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1
US2020266316A1
IMAGE SENSOR
Publication/Patent Number: US2020266316A1 Publication Date: 2020-08-20 Application Number: 16/560,239 Filing Date: 2019-09-04 Inventor: Fan chun sheng   Assignee: OMNIVISION SEMICONDUCTOR (SHANGHAI) CO., LTD.   IPC: H01L31/12 Abstract: An image sensor is disclosed which includes a substrate, a pixel array, a peripheral circuit, an SPAD detector and a VCSEL integrated in the substrate. The peripheral circuit is configured to process an electrical signal obtained from photoelectric conversion in the pixel array, the SPAD detector is configured to convert a first external optical pulse into an electrical pulse to provide a clock signal to the peripheral circuit. The VCSEL is driven by the peripheral circuit and configured to output a second optical pulse. The number of electrical connection terminals in the image sensor is reduced to only two, which is favorable to the miniaturization of the image sensor and simplifies the design of the mating device while allowing the inputting of a first optical pulse and outputting of a second optical pulse. By using these optical signals, extremely high speed and high bandwidth data transmission can be achieved.
2
US10620491B2
Liquid crystal on silicon packaging
Publication/Patent Number: US10620491B2 Publication Date: 2020-04-14 Application Number: 16/658,338 Filing Date: 2019-10-21 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1333 Abstract: A method of fanning an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.
3
US2020050044A1
Liquid Crystal On Silicon Packaging
Publication/Patent Number: US2020050044A1 Publication Date: 2020-02-13 Application Number: 16/658,338 Filing Date: 2019-10-21 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1345 Abstract: A method of fanning an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.
4
US10750061B2
Endoscope having camera module and LED on flexible printed circuit
Publication/Patent Number: US10750061B2 Publication Date: 2020-08-18 Application Number: 15/705,523 Filing Date: 2017-09-15 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04N5/225 Abstract: An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side of the first head part and a second side of the first LED is mounted on a first side of the camera module, while the first head part is bent. The second side of the body part is mounted on an end of a flexible fiber, and the tail part of the FPC is bent to mount on the flexible fiber.
5
US2020111829A1
IMAGE SENSOR CHIP-SCALE-PACKAGE
Publication/Patent Number: US2020111829A1 Publication Date: 2020-04-09 Application Number: 16/154,544 Filing Date: 2018-10-08 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An image sensor chip-scale package includes a pixel array, a cover glass covering the pixel array, a dam, and an adhesive layer. The pixel array is embedded in a substrate top-surface of a semiconductor substrate. The semiconductor substrate includes a plurality of conductive pads in a peripheral region of the semiconductor substrate surrounding the pixel array. The dam at least partially surrounds the pixel array and is located (i) between the cover glass and the semiconductor substrate, and (ii) on a region of the substrate top-surface between the pixel array and the plurality of conductive pads. The adhesive layer is (i) located between the cover glass and the semiconductor substrate, (ii) at least partially surrounding the dam, and (iii) configured to adhere the cover glass to the semiconductor substrate.
6
US202050044A1
Liquid Crystal On Silicon Packaging
Publication/Patent Number: US202050044A1 Publication Date: 2020-02-13 Application Number: 20/191,665 Filing Date: 2019-10-21 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1362 Abstract: A method of fanning an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.
7
US10848648B2
Image sensor
Publication/Patent Number: US10848648B2 Publication Date: 2020-11-24 Application Number: 16/560,239 Filing Date: 2019-09-04 Inventor: Fan chun sheng   Assignee: OMNIVISION SEMICONDUCTOR (SHANGHAI) CO., LTD.   IPC: H04N5/225 Abstract: An image sensor is disclosed which includes a substrate, a pixel array, a peripheral circuit, an SPAD detector and a VCSEL integrated in the substrate. The peripheral circuit is configured to process an electrical signal obtained from photoelectric conversion in the pixel array, the SPAD detector is configured to convert a first external optical pulse into an electrical pulse to provide a clock signal to the peripheral circuit. The VCSEL is driven by the peripheral circuit and configured to output a second optical pulse. The number of electrical connection terminals in the image sensor is reduced to only two, which is favorable to the miniaturization of the image sensor and simplifies the design of the mating device while allowing the inputting of a first optical pulse and outputting of a second optical pulse. By using these optical signals, extremely high speed and high bandwidth data transmission can be achieved.
8
US2020249536A1
LCOS PIXEL FILM LAYER DESIGN FOR REFLECTION RATE IMPROVEMENT
Publication/Patent Number: US2020249536A1 Publication Date: 2020-08-06 Application Number: 16/267,300 Filing Date: 2019-02-04 Inventor: Fan chun sheng cs   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1362 Abstract: A novel liquid crystal on silicon (LCoS) device includes an array of pixel electrodes having a highly reflective material formed thereon. In a particular embodiment, the pixel electrodes are aluminum and have silver pixel mirrors electroplated thereon. In a more particular embodiment, the LCoS device includes auxiliary circuitry facilitating the electroplating of the pixel mirrors.
