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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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21
US2020052019A1
CAVITYLESS CHIP-SCALE IMAGE-SENSOR PACKAGE
Publication/Patent Number: US2020052019A1 Publication Date: 2020-02-13 Application Number: 16/100,835 Filing Date: 2018-08-10 Inventor: Yeh, Chien-chan   Kuo, Ying-chih   Lin, Wei-feng   Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.
22
US202052019A1
CAVITYLESS CHIP-SCALE IMAGE-SENSOR PACKAGE
Publication/Patent Number: US202052019A1 Publication Date: 2020-02-13 Application Number: 20/181,610 Filing Date: 2018-08-10 Inventor: Lin, Wei-feng   Fan chun sheng   Yeh, Chien-chan   Kuo, Ying-chih   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.
23
US201989875A1
ENDOSCOPE HAVING CAMERA MODULE AND LED ON FLEXIBLE PRINTED CIRCUIT
Publication/Patent Number: US201989875A1 Publication Date: 2019-03-21 Application Number: 20/171,570 Filing Date: 2017-09-15 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04N5/225 Abstract: An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side of the first head part and a second side of the first LED is mounted on a first side of the camera module, while the first head part is bent. The second side of the body part is mounted on an end of a flexible fiber, and the tail part of the FPC is bent to mount on the flexible fiber.
24
TW201944771A
Imaging system having four image sensors
Publication/Patent Number: TW201944771A Publication Date: 2019-11-16 Application Number: 107112175 Filing Date: 2018-04-09 Inventor: Fan chun sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H04N5/369 Abstract: An imaging system having four image sensors comprises a first dichroic filter, a second dichroic filter, and a third dichroic filter. The first dichroic filter reflects light having a first wavelength band and a second wavelength band toward a second dichroic filter, and transmits light having a third wavelength band and a fourth wavelength band toward the third dichroic filter. The second dichroic filter reflects light having the first wavelength band toward the first image sensor, and transmits light having the second wavelength band toward the second image sensor. The third dichroic filter reflectes light having the third wavelength band toward the third image sensor, and transmits light having the fourth wavelength band toward the fourth image sensor. The first dichroic filter, the second dichroic filter, and the third dichroic filter are included in an integrated part.
25
US10310285B2
Wafer-level liquid-crystal-on-silicon projection assembly, systems and methods
Publication/Patent Number: US10310285B2 Publication Date: 2019-06-04 Application Number: 15/817,064 Filing Date: 2017-11-17 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02B27/26 Abstract: A wafer-level liquid-crystal-on-silicon (LCOS) projection assembly includes a LCOS display for spatially modulating light incident on the LCOS display and a polarizing beam-separating (PBS) layer for directing light to and from the LCOS display. A method for fabricating a LCOS projection system includes disposing a PBS wafer above an active-matrix wafer. The active-matrix wafer includes a plurality of active matrices for addressing liquid crystal display pixels. The method, further includes disposing a lens wafer above the PBS wafer. The lens wafer includes a plurality of lenses. Additionally, a method for fabricating a wafer-level polarizing beam includes bonding a PBS wafer and at least one other wafer to form a stacked wafer. The PBS wafer includes a PBS layer that contains a plurality of PBS film bands.
26
US10313642B2
Imaging system having dual image sensors
Publication/Patent Number: US10313642B2 Publication Date: 2019-06-04 Application Number: 15/408,724 Filing Date: 2017-01-18 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04N9/07 Abstract: An imaging system for capturing an image of an object comprises a first lens, a dichroic beam splitter, which transmits light of a color band and reflects light of all colors outside the color band, a first image sensor for capturing an image formed by the transmitted light in the color band, a second image sensor for capturing an image formed by the reflected light outside the color band. The first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor. The image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image.
27
US2019086708A1
LIQUID CRYSTAL ON SILICON PACKAGING
Publication/Patent Number: US2019086708A1 Publication Date: 2019-03-21 Application Number: 15/707,988 Filing Date: 2017-09-18 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1345 Abstract: A method of forming an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.
