component, the optical component being placed on the first face, and the second face being opposite to the first face. The present technology can be applied to, for example, a camera module that collects light to capture an image.
2
US2021096318A1
CAMERA MODULE
Publication/Patent Number: US2021096318A1 Publication Date: 2021-04-01 Application Number: 16/970,773 Filing Date: 2019-02-13 Inventor: Dobashi, Eiichiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G02B7/02 Abstract: The present technology relates to a camera module that is enabled to have a lower height. The camera module includes a supporting component that includes an opening through which light from a lens collecting the light passes, the supporting component supporting an optical component between the lens and an imaging element that performs photoelectric conversion of the light, the optical component being placed so as to cover the opening and being supported on a side of the supporting component closer to the imaging element. In addition, around the opening, there is disposed a sloped portion inclined in the thickness direction of the supporting component, and the supporting component is placed such that the slope of the sloped portion and the lens face each other. Furthermore, the camera module is configured such that a portion of the lens is placed closer to a first face of the supporting component beyond a second face of the supporting component, the portion facing the supporting component, the optical component being placed on the first face, and the second face being opposite to the first face. The present technology can be applied to, for example, a camera module that collects light to capture an image.
3
US2021055458A1
STACKED LENS STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2021055458A1 Publication Date: 2021-02-25 Application Number: 17/042,274 Filing Date: 2019-03-19 Inventor: Dobashi, Eiichiro   Maruyama, Shunsuke   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G02B3/00 Abstract: The present disclosure relates to a stacked lens structure and a method of manufacturing the same, and an electronic apparatus by which it is possible to realize miniaturization of a lens module. A stacked lens structure includes plural substrates with lens stacked on one another, the substrate with lens each having a lens disposed on inside of a through-hole formed in the substrate. In regard of side surfaces at side parts corresponding to sides of a rectangle surrounding the substrate with lens in plan view as viewed in an optical axis direction, a width and a shape are the same among all the substrates with lens, whereas in regard of side surfaces at opposite angle parts corresponding to opposite angles of the rectangle, the width or shape differs between at least two substrates with lens. The present technology is applicable, for example, to a lens module or the like.
4
US10270946B2
Solid state imaging device, camera module and electronic device
Publication/Patent Number: US10270946B2 Publication Date: 2019-04-23 Application Number: 14/775,934 Filing Date: 2014-03-12 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state imaging device. A rib is arranged on a frame part to be joined to a board on which an image sensor is mounted, the rib abutting on the board at an abutting position next to a periphery of the image sensor.
5
JP2019148698A
CAMERA MODULE
Publication/Patent Number: JP2019148698A Publication Date: 2019-09-05 Application Number: 2018033206 Filing Date: 2018-02-27 Inventor: Dobashi, Eiichiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G03B17/02 Abstract: To provide a camera module which can reduce the height thereof.SOLUTION: A camera module 110 comprises: a support component 132 having an opening part through which light from a lens 121 condensing light passes and disposed so as to cover the opening part between the lens 121 and an imaging element 136 for photoelectrically converting light; and an IRCF 135 cutting infrared ray. A gradient part 134 inclined in a thickness direction is provided on the opposite side of the lens 121 of the support component 132 in order to prevent ghost and flare.SELECTED DRAWING: Figure 2
6
US10462339B2
Imaging apparatus and imaging system having press bent infrared cut filter holder
Publication/Patent Number: US10462339B2 Publication Date: 2019-10-29 Application Number: 16/414,470 Filing Date: 2019-05-16 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
7
US2019273851A1
IMAGING APPARATUS AND IMAGING SYSTEM HAVING PRESS BENT INFRARED CUT FILTER HOLDER
Publication/Patent Number: US2019273851A1 Publication Date: 2019-09-05 Application Number: 16/414,470 Filing Date: 2019-05-16 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
8
US10341542B2
Light shielding members for solid state image capturing apparatus, camera module and electronic device
Publication/Patent Number: US10341542B2 Publication Date: 2019-07-02 Application Number: 15/435,118 Filing Date: 2017-02-16 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
9
WO2019167607A1
CAMERA MODULE
Publication/Patent Number: WO2019167607A1 Publication Date: 2019-09-06 Application Number: 2019004932 Filing Date: 2019-02-13 Inventor: Dobashi, Eiichiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/225 Abstract: The present technology relates to a camera module configured to enable a reduction in the height of the camera module. The camera module has an opening through which light from a light-condensing lens passes, and comprises a support component that supports, on an imaging element side, an optical component which is disposed so as to cover the opening between the lens and an imaging element that photoelectrically converts the light. A gradient section that is inclined in the thickness direction of the support component is provided around the opening, and the support component is disposed so that the inclination of the gradient section and the lens oppose each other. A portion of the lens that opposes the support component is configured to be disposed more toward the side of a first surface of the support component, on which the optical component is disposed, than a second surface opposite to the first surface. The present technology can be applied to camera modules that condense light to capture an image.
