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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
EP3255456B1
OPTICAL SENSOR ARRANGEMENT AND METHOD FOR MANUFACTURING AN OPTICAL SENSOR ARRANGEMENT
Publication/Patent Number: EP3255456B1 Publication Date: 2021-01-06 Application Number: 16173353.0 Filing Date: 2016-06-07 Inventor: Etschmaier, Harald   Minixhofer, Rainer   Röhrer, Georg   Assignee: ams AG   IPC: G01S17/10
2
US10723615B2
Sensor assembly and arrangement and method for manufacturing a sensor assembly
Publication/Patent Number: US10723615B2 Publication Date: 2020-07-28 Application Number: 16/098,230 Filing Date: 2017-05-05 Inventor: Etschmaier, Harald   Singulani, Anderson   Assignee: Sciosense B.V.   IPC: B81B7/00 Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.
3
US2020333442A1
METHOD FOR FABRICATING A PLURALITY OF TIME-OF-FLIGHT SENSOR DEVICES
Publication/Patent Number: US2020333442A1 Publication Date: 2020-10-22 Application Number: 16/754,335 Filing Date: 2018-10-10 Inventor: Etschmaier, Harald   Bodner, Thomas   Assignee: ams AG   IPC: G01S7/481 Abstract: A method for fabricating a plurality of Time-of-Flight sensor devices (1) comprises a step of providing a wafer (100) including a plurality of wafer portions (110) for a respective one of the Time-of-Flight sensor devices (1), wherein each of the wafer portions (110) includes a first light detecting area (10) and a second light detecting area (20) and a respective light emitter device (30). The respective light emitter device (30) and the respective first light detecting area (10) is encapsulated by a first volume (40) of a light transparent material (130), and the respective second light detecting area (20) is encapsulated by a second volume (50) of the light transparent material (130). Before singulation of the devices (1), an opaque material (60) is placed on the wafer portions (110) in a space (120) between the respective first and second volume (40, 50) of the light transparent material (130).
4
US2020225085A1
OPTICAL SENSOR PACKAGE AND METHOD OF PRODUCING SAME
Publication/Patent Number: US2020225085A1 Publication Date: 2020-07-16 Application Number: 16/633,509 Filing Date: 2018-07-18 Inventor: Etschmaier, Harald   Schmidegg, Klaus   Assignee: ams AG   IPC: G01J1/04 Abstract: The optical sensor package comprises an optical sensor device with a sensor element arranged inside a housing comprising a cap. A diffuser is arranged in an aperture of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser.
5
EP3724634A1
INTEGRATED PARTICULATE MATTER SENSOR SYSTEMS
Publication/Patent Number: EP3724634A1 Publication Date: 2020-10-21 Application Number: 18825620.0 Filing Date: 2018-12-13 Inventor: Etschmaier, Harald   Roehrer, Georg   Singulani, Anderson   Bergmann, Alexander   Assignee: ams International AG   Technische Universität Graz   IPC: G01N15/06
6
US10741035B2
Integrated smoke detection device
Publication/Patent Number: US10741035B2 Publication Date: 2020-08-11 Application Number: 16/345,828 Filing Date: 2017-10-19 Inventor: Etschmaier, Harald   Hiramatsu, Nobuyoshi   Synooka, Olesia   Assignee: ams AG   IPC: G08B17/107 Abstract: The integrated smoke detection device comprises a carrier (1), a light source (2) arranged on or above the carrier, a light receiver (3) arranged on or above the carrier at a distance from the light source, and a polarizing member (7) arranged on or above the carrier, the light source emitting radiation (a, b) into the polarizing member. The polarizing member is configured to have a boundary surface (11) that linearly polarizes a reflected portion (d) of the radiation emitted by the light source, and an exit surface (12) that allows the reflected portion (d) to exit the polarizing member.
