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1 | EP3255456B1 |
OPTICAL SENSOR ARRANGEMENT AND METHOD FOR MANUFACTURING AN OPTICAL SENSOR ARRANGEMENT
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Publication/Patent Number: EP3255456B1 | Publication Date: 2021-01-06 | Application Number: 16173353.0 | Filing Date: 2016-06-07 | Inventor： Etschmaier, Harald Minixhofer, Rainer Röhrer, Georg | Assignee: ams AG | IPC: G01S17/10 | ||||
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2 | US10723615B2 |
Sensor assembly and arrangement and method for manufacturing a sensor assembly
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Publication/Patent Number: US10723615B2 | Publication Date: 2020-07-28 | Application Number: 16/098,230 | Filing Date: 2017-05-05 | Inventor： Etschmaier, Harald Singulani, Anderson | Assignee: Sciosense B.V. | IPC: B81B7/00 | Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board. | |||
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3 | US2020333442A1 |
METHOD FOR FABRICATING A PLURALITY OF TIME-OF-FLIGHT SENSOR DEVICES
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Publication/Patent Number: US2020333442A1 | Publication Date: 2020-10-22 | Application Number: 16/754,335 | Filing Date: 2018-10-10 | Inventor： Etschmaier, Harald Bodner, Thomas | Assignee: ams AG | IPC: G01S7/481 | Abstract: A method for fabricating a plurality of Time-of-Flight sensor devices (1) comprises a step of providing a wafer (100) including a plurality of wafer portions (110) for a respective one of the Time-of-Flight sensor devices (1), wherein each of the wafer portions (110) includes a first light detecting area (10) and a second light detecting area (20) and a respective light emitter device (30). The respective light emitter device (30) and the respective first light detecting area (10) is encapsulated by a first volume (40) of a light transparent material (130), and the respective second light detecting area (20) is encapsulated by a second volume (50) of the light transparent material (130). Before singulation of the devices (1), an opaque material (60) is placed on the wafer portions (110) in a space (120) between the respective first and second volume (40, 50) of the light transparent material (130). | |||
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4 | US2020225085A1 |
OPTICAL SENSOR PACKAGE AND METHOD OF PRODUCING SAME
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Publication/Patent Number: US2020225085A1 | Publication Date: 2020-07-16 | Application Number: 16/633,509 | Filing Date: 2018-07-18 | Inventor： Etschmaier, Harald Schmidegg, Klaus | Assignee: ams AG | IPC: G01J1/04 | Abstract: The optical sensor package comprises an optical sensor device with a sensor element arranged inside a housing comprising a cap. A diffuser is arranged in an aperture of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser. | |||
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5 | EP3724634A1 |
INTEGRATED PARTICULATE MATTER SENSOR SYSTEMS
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Publication/Patent Number: EP3724634A1 | Publication Date: 2020-10-21 | Application Number: 18825620.0 | Filing Date: 2018-12-13 | Inventor： Etschmaier, Harald Roehrer, Georg Singulani, Anderson Bergmann, Alexander | Assignee: ams International AG Technische Universität Graz | IPC: G01N15/06 | ||||
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6 | US10741035B2 |
Integrated smoke detection device
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Publication/Patent Number: US10741035B2 | Publication Date: 2020-08-11 | Application Number: 16/345,828 | Filing Date: 2017-10-19 | Inventor： Etschmaier, Harald Hiramatsu, Nobuyoshi Synooka, Olesia | Assignee: ams AG | IPC: G08B17/107 | Abstract: The integrated smoke detection device comprises a carrier (1), a light source (2) arranged on or above the carrier, a light receiver (3) arranged on or above the carrier at a distance from the light source, and a polarizing member (7) arranged on or above the carrier, the light source emitting radiation (a, b) into the polarizing member. The polarizing member is configured to have a boundary surface (11) that linearly polarizes a reflected portion (d) of the radiation emitted by the light source, and an exit surface (12) that allows the reflected portion (d) to exit the polarizing member. | |||
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7 | EP3620813A1 |
OPTICAL SENSOR ARRANGEMENT, DEVICE AND METHOD OF MANUFACTURING AN OPTICAL SENSOR ARRANGEMENT
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Publication/Patent Number: EP3620813A1 | Publication Date: 2020-03-11 | Application Number: 18192541.3 | Filing Date: 2018-09-04 | Inventor： Etschmaier, Harald Schmidegg, Klaus Eilertsen, James | Assignee: ams AG | IPC: G01S7/481 | Abstract: A method of manufacturing an optical sensor arrangement comprising the steps of providing a substrate (10) having a surface (11) and providing an integrated circuit (20) comprising an optical detector (21) arranged for detecting light of a desired wavelength range. The integrated circuit (20) and a light emitter (30) are mounted onto the surface (11), wherein the light emitter (30) is arranged for emitting light in the desired wavelength range. The integrated circuit (20) and the light emitter (30) are electrically connected to each other and to the substrate (10). A light barrier (40) is formed between the optical detector (21) and the light emitter (30) by dispensing a first optically opaque material along a profile (24) of the integrated circuit (20). A mold layer (50) is formed by at least partly encapsulating the substrate (10), the integrated circuit (20) and the light emitter (30) with an optically transparent material. A casing (60), made from a second optically opaque material, is mounted on the light barrier (40) and thereby encloses a hollow space between the casing (60) and the mold layer (50). | |||