9
US10852603B2
LCOS pixel film layer design for reflection rate improvement
Publication/Patent Number: US10852603B2 Publication Date: 2020-12-01 Application Number: 16/267,300 Filing Date: 2019-02-04 Inventor: Fan chun sheng cs   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1335 Abstract: A novel liquid crystal on silicon (LCoS) device includes an array of pixel electrodes having a highly reflective material formed thereon. In a particular embodiment, the pixel electrodes are aluminum and have silver pixel mirrors electroplated thereon. In a more particular embodiment, the LCoS device includes auxiliary circuitry facilitating the electroplating of the pixel mirrors.
10
US2020098806A1
IMAGE-SENSOR PACKAGE AND ASSOCIATED METHOD
Publication/Patent Number: US2020098806A1 Publication Date: 2020-03-26 Application Number: 16/139,019 Filing Date: 2018-09-22 Inventor: Lin, Wei-feng   Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An image-sensor package includes a cover glass, an image sensor, and an integrated circuit. The cover glass has a cover-glass bottom surface, to which the image sensor is bonded. The integrated circuit is beneath the cover-glass bottom surface, adjacent to the image sensor, and electronically connected to the image sensor. A method for packaging an image sensor includes attaching an image sensor to a cover-glass bottom surface of a cover glass, a light-sensing region of the image sensor facing the cover-glass bottom surface. The method also includes attaching an integrated circuit to the cover-glass bottom surface, a top IC-surface of the integrated circuit facing the cover-glass bottom surface.
11
US202050051A1
LCOS DISPLAY PANEL HAVING UV CUT FILTER
Publication/Patent Number: US202050051A1 Publication Date: 2020-02-13 Application Number: 20/181,605 Filing Date: 2018-08-08 Inventor: Ko, Pei-wen   Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1339 Abstract: A LCOS display panel comprises a silicon substrate, a pixel structure on the silicon substrate, a first and a second PI (polyimide) layers, a LC (liquid crystal) layer between the first and the second PI layers, wherein the second PI layer is disposed on the pixel structure, and the LC layer is disposed on the second PI layer, a glass substrate, an ITO (indium tin oxide) layer, a dam sealing a perimeter of the LCOS display panel to enclose the LC layer within the dam, wherein the dam is disposed between the first and second PI layers, and holds the silicon substrate and the glass substrate together, and a UV (ultra violet) cut filter in an active area of the LCOS display panel, wherein the active area of the LCOS display panel includes the LC layer and the pixel structure.
12
US2020050051A1
LCOS DISPLAY PANEL HAVING UV CUT FILTER
Publication/Patent Number: US2020050051A1 Publication Date: 2020-02-13 Application Number: 16/057,950 Filing Date: 2018-08-08 Inventor: Ko, Pei-wen   Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1335 Abstract: A LCOS display panel comprises a silicon substrate, a pixel structure on the silicon substrate, a first and a second PI (polyimide) layers, a LC (liquid crystal) layer between the first and the second PI layers, wherein the second PI layer is disposed on the pixel structure, and the LC layer is disposed on the second PI layer, a glass substrate, an ITO (indium tin oxide) layer, a dam sealing a perimeter of the LCOS display panel to enclose the LC layer within the dam, wherein the dam is disposed between the first and second PI layers, and holds the silicon substrate and the glass substrate together, and a UV (ultra violet) cut filter in an active area of the LCOS display panel, wherein the active area of the LCOS display panel includes the LC layer and the pixel structure.
13
US2020395730A1
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020395730A1 Publication Date: 2020-12-17 Application Number: 16/440,031 Filing Date: 2019-06-13 Inventor: Fan chun sheng   Lin, Wei-feng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H01S5/022 Abstract: A semiconductor structure is provided. The semiconductor structure includes: a substrate having a cavity recessed from a top surface of the substrate toward a bottom surface of the substrate opposite to the top surface, wherein the cavity has a sidewall and a bottom surface, and the bottom surface of the cavity is substantially parallel to the top surface of the substrate; a light source structure in the cavity, and the light source structure emitting a light from a sidewall of the light source structure; and a diffractive optical element (DOE) over the top surface of the substrate; wherein the sidewall of the cavity is a sloped surface, so that when the light is incident on the sidewall, the sloped surface reflects the incident light to generate a reflected light toward the DOE. Associated semiconductor structure and manufacturing method are also disclosed.
14
US2020387002A1
DIFFRACTIVE OPTICAL ELEMENTS MADE OF CONDUCTIVE MATERIALS
Publication/Patent Number: US2020387002A1 Publication Date: 2020-12-10 Application Number: 16/430,517 Filing Date: 2019-06-04 Inventor: Fan chun sheng   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: G02B27/09 Abstract: A diffractive optical element (DOE) comprises a first part comprising a first transparent non-conductive base and a first transparent conductive layer disposed on the first transparent non-conductive base and a second part comprising a second transparent non-conductive base and a second transparent conductive layer disposed on the second transparent non-conductive base. The first transparent conductive layer and the second transparent conductive layer have periodical patterns of thickness for diffracting light. Spacers separate the first part and the second part. The first part and the second part are positioned such that the first transparent conductive layer is facing the second transparent conductive layer. A first end of the first transparent conductive layer is electrically connected to a first terminal of a capacitance monitor, and a second end of the second transparent conductive layer is electrically connected to a second terminal of the capacitance monitor. The capacitance monitor constantly monitors the capacitance across the first transparent conductive layer and the second transparent conductive layer during an operation comprising diffracting a laser beam.