7
EP3620813A1
OPTICAL SENSOR ARRANGEMENT, DEVICE AND METHOD OF MANUFACTURING AN OPTICAL SENSOR ARRANGEMENT
Publication/Patent Number: EP3620813A1 Publication Date: 2020-03-11 Application Number: 18192541.3 Filing Date: 2018-09-04 Inventor: Etschmaier, Harald   Schmidegg, Klaus   Eilertsen, James   Assignee: ams AG   IPC: G01S7/481 Abstract: A method of manufacturing an optical sensor arrangement comprising the steps of providing a substrate (10) having a surface (11) and providing an integrated circuit (20) comprising an optical detector (21) arranged for detecting light of a desired wavelength range. The integrated circuit (20) and a light emitter (30) are mounted onto the surface (11), wherein the light emitter (30) is arranged for emitting light in the desired wavelength range. The integrated circuit (20) and the light emitter (30) are electrically connected to each other and to the substrate (10). A light barrier (40) is formed between the optical detector (21) and the light emitter (30) by dispensing a first optically opaque material along a profile (24) of the integrated circuit (20). A mold layer (50) is formed by at least partly encapsulating the substrate (10), the integrated circuit (20) and the light emitter (30) with an optically transparent material. A casing (60), made from a second optically opaque material, is mounted on the light barrier (40) and thereby encloses a hollow space between the casing (60) and the mold layer (50).
8
US2020393351A1
INTEGRATED PARTICULATE MATTER SENSOR SYSTEMS
Publication/Patent Number: US2020393351A1 Publication Date: 2020-12-17 Application Number: 16/772,453 Filing Date: 2018-12-13 Inventor: Etschmaier, Harald   Roehrer, Georg   Singulani, Anderson   Bergmann, Alexander   Assignee: ams International AG   Technische Universität Graz   IPC: G01N15/06 Abstract: A particulate matter sensor system for sensing particulate matter in a fluid includes a substrate and a cover disposed on the substrate. The cover defines at least a portion of a flow path through the microfluidic system. The sensor system includes a particulate matter sensor disposed in an interior space between the cover and the substrate. The particulate matter sensor includes an integrated sensor device electrically connected to the substrate. The flow path is defined through the particulate matter sensor. The sensor system includes a fluid circulation device disposed in the interior space between the cover and the substrate and configured to cause fluid to flow along the flow path through the microfluidic system.
9
US2020184790A1
INTEGRATED SMOKE DETECTION DEVICE
Publication/Patent Number: US2020184790A1 Publication Date: 2020-06-11 Application Number: 16/345,828 Filing Date: 2017-10-19 Inventor: Etschmaier, Harald   Hiramatsu, Nobuyoshi   Synooka, Olesia   Assignee: ams AG   IPC: G08B17/107 Abstract: The integrated smoke detection device comprises a carrier (1), a light source (2) arranged on or above the carrier, a light receiver (3) arranged on or above the carrier at a distance from the light source, and a polarizing member (7) arranged on or above the carrier, the light source emitting radiation (a, b) into the polarizing member. The polarizing member is configured to have a boundary surface (11) that linearly polarizes a reflected portion (d) of the radiation emitted by the light source, and an exit surface (12) that allows the reflected portion (d) to exit the polarizing member.
10
US10734534B2
Method of producing an optical sensor at wafer-level and optical sensor
Publication/Patent Number: US10734534B2 Publication Date: 2020-08-04 Application Number: 15/746,342 Filing Date: 2016-07-22 Inventor: Etschmaier, Harald   Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Assignee: ams AG   IPC: H01L31/0203 Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.
11
US10847664B2
Optical package and method of producing an optical package
Publication/Patent Number: US10847664B2 Publication Date: 2020-11-24 Application Number: 15/773,539 Filing Date: 2016-11-04 Inventor: Mehrl, David   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Schrank, Franz   Assignee: AMS AG   IPC: H01L31/0232 Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.
12
WO2020027721A1
PACKAGE INCLUDING PORTIONS OF A LEAD FRAME AS ELECTRICALLY CONDUCTIVE LEADS
Publication/Patent Number: WO2020027721A1 Publication Date: 2020-02-06 Application Number: 2019050342 Filing Date: 2019-07-12 Inventor: Tak, Coen   Kilburn, Ian   Balimann, Martin Lukas   Umali, Arnold   Etschmaier, Harald   Assignee: AMS SENSORS ASIA PTE. LTD.   IPC: H01S5/022 Abstract: The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package.
13
EP3724628A1
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
Publication/Patent Number: EP3724628A1 Publication Date: 2020-10-21 Application Number: 18825621.8 Filing Date: 2018-12-13 Inventor: Etschmaier, Harald   Roehrer, Georg   Singulani, Anderson   Enichlmair, Hubert   Park, Jong-mun   Bergmann, Alexander   Maierhofer, Paul   Assignee: ams International AG   Technische Universität Graz   IPC: G01N1/22
14
US2020400544A1
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
Publication/Patent Number: US2020400544A1 Publication Date: 2020-12-24 Application Number: 16/772,457 Filing Date: 2018-12-13 Inventor: Etschmaier, Harald   Roehrer, Georg   Singulani, Anderson   Enichlmair, Hubert   Park, Jong-mun   Bergmann, Alexander   Maierhofer, Paul   Assignee: ams International AG   Technische Universität Graz   IPC: G01N15/06 Abstract: An apparatus for sensing particulate matter in a fluid includes a substrate; and an integrated circuit electrically connected to the substrate, the integrated circuit including a photodetector. The apparatus includes a filter assembly including a particle filter aligned with the photodetector, and a filter housing for the particle filter, the filter housing defining a flow path for fluid through the particle filter. The apparatus includes a light source electrically connected to the substrate and positioned to illuminate the particle filter.