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8 | US2020393351A1 |
INTEGRATED PARTICULATE MATTER SENSOR SYSTEMS
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Publication/Patent Number: US2020393351A1 | Publication Date: 2020-12-17 | Application Number: 16/772,453 | Filing Date: 2018-12-13 | Inventor： Etschmaier, Harald Roehrer, Georg Singulani, Anderson Bergmann, Alexander | Assignee: ams International AG Technische Universität Graz | IPC: G01N15/06 | Abstract: A particulate matter sensor system for sensing particulate matter in a fluid includes a substrate and a cover disposed on the substrate. The cover defines at least a portion of a flow path through the microfluidic system. The sensor system includes a particulate matter sensor disposed in an interior space between the cover and the substrate. The particulate matter sensor includes an integrated sensor device electrically connected to the substrate. The flow path is defined through the particulate matter sensor. The sensor system includes a fluid circulation device disposed in the interior space between the cover and the substrate and configured to cause fluid to flow along the flow path through the microfluidic system. | |||
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9 | US2020184790A1 |
INTEGRATED SMOKE DETECTION DEVICE
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Publication/Patent Number: US2020184790A1 | Publication Date: 2020-06-11 | Application Number: 16/345,828 | Filing Date: 2017-10-19 | Inventor： Etschmaier, Harald Hiramatsu, Nobuyoshi Synooka, Olesia | Assignee: ams AG | IPC: G08B17/107 | Abstract: The integrated smoke detection device comprises a carrier (1), a light source (2) arranged on or above the carrier, a light receiver (3) arranged on or above the carrier at a distance from the light source, and a polarizing member (7) arranged on or above the carrier, the light source emitting radiation (a, b) into the polarizing member. The polarizing member is configured to have a boundary surface (11) that linearly polarizes a reflected portion (d) of the radiation emitted by the light source, and an exit surface (12) that allows the reflected portion (d) to exit the polarizing member. | |||
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10 | US10734534B2 |
Method of producing an optical sensor at wafer-level and optical sensor
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Publication/Patent Number: US10734534B2 | Publication Date: 2020-08-04 | Application Number: 15/746,342 | Filing Date: 2016-07-22 | Inventor： Etschmaier, Harald Toschkoff, Gregor Bodner, Thomas Schrank, Franz | Assignee: ams AG | IPC: H01L31/0203 | Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure. | |||
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11 | US10847664B2 |
Optical package and method of producing an optical package
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Publication/Patent Number: US10847664B2 | Publication Date: 2020-11-24 | Application Number: 15/773,539 | Filing Date: 2016-11-04 | Inventor： Mehrl, David Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald Schrank, Franz | Assignee: AMS AG | IPC: H01L31/0232 | Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range. | |||
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12 | WO2020027721A1 |
PACKAGE INCLUDING PORTIONS OF A LEAD FRAME AS ELECTRICALLY CONDUCTIVE LEADS
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Publication/Patent Number: WO2020027721A1 | Publication Date: 2020-02-06 | Application Number: 2019050342 | Filing Date: 2019-07-12 | Inventor： Tak, Coen Kilburn, Ian Balimann, Martin Lukas Umali, Arnold Etschmaier, Harald | Assignee: AMS SENSORS ASIA PTE. LTD. | IPC: H01S5/022 | Abstract: The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package. | |||
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13 | EP3724628A1 |
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
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Publication/Patent Number: EP3724628A1 | Publication Date: 2020-10-21 | Application Number: 18825621.8 | Filing Date: 2018-12-13 | Inventor： Etschmaier, Harald Roehrer, Georg Singulani, Anderson Enichlmair, Hubert Park, Jong-mun Bergmann, Alexander Maierhofer, Paul | Assignee: ams International AG Technische Universität Graz | IPC: G01N1/22 | ||||
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14 | US2020400544A1 |
INTEGRATED FILTER-BASED PARTICULATE MATTER SENSORS