10
WO2019193965A1
LAMINATED LENS STRUCTURE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
Publication/Patent Number: WO2019193965A1 Publication Date: 2019-10-10 Application Number: 2019011340 Filing Date: 2019-03-19 Inventor: Dobashi, Eiichiro   Maruyama, Shunsuke   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/225 Abstract: The present invention relates to a laminated lens structure for making it possible to reduce the size of a lens module, a method for manufacturing the laminated lens structure, and an electronic device. Layered in the laminated lens structure are a plurality of lens-equipped substrates in which a lens is disposed inside a through hole formed in a substrate. Regarding lateral surfaces of side portions corresponding to sides of a rectangle surrounding the lens-equipped substrates in plan view from the optical axis direction, the width and shape thereof is the same in all the lens-equipped substrates, and regarding lateral surfaces of corner portions corresponding to corners of the rectangle, the width or shape differs between at least two lens-equipped substrates. The present invention is applicable to a lens module or the like, for example.
11
JP2019184719A
LAMINATED LENS STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
Publication/Patent Number: JP2019184719A Publication Date: 2019-10-24 Application Number: 2018072849 Filing Date: 2018-04-05 Inventor: Maruyama, Shunsuke   Dobashi, Eiichiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: H04N5/225 Abstract: To make it possible to achieve miniaturization of a lens module.SOLUTION: In a laminated lens structure, a plurality of lens-fitted substrates are laminated in which a lens is arranged inside a through-hole formed in a substrate. Regarding a side surface of a side portion corresponding to a side of a rectangle surrounding the lens-fitted substrate in a plan view viewed from an optical axis direction, a width and a shape of the whole lens-fitted substrate are the same. Regarding a side surface of a diagonal portion corresponding to a diagonal of the rectangle, the width or the shape is different with at least two lens-fitted substrates. The present technique is applicable, for example, to a lens module.SELECTED DRAWING: Figure 88
12
US10181446B2
Camera module, imaging apparatus, and electronic instrument
Publication/Patent Number: US10181446B2 Publication Date: 2019-01-15 Application Number: 15/527,780 Filing Date: 2015-11-13 Inventor: Dobashi, Eiichiro   Wakabayashi, Takahiro   Assignee: SONY CORPORATION   IPC: H01L27/14 Abstract: The present technology relates to a camera module capable of reducing the number of steps in the manufacturing process and reducing a black spot failure, a method for manufacturing the camera module, an imaging apparatus, and an electronic instrument. A frame and the rigid flexible substrate are adhered to each other by adhesive formed of thermosetting resin applied on an abutment surface excluding a portion of a range including a bonding section with the FPC drawer unit, thereby forming a vent hole in a site where adhesive has not been applied. At this time, the air of the space between the frame and the rigid flexible substrate is expanded by the heat and discharged from the vent hole. Subsequently, after adhesion is performed with thermosetting resin, reinforcement resin that reinforces the bonding section between the rigid flexible substrate and the FPC drawer unit or that reinforces the bonding section between the rigid flexible substrate and the frame is applied so as to close a portion of the range on which the adhesive has not been applied. This enables omitting the process of closing the vent hole. The present technology can be applied to a camera module.
13
US10356295B2
Imaging device, manufacturing device, and manufacturing method
Publication/Patent Number: US10356295B2 Publication Date: 2019-07-16 Application Number: 16/113,802 Filing Date: 2018-08-27 Inventor: Dobashi, Eiichiro   Mochinaga, Shuichi   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.
14
US10021283B2
Light shielding members for solid state image capturing apparatus, camera module and electronic device
Publication/Patent Number: US10021283B2 Publication Date: 2018-07-10 Application Number: 15/384,645 Filing Date: 2016-12-20 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: G02B5/00 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
15
US2018367716A1
IMAGING DEVICE, MANUFACTURING DEVICE, AND MANUFACTURING METHOD
Publication/Patent Number: US2018367716A1 Publication Date: 2018-12-20 Application Number: 16/113,802 Filing Date: 2018-08-27 Inventor: Dobashi, Eiichiro   Mochinaga, Shuichi   Assignee: SONY CORPORATION   IPC: H04N5/225 Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.
16
US10091403B2
Imaging device, manufacturing device, and manufacturing method
Publication/Patent Number: US10091403B2 Publication Date: 2018-10-02 Application Number: 15/323,941 Filing Date: 2015-07-01 Inventor: Dobashi, Eiichiro   Mochinaga, Shuichi   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.
17
US2017104904A1
SOLID STATE IMAGE CAPTURING APPARATUS, CAMERA MODULE AND ELECTRONIC DEVICE
Publication/Patent Number: US2017104904A1 Publication Date: 2017-04-13 Application Number: 15/384,645 Filing Date: 2016-12-20 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
18
US2017163859A1
SOLID STATE IMAGE CAPTURING APPARATUS, CAMERA MODULE AND ELECTRONIC DEVICE
Publication/Patent Number: US2017163859A1 Publication Date: 2017-06-08 Application Number: 15/435,118 Filing Date: 2017-02-16 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
19
US9554025B2
Solid state image capturing apparatus, camera module and electronic device including anti-reflection plate
Publication/Patent Number: US9554025B2 Publication Date: 2017-01-24 Application Number: 14/539,568 Filing Date: 2014-11-12 Inventor: Dobashi, Eiichiro   Assignee: Sony Corporation   IPC: H04N5/225 Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.
20
US2017180613A1
IMAGING DEVICE, MANUFACTURING DEVICE, AND MANUFACTURING METHOD
Publication/Patent Number: US2017180613A1 Publication Date: 2017-06-22 Application Number: 15/323,941 Filing Date: 2015-07-01 Inventor: Dobashi, Eiichiro   Mochinaga, Shuichi   Assignee: SONY CORPORATION   IPC: H04N5/225 Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.
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