15
US10175270B2
Integrated current sensor system and method for producing an integrated current sensor system
Publication/Patent Number: US10175270B2 Publication Date: 2019-01-08 Application Number: 15/116,496 Filing Date: 2015-01-16 Inventor: Etschmaier, Harald   Assignee: ams AG   IPC: G01R15/20 Abstract: An integrated current sensor system has a printed circuit board with a magnetic field sensor with a sensor interface. The printed circuit board has a first side on which, isolated from the printed circuit board, a first current conductor is arranged with a longitudinal edge of a portion of the first current conductor being proximate to a sensitive area of sensor. The circuit board has a second side on which a second current conductor is, isolated from the printed circuit board, arranged, wherein a longitudinal edge of a portion of the second current conductor is arranged proximate to the sensitive area. The first and the second current conductor are electrically connected with at least one conductive via.
16
EP2905626B1
Integrated current sensor system and method for producing an integrated current sensor system
Publication/Patent Number: EP2905626B1 Publication Date: 2019-09-11 Application Number: 14154008.8 Filing Date: 2014-02-05 Inventor: Etschmaier, Harald   Assignee: ams AG   IPC: G01R15/14
17
TW201918694A
Optical sensor package and method of producing same
Publication/Patent Number: TW201918694A Publication Date: 2019-05-16 Application Number: 107124644 Filing Date: 2018-07-17 Inventor: Schmidegg, Klaus   Etschmaier, Harald   Assignee: AMS AG   IPC: G01J3/02 Abstract: The optical sensor package comprises an optical sensor device (4) with a sensor element (5) arranged inside a housing (1, 2) comprising a cap (2). A diffuser (3) is arranged in an aperture (11) of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser.
18
WO2019072927A1
METHOD FOR FABRICATING A PLURALITY OF TIME-OF-FLIGHT SENSOR DEVICES
Publication/Patent Number: WO2019072927A1 Publication Date: 2019-04-18 Application Number: 2018077626 Filing Date: 2018-10-10 Inventor: Bodner, Thomas   Etschmaier, Harald   Assignee: AMS AG   IPC: G01S7/481 Abstract: A method for fabricating a plurality of Time-of-Flight sensor devices (1) comprises a step of providing a wafer (100) including a plurality of wafer portions (110) for a respective one of the Time-of-Flight sensor devices (1), wherein each of the wafer portions (110) includes a first light detecting area (10) and a second light detecting area (20) and a respective light emitter device (30). The respective light emitter device (30) and the respective first light detecting area (10) is encapsulated by a first volume (40) of a light transparent material (130), and the respective second light detecting area (20) is encapsulated by a second volume (50) of the light transparent material (130). Before singulation of the devices (1), an opaque material (60) is placed on the wafer portions (110) in a space (120) between the respective first and second volume (40, 50) of the light transparent material (130).
19
EP3435045A1
OPTICAL SENSOR PACKAGE AND METHOD OF PRODUCING SAME
Publication/Patent Number: EP3435045A1 Publication Date: 2019-01-30 Application Number: 17183544.0 Filing Date: 2017-07-27 Inventor: Etschmaier, Harald   Schmidegg, Klaus   Assignee: ams AG   IPC: G01J1/02 Abstract: The optical sensor package comprises an optical sensor device (4) with a sensor element (5) arranged inside a housing (1, 2) comprising a cap (2). A diffuser (3) is arranged in an aperture (11) of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser.
20
US2019161340A1
SENSOR ASSEMBLY AND ARRANGEMENT AND METHOD FOR MANUFACTURING A SENSOR ASSEMBLY
Publication/Patent Number: US2019161340A1 Publication Date: 2019-05-30 Application Number: 16/098,230 Filing Date: 2017-05-05 Inventor: Etschmaier, Harald   Singulani, Anderson   Assignee: ams AG   IPC: B81B7/00 Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.
Total 4 pages