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Publication/Patent Number: US2020400544A1 | Publication Date: 2020-12-24 | Application Number: 16/772,457 | Filing Date: 2018-12-13 | Inventor： Etschmaier, Harald Roehrer, Georg Singulani, Anderson Enichlmair, Hubert Park, Jong-mun Bergmann, Alexander Maierhofer, Paul | Assignee: ams International AG Technische Universität Graz | IPC: G01N15/06 | Abstract: An apparatus for sensing particulate matter in a fluid includes a substrate; and an integrated circuit electrically connected to the substrate, the integrated circuit including a photodetector. The apparatus includes a filter assembly including a particle filter aligned with the photodetector, and a filter housing for the particle filter, the filter housing defining a flow path for fluid through the particle filter. The apparatus includes a light source electrically connected to the substrate and positioned to illuminate the particle filter. | |||
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15 | US10175270B2 |
Integrated current sensor system and method for producing an integrated current sensor system
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Publication/Patent Number: US10175270B2 | Publication Date: 2019-01-08 | Application Number: 15/116,496 | Filing Date: 2015-01-16 | Inventor： Etschmaier, Harald | Assignee: ams AG | IPC: G01R15/20 | Abstract: An integrated current sensor system has a printed circuit board with a magnetic field sensor with a sensor interface. The printed circuit board has a first side on which, isolated from the printed circuit board, a first current conductor is arranged with a longitudinal edge of a portion of the first current conductor being proximate to a sensitive area of sensor. The circuit board has a second side on which a second current conductor is, isolated from the printed circuit board, arranged, wherein a longitudinal edge of a portion of the second current conductor is arranged proximate to the sensitive area. The first and the second current conductor are electrically connected with at least one conductive via. | |||
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16 | EP2905626B1 |
Integrated current sensor system and method for producing an integrated current sensor system
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Publication/Patent Number: EP2905626B1 | Publication Date: 2019-09-11 | Application Number: 14154008.8 | Filing Date: 2014-02-05 | Inventor： Etschmaier, Harald | Assignee: ams AG | IPC: G01R15/14 | ||||
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17 | TW201918694A |
Optical sensor package and method of producing same
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Publication/Patent Number: TW201918694A | Publication Date: 2019-05-16 | Application Number: 107124644 | Filing Date: 2018-07-17 | Inventor： Schmidegg, Klaus Etschmaier, Harald | Assignee: AMS AG | IPC: G01J3/02 | Abstract: The optical sensor package comprises an optical sensor device (4) with a sensor element (5) arranged inside a housing (1, 2) comprising a cap (2). A diffuser (3) is arranged in an aperture (11) of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser. | |||
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18 | WO2019072927A1 |
METHOD FOR FABRICATING A PLURALITY OF TIME-OF-FLIGHT SENSOR DEVICES
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Publication/Patent Number: WO2019072927A1 | Publication Date: 2019-04-18 | Application Number: 2018077626 | Filing Date: 2018-10-10 | Inventor： Bodner, Thomas Etschmaier, Harald | Assignee: AMS AG | IPC: G01S7/481 | Abstract: A method for fabricating a plurality of Time-of-Flight sensor devices (1) comprises a step of providing a wafer (100) including a plurality of wafer portions (110) for a respective one of the Time-of-Flight sensor devices (1), wherein each of the wafer portions (110) includes a first light detecting area (10) and a second light detecting area (20) and a respective light emitter device (30). The respective light emitter device (30) and the respective first light detecting area (10) is encapsulated by a first volume (40) of a light transparent material (130), and the respective second light detecting area (20) is encapsulated by a second volume (50) of the light transparent material (130). Before singulation of the devices (1), an opaque material (60) is placed on the wafer portions (110) in a space (120) between the respective first and second volume (40, 50) of the light transparent material (130). | |||
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19 | EP3435045A1 |
OPTICAL SENSOR PACKAGE AND METHOD OF PRODUCING SAME
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Publication/Patent Number: EP3435045A1 | Publication Date: 2019-01-30 | Application Number: 17183544.0 | Filing Date: 2017-07-27 | Inventor： Etschmaier, Harald Schmidegg, Klaus | Assignee: ams AG | IPC: G01J1/02 | Abstract: The optical sensor package comprises an optical sensor device (4) with a sensor element (5) arranged inside a housing (1, 2) comprising a cap (2). A diffuser (3) is arranged in an aperture (11) of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser. | |||
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20 | US2019161340A1 |
SENSOR ASSEMBLY AND ARRANGEMENT AND METHOD FOR MANUFACTURING A SENSOR ASSEMBLY
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Publication/Patent Number: US2019161340A1 | Publication Date: 2019-05-30 | Application Number: 16/098,230 | Filing Date: 2017-05-05 | Inventor： Etschmaier, Harald Singulani, Anderson | Assignee: ams AG | IPC: B81B7/00 | Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board. |
3.Current Quota