15
US2020124902A1
LCOS DISPLAY WITH LIGHT ABSORBING LAYER
Publication/Patent Number: US2020124902A1 Publication Date: 2020-04-23 Application Number: 16/164,469 Filing Date: 2018-10-18 Inventor: Ko, Pei-wen   Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1333 Abstract: An example liquid crystal display device includes a circuit substrate, an array of conductive mirrors formed on the substrate, a light absorbing material disposed between the conductive mirrors, a transparent plate disposed over the array of conductive mirrors, and liquid crystal material disposed between the conductive mirrors and the transparent plate. The light absorbing material can also be disposed around the peripheral region of the array of the conductive mirrors. In an example display, the light absorbing material is black and/or has a light absorbing efficiency of at least fifty percent.
16
US202027865A1
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
Publication/Patent Number: US202027865A1 Publication Date: 2020-01-23 Application Number: 20/181,612 Filing Date: 2018-09-04 Inventor: Fan, Regis   Fan chun sheng   Ko, Pei-wen   Assignee: OmniVision Semiconductor (Shanghai) Co., Ltd.   IPC: H01L33/62 Abstract: A micro LED display and a manufacturing method thereof are disclosed. A plurality of electrode structures is formed on a first surface of a substrate, and a plurality of circuit structure are formed in the substrate, where the circuit structures are electrically connected to the electrode structures. An LED functional layer is formed on the substrate, and includes a plurality of mutually isolated LED functional structures, where the LED functional structures are corresponding and electrically connected to the electrode structures. An electrode layer covers the LED functional layer and is electrically connected to the LED functional structures. Micro lenses are formed on the electrode layer and corresponding to the LED functional structures. Therefore, all the LED functional structures can be wholly used as a light-emitting region of a pixel, improving light emission efficiency of the micro LED display.
17
US10607974B2
Micro LED display and manufacturing method thereof
Publication/Patent Number: US10607974B2 Publication Date: 2020-03-31 Application Number: 16/120,835 Filing Date: 2018-09-04 Inventor: Fan, Regis   Ko, Pei-wen   Fan chun sheng   Assignee: OMNIVISION SEMICONDUCTOR (SHANGHAI) CO., LTD.   IPC: H01L25/16 Abstract: A micro LED display and a manufacturing method thereof are disclosed. A plurality of electrode structures is formed on a first surface of a substrate, and a plurality of circuit structure are formed in the substrate, where the circuit structures are electrically connected to the electrode structures. An LED functional layer is formed on the substrate, and includes a plurality of mutually isolated LED functional structures, where the LED functional structures are corresponding and electrically connected to the electrode structures. An electrode layer covers the LED functional layer and is electrically connected to the LED functional structures. Micro lenses are formed on the electrode layer and corresponding to the LED functional structures. Therefore, all the LED functional structures can be wholly used as a light-emitting region of a pixel, improving light emission efficiency of the micro LED display.
18
US2020027865A1
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
Publication/Patent Number: US2020027865A1 Publication Date: 2020-01-23 Application Number: 16/120,835 Filing Date: 2018-09-04 Inventor: Fan, Regis   Ko, Pei-wen   Fan chun sheng   Assignee: OmniVision Semiconductor (Shanghai) Co., Ltd.   IPC: H01L25/16 Abstract: A micro LED display and a manufacturing method thereof are disclosed. A plurality of electrode structures is formed on a first surface of a substrate, and a plurality of circuit structure are formed in the substrate, where the circuit structures are electrically connected to the electrode structures. An LED functional layer is formed on the substrate, and includes a plurality of mutually isolated LED functional structures, where the LED functional structures are corresponding and electrically connected to the electrode structures. An electrode layer covers the LED functional layer and is electrically connected to the LED functional structures. Micro lenses are formed on the electrode layer and corresponding to the LED functional structures. Therefore, all the LED functional structures can be wholly used as a light-emitting region of a pixel, improving light emission efficiency of the micro LED display.
19
US10644048B2
Anti-reflective coating with high refractive index material at air interface
Publication/Patent Number: US10644048B2 Publication Date: 2020-05-05 Application Number: 15/421,879 Filing Date: 2017-02-01 Inventor: Fan chun sheng   Tsai, Chen-wei   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.
20
US2020335534A1
ANTI-REFLECTIVE COATING WITH HIGH REFRACTIVE INDEX MATERIAL AT AIR INTERFACE
Publication/Patent Number: US2020335534A1 Publication Date: 2020-10-22 Application Number: 16/816,683 Filing Date: 2020-03-12 Inventor: Fan chun sheng   Tsai, Chen-wei   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.