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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US10976200B2
Optical sensing device and method for manufacturing an optical sensing device
Publication/Patent Number: US10976200B2 Publication Date: 2021-04-13 Application Number: 16/651,194 Filing Date: 2018-08-30 Inventor: Enichlmair, Hubert   Eilmsteiner, Gerhard   Assignee: AMS AG   IPC: G01J3/02 Abstract: An optical sensing device comprises a photodetector array comprising at least one first photodetector and at least one second photodetector, the photodetector array being arranged on a semiconductor substrate. The optical sensing device further comprises a filter stack arranged on the substrate and covering the photodetector array. The filter stack comprises at least two first lower dielectric mirrors and at least two second lower dielectric mirrors, where a first and a second lower mirror are arranged above the first photodetector and a first and a second lower mirror are arranged above the second photodetector, and where the first lower mirrors have a different thickness in vertical direction which is perpendicular to the main plane of extension of the substrate than the second lower mirrors. The filter stack further comprises a spacer stack arranged on the first and second lower mirrors, and an upper dielectric mirror arranged on the spacer stack and covering the photodetector array. Furthermore, a method for manufacturing an optical sensing device is provided.
2
EP2802009B1
Integrated imaging device for infrared radiation and method of production
Publication/Patent Number: EP2802009B1 Publication Date: 2021-03-24 Application Number: 13167095.2 Filing Date: 2013-05-08 Inventor: Enichlmair, Hubert   Minixhofer, Rainer   Schrems, Martin   Assignee: ams AG   IPC: H01L27/146
3
EP2889901B1
Semiconductor device with through-substrate via and corresponding method
Publication/Patent Number: EP2889901B1 Publication Date: 2021-02-03 Application Number: 13199683.7 Filing Date: 2013-12-27 Inventor: Schrank, Franz   Carniello, Sara   Enichlmair, Hubert   Kraft, Jochen   Löffler, Bernhard   Holzhaider, Rainer   Assignee: ams AG   IPC: H01L21/768
4
EP3032583B1
Integrated optical sensor and method of producing an integrated optical sensor
Publication/Patent Number: EP3032583B1 Publication Date: 2020-03-04 Application Number: 14196808.1 Filing Date: 2014-12-08 Inventor: Enichlmair, Hubert   Assignee: ams AG   IPC: H01L27/144
5
US2020271516A1
OPTICAL SENSING DEVICE AND METHOD FOR MANUFACTURING AN OPTICAL SENSING DEVICE
Publication/Patent Number: US2020271516A1 Publication Date: 2020-08-27 Application Number: 16/651,194 Filing Date: 2018-08-30 Inventor: Enichlmair, Hubert   Eilmsteiner, Gerhard   Assignee: ams AG   IPC: G01J3/28 Abstract: An optical sensing device comprises a photodetector array comprising at least one first photodetector and at least one second photodetector, the photodetector array being arranged on a semiconductor substrate. The optical sensing device further comprises a filter stack arranged on the substrate and covering the photodetector array. The filter stack comprises at least two first lower dielectric mirrors and at least two second lower dielectric mirrors, where a first and a second lower mirror are arranged above the first photodetector and a first and a second lower mirror are arranged above the second photodetector, and where the first lower mirrors have a different thickness in vertical direction which is perpendicular to the main plane of extension of the substrate than the second lower mirrors. The filter stack further comprises a spacer stack arranged on the first and second lower mirrors, and an upper dielectric mirror arranged on the spacer stack and covering the photodetector array. Furthermore, a method for manufacturing an optical sensing device is provided.