28
TW201923406A
Method for fabricating a wafer-level liquid-crystal-on-silicon projection system
Publication/Patent Number: TW201923406A Publication Date: 2019-06-16 Application Number: 107138047 Filing Date: 2018-10-26 Inventor: Fan chun sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H04N9/31 Abstract: A wafer-level liquid-crystal-on-silicon (LCOS) projection assembly includes a LCOS display for spatially modulating light incident on the LCOS display and a polarizing beam-separating (PBS) layer for directing light to and from the LCOS display. A method for fabricating a LCOS projection system includes disposing a PBS wafer above an active-matrix wafer. The active-matrix wafer includes a plurality of active matrices for addressing liquid crystal display pixels. The method, further includes disposing a lens wafer above the PBS wafer. The lens wafer includes a plurality of lenses. Additionally, a method for fabricating a wafer-level polarizing beam includes bonding a PBS wafer and at least one other wafer to form a stacked wafer. The PBS wafer includes a PBS layer that contains a plurality of PBS film bands.
29
US10488721B2
Liquid crystal on silicon packaging
Publication/Patent Number: US10488721B2 Publication Date: 2019-11-26 Application Number: 15/707,988 Filing Date: 2017-09-18 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1333 Abstract: A method of forming an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.
30
US2019089875A1
ENDOSCOPE HAVING CAMERA MODULE AND LED ON FLEXIBLE PRINTED CIRCUIT
Publication/Patent Number: US2019089875A1 Publication Date: 2019-03-21 Application Number: 15/705,523 Filing Date: 2017-09-15 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04N5/225 Abstract: An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side of the first head part and a second side of the first LED is mounted on a first side of the camera module, while the first head part is bent. The second side of the body part is mounted on an end of a flexible fiber, and the tail part of the FPC is bent to mount on the flexible fiber.
31
US10313643B2
Imaging system having four image sensors
Publication/Patent Number: US10313643B2 Publication Date: 2019-06-04 Application Number: 15/456,937 Filing Date: 2017-03-13 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04N9/097 Abstract: An imaging system having four image sensors comprises a first dichroic filter, a second dichroic filter, and a third dichroic filter. The first dichroic filter reflects light having a first wavelength band and a second wavelength band toward a second dichroic filter, and transmits light having a third wavelength band and a fourth wavelength band toward the third dichroic filter. The second dichroic filter reflects light having the first wavelength band toward the first image sensor, and transmits light having the second wavelength band toward the second image sensor. The third dichroic filter reflects light having the third wavelength band toward the third image sensor, and transmits light having the fourth wavelength band toward the fourth image sensor. The first dichroic filter, the second dichroic filter, and the third dichroic filter are included in an integrated part.
32
TW201914517A
Endoscope and manufacturing method thereof
Publication/Patent Number: TW201914517A Publication Date: 2019-04-16 Application Number: 107130912 Filing Date: 2018-09-04 Inventor: Fan chun sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: A61B1/06 Abstract: An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side of the first head part and a second side of the first LED is mounted on a first side of the camera module, while the first head part is bent. The second side of the body part is mounted on an end of a flexible fiber, and the tail part of the FPC is bent to mount on the flexible fiber.
33
TWI663721B
Chip-scale image sensor package and associated method of making
Publication/Patent Number: TWI663721B Publication Date: 2019-06-21 Application Number: 107109297 Filing Date: 2018-03-19 Inventor: Lin, Wei Feng   Tsai, Chen Wei   Fan, Chun Sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: H01L27/146 Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.
34
US10256266B2
Chip-scale image sensor package and associated method of making
Publication/Patent Number: US10256266B2 Publication Date: 2019-04-09 Application Number: 15/480,131 Filing Date: 2017-04-05 Inventor: Tsai, Chen-wei   Fan chun sheng   Lin, Wei-feng   Assignee: OmniVision Technologies, Inc.   IPC: H01L27/146 Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.
35
US10108053B2
Liquid crystal display device with peripheral electrode
Publication/Patent Number: US10108053B2 Publication Date: 2018-10-23 Application Number: 15/299,842 Filing Date: 2016-10-21 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1343 Abstract: A liquid crystal display device includes a first substrate, a pixel array formed on the first substrate, a transparent substrate, a liquid crystal layer disposed between the pixel array and the transparent substrate, a transparent electrode disposed between the transparent substrate and the liquid crystal layer, and an input electrode. The transparent electrode has a longer first edge and an orthogonal shorter second edge. The input electrode extends along, and is electrically coupled along, the first edge of the transparent electrode and has lower impedance than a portion of the transparent electrode overlying the pixel array. The input electrode can include additional portion(s) that extend along, and that are electrically-coupled along, the other edges of the transparent electrode. The input electrode reduces the common voltage propagation delay across the transparent electrode and improves reduces intensity variation over the display area, even for high-frequency common voltage waveforms.