6
EP2661034B1
Electric circuit arrangement for galvanic isolated communication
Publication/Patent Number: EP2661034B1 Publication Date: 2020-03-11 Application Number: 12166877.6 Filing Date: 2012-05-04 Inventor: Vinau, Jose   Poirier, Sébastien   Enichlmair, Hubert   Ele, Vijay   Ranganathan, Rohit   Brandl, Manfred   Assignee: ams AG   IPC: H04L25/493
7
EP3724628A1
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
Publication/Patent Number: EP3724628A1 Publication Date: 2020-10-21 Application Number: 18825621.8 Filing Date: 2018-12-13 Inventor: Etschmaier, Harald   Roehrer, Georg   Singulani, Anderson   Enichlmair, Hubert   Park, Jong-mun   Bergmann, Alexander   Maierhofer, Paul   Assignee: ams International AG   Technische Universität Graz   IPC: G01N1/22
8
US2020400544A1
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
Publication/Patent Number: US2020400544A1 Publication Date: 2020-12-24 Application Number: 16/772,457 Filing Date: 2018-12-13 Inventor: Etschmaier, Harald   Roehrer, Georg   Singulani, Anderson   Enichlmair, Hubert   Park, Jong-mun   Bergmann, Alexander   Maierhofer, Paul   Assignee: ams International AG   Technische Universität Graz   IPC: G01N15/06 Abstract: An apparatus for sensing particulate matter in a fluid includes a substrate; and an integrated circuit electrically connected to the substrate, the integrated circuit including a photodetector. The apparatus includes a filter assembly including a particle filter aligned with the photodetector, and a filter housing for the particle filter, the filter housing defining a flow path for fluid through the particle filter. The apparatus includes a light source electrically connected to the substrate and positioned to illuminate the particle filter.
9
US10453972B2
Integrated optical sensor and method of producing an integrated optical sensor
Publication/Patent Number: US10453972B2 Publication Date: 2019-10-22 Application Number: 15/533,989 Filing Date: 2015-12-04 Inventor: Enichlmair, Hubert   Assignee: ams AG   IPC: H01L31/0232 Abstract: An integrated optical sensor comprises a semiconductor substrate (1), an integrated circuit (2), a dielectric layer (6), a wiring (4), a structured filter layer (7) and a diffuser (10). The semiconductor substrate (1) has a main surface (11) and the integrated circuit (2) is arranged in the substrate (1) at or near the main surface (11). Furthermore, the integrated circuit (2) comprises at least one light sensitive component (3). The dielectric layer (6) comprises at least one compound of the semiconductor material. The dielectric layer (6) is arranged on or above the main surface (11). The wiring (4) is arranged in the dielectric layer (6) and provides an electrical connection to the integrated circuit (2), i.e. the wiring is connected to the integrated circuit (2). The structured filter layer (7) is arranged on the dielectric layer (6) and faces the at least one light sensitive component (3), i.e. the diffusor (10) is positioned over the structured filter layer (7). In particular, the structured filter layer (7) is adapted for diffused incident light. The diffuser (10) is arranged on the structured filter layer (7).
10
EP3462148A1
OPTICAL SENSING DEVICE AND METHOD FOR MANUFACTURING AN OPTICAL SENSING DEVICE
Publication/Patent Number: EP3462148A1 Publication Date: 2019-04-03 Application Number: 17193871.5 Filing Date: 2017-09-28 Inventor: Enichlmair, Hubert   Eilmsteiner, Gerhard   Assignee: ams AG   IPC: G01J3/26 Abstract: An optical sensing device (10) comprises a photodetector array (11) comprising at least one first photodetector (12) and at least one second photodetector (13), the photodetector array (11) being arranged on a semiconductor substrate (14). The optical sensing device (10) further comprises a filter stack (15) arranged on the substrate (14) and covering the photodetector array (11). The filter stack (15) comprises at least two first lower dielectric mirrors (16) and at least two second lower dielectric mirrors (17), where a first and a second lower mirror (16, 17) are arranged above the first photodetector (12) and a first and a second lower mirror (16, 17) are arranged above the second photodetector (13), and where the first lower mirrors (16) have a different thickness in vertical direction (z) which is perpendicular to the main plane of extension of the substrate (14) than the second lower mirrors (17). The filter stack (15) further comprises a spacer stack (18) arranged on the first and second lower mirrors (16, 17), and an upper dielectric mirror (19) arranged on the spacer stack (18) and covering the photodetector array (11). Furthermore, a method for manufacturing an optical sensing device (10) is provided.
11
KR102053561B1
광 검출 장치 및 광 검출 장치를 제조하는 방법
Publication/Patent Number: KR102053561B1 Publication Date: 2019-12-06 Application Number: 20187016060 Filing Date: 2016-11-29 Inventor: Eilmsteiner, Gerhard   Enichlmair, Hubert   Assignee: AMS AG   IPC: G01J3/26 Abstract: 광 검출 장치는 제1 및 제2 광 검출기(S1, S2)를 지지하는 기판(S1) 및 기판 상에 배치되고 광 검출기 어레이를 덮는 필터 스택을 포함한다. 필터 스택은 대역 통과 필터(BP), 대역 통과 필터(BP) 상에 배치된 디커플링층(DL) 및 디커플링층(DL) 상에 배치된 하부 유전체 거울(LM)을 포함한다. 필터 스택은 제1 유전체 재료를 포함하고 광 검출기 어레이를 덮는 하부 유전체 거울(LM) 상에 배치된 주 스페이서층(SP)을 갖는 스페이서 스택을 포함한다. 스페이서 스택은 제1 유전체 재료를 포함하는 제1 스페이서층(S1)을 포함하며, 제1 스페이서층(S1)의 제1 세그먼트는 주 스페이서층(SP) 상에 배치되고 제2 광 검출기를 덮으며, 제1 광 검출기(P1)를 덮지 않는다. 필터 스택은 스페이서 스택 상에 배치된 상부 유전체 거울(UM)를 포함한다.
12
WO2019063238A1
OPTICAL SENSING DEVICE AND METHOD FOR MANUFACTURING AN OPTICAL SENSING DEVICE
Publication/Patent Number: WO2019063238A1 Publication Date: 2019-04-04 Application Number: 2018073374 Filing Date: 2018-08-30 Inventor: Enichlmair, Hubert   Eilmsteiner, Gerhard   Assignee: AMS AG   IPC: G01J3/26 Abstract: An optical sensing device (10) comprises a photodetector array (11) comprising at least one first photodetector (12) and at least one second photodetector (13), the photodetector array (11) being arranged on a semiconductor substrate (14). The optical sensing device (10) further comprises a filter stack (15) arranged on the substrate (14) and covering the photodetector array (11). The filter stack (15) comprises at least two first lower dielectric mirrors (16) and at least two second lower dielectric mirrors (17), where a first and a second lower mirror (16, 17) are arranged above the first photodetector (12) and a first and a second lower mirror (16, 7) are arranged above the second photodetector (13), and where the first lower mirrors (16) have a different thickness in vertical direction (z) which is perpendicular to the main plane of extension of the substrate (14) than the second lower mirrors (17). The filter stack (15) further comprises a spacer stack (18) arranged on the first and second lower mirrors (16, 17), and an upper dielectric mirror (19) arranged on the spacer stack (18) and covering the photodetector array (11). Furthermore, a method for manufacturing an optical sensing device (10) is provided.
13
US2019237500A1
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
Publication/Patent Number: US2019237500A1 Publication Date: 2019-08-01 Application Number: 16/312,145 Filing Date: 2017-06-02 Inventor: Manninger, Mario   Bodner, Thomas   Toschkoff, Gregor   Schrems, Martin   Enichlmair, Hubert   Assignee: ams AG   IPC: H01L27/146 Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer.
14
EP3261122B1
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
Publication/Patent Number: EP3261122B1 Publication Date: 2019-10-30 Application Number: 16176222.4 Filing Date: 2016-06-24 Inventor: Enichlmair, Hubert   Schrems, Martin   Toschkoff, Gregor   Bodner, Thomas   Manninger, Mario   Assignee: ams AG   IPC: H01L27/146
15
US10468541B2
Semiconductor device with through-substrate via and corresponding method of manufacture
Publication/Patent Number: US10468541B2 Publication Date: 2019-11-05 Application Number: 15/107,901 Filing Date: 2014-12-12 Inventor: Schrank, Franz   Carniello, Sara   Enichlmair, Hubert   Kraft, Jochen   Loeffler, Bernhard   Holzhaider, Rainer   Assignee: ams AG   IPC: H01L31/0224 Abstract: A dielectric layer (2) is arranged on the main surface (10) of a semiconductor substrate (1), and a passivation layer (6) is arranged on the dielectric layer. A metal layer (3) is embedded in the dielectric layer above an opening (12) in the substrate, and a metallization (14) is arranged in the opening. The metallization contacts the metal layer and forms a through-substrate via to a rear surface (11) of the substrate. A layer or layer sequence (7, 8, 9) comprising at least one further layer is arranged on the passivation layer above the opening. In this way the bottom of the through-substrate via is stabilized. A plug (17) may additionally be arranged in the opening without filling the opening.