36
TW201841018A
Imaging system and method of forming the same, electronic device comprising imaging system
Publication/Patent Number: TW201841018A Publication Date: 2018-11-16 Application Number: 107101477 Filing Date: 2018-01-16 Inventor: Fan chun sheng   Assignee: OMNIVISION TECHNOLOGIES, INC.   IPC: G02B13/00 Abstract: An imaging system for capturing an image of an object comprises a first lens, a dichroic beam splitter, which transmits light of a color band and reflects light of all colors outside the color band, a first image sensor for capturing an image formed by the transmitted light in the color band, a second image sensor for capturing an image formed by the reflected light outside the color band. The first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor. The image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image. An electronic device comprising the imaging system and a method for forming the imaging system are also provided.
37
US9958726B2
Highly-reflective liquid crystal on silicon panel comprising a continuous reflective coating covering pixel electrodes and an inter-pixel coating
Publication/Patent Number: US9958726B2 Publication Date: 2018-05-01 Application Number: 14/631,390 Filing Date: 2015-02-25 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1362 Abstract: A highly-reflective liquid crystal on silicon (LCOS) panel includes pixel electrodes on a substrate, each pixel electrode having a top surface with a first reflectivity. A continuous reflective coating covers the pixel electrodes and substrate surfaces therebetween, forming a plurality of coated pixel electrodes having an enhanced reflectivity that exceeds the first reflectivity. A method for increasing pixel reflectivity in a LCOS panel includes depositing a continuous reflective coating covering both (1) a plurality of pixel electrodes on a substrate and (2) a plurality of inter-pixel substrate surfaces, and depositing a layer on the continuous reflective coating.
38
US2018113363A1
Liquid Crystal Display Device With Peripheral Electrode
Publication/Patent Number: US2018113363A1 Publication Date: 2018-04-26 Application Number: 15/299,842 Filing Date: 2016-10-21 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: G02F1/1343 Abstract: A liquid crystal display device includes a first substrate, a pixel array formed on the first substrate, a transparent substrate, a liquid crystal layer disposed between the pixel array and the transparent substrate, a transparent electrode disposed between the transparent substrate and the liquid crystal layer, and an input electrode. The transparent electrode has a longer first edge and an orthogonal shorter second edge. The input electrode extends along, and is electrically coupled along, the first edge of the transparent electrode and has lower impedance than a portion of the transparent electrode overlying the pixel array. The input electrode can include additional portion(s) that extend along, and that are electrically-coupled along, the other edges of the transparent electrode. The input electrode reduces the common voltage propagation delay across the transparent electrode and improves reduces intensity variation over the display area, even for high-frequency common voltage waveforms.
39
US2018205916A1
Imaging system having dual image sensors
Publication/Patent Number: US2018205916A1 Publication Date: 2018-07-19 Application Number: 15/408,724 Filing Date: 2017-01-18 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04M1/02 Abstract: An imaging system for capturing an image of an object comprises a first lens, a dichroic beam splitter, which transmits light of a color band and reflects light of all colors outside the color band, a first image sensor for capturing an image formed by the transmitted light in the color band, a second image sensor for capturing an image formed by the reflected light outside the color band. The first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor. The image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image.
40
US2018262725A1
Imaging system having four image sensors
Publication/Patent Number: US2018262725A1 Publication Date: 2018-09-13 Application Number: 15/456,937 Filing Date: 2017-03-13 Inventor: Fan chun sheng   Assignee: OmniVision Technologies, Inc.   IPC: H04N9/097 Abstract: An imaging system having four image sensors comprises a first dichroic filter, a second dichroic filter, and a third dichroic filter. The first dichroic filter reflects light having a first wavelength band and a second wavelength band toward a second dichroic filter, and transmits light having a third wavelength band and a fourth wavelength band toward the third dichroic filter. The second dichroic filter reflects light having the first wavelength band toward the first image sensor, and transmits light having the second wavelength band toward the second image sensor. The third dichroic filter reflects light having the third wavelength band toward the third image sensor, and transmits light having the fourth wavelength band toward the fourth image sensor. The first dichroic filter, the second dichroic filter, and the third dichroic filter are included in an integrated part.
Total 6 pages