16
WO2019115690A1
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
Publication/Patent Number: WO2019115690A1 Publication Date: 2019-06-20 Application Number: 2018084759 Filing Date: 2018-12-13 Inventor: Enichlmair, Hubert   Bergmann, Alexander   Roehrer, Georg   Singulani, Anderson   Maierhofer, Paul   Etschmaier, Harald   Park, Jong-mun   Assignee: TECHNISCHE UNIVERSITäT GRAZ   AMS INTERNATIONAL AG   IPC: G01N15/06 Abstract: An apparatus for sensing particulate matter in a fluid includes a substrate; and an integrated circuit electrically connected to the substrate, the integrated circuit including a photodetector. The apparatus includes a filter assembly including a particle filter aligned with the photodetector, and a filter housing for the particle filter, the filter housing defining a flow path for fluid through the particle filter. The apparatus includes a light source electrically connected to the substrate and positioned to illuminate the particle filter.
17
US2018337291A1
INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING AN INTEGRATED OPTICAL SENSOR
Publication/Patent Number: US2018337291A1 Publication Date: 2018-11-22 Application Number: 15/533,989 Filing Date: 2015-12-04 Inventor: Enichlmair, Hubert   Assignee: ams AG   IPC: H01L31/0216 Abstract: An integrated optical sensor comprises a semiconductor substrate (1), an integrated circuit (2), a dielectric layer (6), a wiring (4), a structured filter layer (7) and a diffuser (10). The semiconductor substrate (1) has a main surface (11) and the integrated circuit (2) is arranged in the substrate (1) at or near the main surface (11). Furthermore, the integrated circuit (2) comprises at least one light sensitive component (3). The dielectric layer (6) comprises at least one compound of the semiconductor material. The dielectric layer (6) is arranged on or above the main surface (11). The wiring (4) is arranged in the dielectric layer (6) and provides an electrical connection to the integrated circuit (2), i.e. the wiring is connected to the integrated circuit (2). The structured filter layer (7) is arranged on the dielectric layer (6) and faces the at least one light sensitive component (3), i.e. the diffusor (10) is positioned over the structured filter layer (7). In particular, the structured filter layer (7) is adapted for diffused incident light. The diffuser (10) is arranged on the structured filter layer (7).
18
EP3404379A1
OPTICAL DEVICE FOR ANGLE MEASUREMENTS
Publication/Patent Number: EP3404379A1 Publication Date: 2018-11-21 Application Number: 17171125.2 Filing Date: 2017-05-15 Inventor: Enichlmair, Hubert   Assignee: AMS AG   IPC: G01J1/04 Abstract: The device comprises a substrate (1) of semiconductor material with a main surface (10), a photodetector (4) and a further photodetector (5) arranged in the substrate at the main surface, a filter (6) arranged above the main surface (10) above the photodetector (4), and a further filter (7) arranged above the main surface (10) above the further photodetector (5). The filter (6) is a colour filter (16), and the further filter (7) includes an interference filter (15) and a further colour filter (17).
19
EP2899760B1
Semiconductor device for optical applications and method of producing such a semiconductor device
Publication/Patent Number: EP2899760B1 Publication Date: 2018-08-29 Application Number: 14152688.9 Filing Date: 2014-01-27 Inventor: Enichlmair, Hubert   Schrank, Franz   Assignee: ams AG   IPC: H01L31/0203 Abstract: A sensor (2) is arranged at a main surface (10) of a semiconductor substrate (1), and a filter (3) is arranged above the sensor. A through-substrate via (4) penetrates the substrate outside the region of the sensor. A semiconductor body is applied above the main surface and then partially removed at least in an area above the sensor. A portion of the semiconductor body remains above the through-substrate via as a frame layer (5). The filter is on a level with the frame layer.
20
US10084004B2
Semiconductor device for optical applications and method of producing such a semiconductor device
Publication/Patent Number: US10084004B2 Publication Date: 2018-09-25 Application Number: 15/114,387 Filing Date: 2015-01-14 Inventor: Enichlmair, Hubert   Schrank, Franz   Assignee: AMS AG   IPC: H01L31/0232 Abstract: A sensor (2) is arranged at a main surface (10) of a semiconductor substrate (1), and a filter (3) is arranged above the sensor. A through-substrate via (4) penetrates the substrate outside the region of the sensor. A semiconductor body is applied above the main surface and then partially removed at least in an area above the sensor. A portion of the semiconductor body remains above the through-substrate via as a frame layer (5). The filter is on a level with the frame layer.
Total 6 pages