| No. | Publication Number | Title | Publication/Patent Number Publication/Patent Number |
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Application Number Application Number |
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Inventor Inventor | Assignee Assignee |
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41 | US2018095290A1 |
Wafer-Level Liquid-Crystal-On-Silicon Projection Assembly, Systems and Methods
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Publication/Patent Number: US2018095290A1 | Publication Date: 2018-04-05 | Application Number: 15/817,064 | Filing Date: 2017-11-17 | Inventor： Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: G03B21/00 | Abstract: A wafer-level liquid-crystal-on-silicon (LCOS) projection assembly includes a LCOS display for spatially modulating light incident on the LCOS display and a polarizing beam-separating (PBS) layer for directing light to and from the LCOS display. A method for fabricating a LCOS projection system includes disposing a PBS wafer above an active-matrix wafer. The active-matrix wafer includes a plurality of active matrices for addressing liquid crystal display pixels. The method, further includes disposing a lens wafer above the PBS wafer. The lens wafer includes a plurality of lenses. Additionally, a method for fabricating a wafer-level polarizing beam includes bonding a PBS wafer and at least one other wafer to form a stacked wafer. The PBS wafer includes a PBS layer that contains a plurality of PBS film bands | |||
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42 | TW201843826A |
Chip-scale image sensor package and associated method of making
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Publication/Patent Number: TW201843826A | Publication Date: 2018-12-16 | Application Number: 107109297 | Filing Date: 2018-03-19 | Inventor： Lin, Wei Feng Tsai, Chen Wei Fan, Chun Sheng | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: H01L27/146 | Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film. | |||
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43 | US10152291B2 |
Multi-projector display box for use in retail marketing
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Publication/Patent Number: US10152291B2 | Publication Date: 2018-12-11 | Application Number: 14/885,305 | Filing Date: 2015-10-16 | Inventor： Fan chun sheng Lin, Wei-feng | Assignee: OmniVision Technologies, Inc. | IPC: G06F3/14 | Abstract: A novel multi-display projection box includes a housing that is short and wide, a set of display panels, a set of projectors, and a controller. In a particular embodiment the set of display panels includes two display panels, each coupled to opposite sides of the housing. The set of projectors includes two projectors placed adjacent opposite side walls of the housing. One of the projectors projects a first image onto one of the display panels and the other projector projects a second image onto the other display panel. The first and second image can include product information corresponding to goods placed atop the projection box in a retail store. | |||
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44 | TW201835609A |
Anti-reflective coating with high refractive index material at air interface
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Publication/Patent Number: TW201835609A | Publication Date: 2018-10-01 | Application Number: 106141082 | Filing Date: 2017-11-27 | Inventor： Lin, Wei-feng Fan chun sheng Tsai, Chen-wei | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: H01L27/146 | Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride. | |||
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45 | US2018219034A1 |
Anti-Reflective Coating with High Refractive Index Material at Air Interface
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Publication/Patent Number: US2018219034A1 | Publication Date: 2018-08-02 | Application Number: 15/421,879 | Filing Date: 2017-02-01 | Inventor： Lin, Wei-feng Tsai, Chen-wei Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: H01L27/146 | Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride. | |||
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46 | US2018294298A1 |
CHIP-SCALE IMAGE SENSOR PACKAGE AND ASSOCIATED METHOD OF MAKING
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Publication/Patent Number: US2018294298A1 | Publication Date: 2018-10-11 | Application Number: 15/480,131 | Filing Date: 2017-04-05 | Inventor： Tsai, Chen-wei Fan chun sheng Lin, Wei-feng | Assignee: OmniVision Technologies, Inc. | IPC: H01L27/146 | Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film. | |||
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47 | US2017160534A1 |
MICROSCOPE ATTACHMENT
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Publication/Patent Number: US2017160534A1 | Publication Date: 2017-06-08 | Application Number: 14/960,132 | Filing Date: 2015-12-04 | Inventor： Fan chun sheng | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: G02B21/36 | Abstract: A microscope attachment includes a lens apparatus with one or more lenses, a light source, and a sample holder. The sample holder is disposed between the lens apparatus and the light source and is positioned to transmit light from the light source through the sample holder and through the lens apparatus. The lens apparatus is disposed to enlarge an optical area in the sample holder. An attachment mechanism is disposed to connect the microscope attachment to a personal electronic device. | |||
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48 | TW201730621A |
Microscope attachment
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Publication/Patent Number: TW201730621A | Publication Date: 2017-09-01 | Application Number: 105130376 | Filing Date: 2016-09-20 | Inventor： Fan chun sheng | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: G01N35/10 | Abstract: A microscope attachment includes a lens apparatus with one or more lenses | |||
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49 | HK1192948A1 |
DEVICE AND METHOD FOR REDUCING SPECKLE IN PROJECTED IMAGES
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Publication/Patent Number: HK1192948A1 | Publication Date: 2017-08-18 | Application Number: 14106438 | Filing Date: 2014-06-26 | Inventor： Fan chun sheng | Assignee: OMNIVISION TECHNOLOGIES INC. | IPC: G02B | ||||
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50 | US9851575B2 |
Wafer-level liquid-crystal-on-silicon projection assembly
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Publication/Patent Number: US9851575B2 | Publication Date: 2017-12-26 | Application Number: 20/141,427 | Filing Date: 2014-05-15 | Inventor： Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02B13/00 | Abstract: A wafer-level liquid-crystal-on-silicon (LCOS) projection assembly includes a LCOS display for spatially modulating light incident on the LCOS display and a polarizing beam-separating (PBS) layer for directing light to and from the LCOS display. A method for fabricating a LCOS projection system includes disposing a PBS wafer above an active-matrix wafer. The active-matrix wafer includes a plurality of active matrices for addressing liquid crystal display pixels. The method | |||
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51 | US9835842B2 |
Microscope attachment
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Publication/Patent Number: US9835842B2 | Publication Date: 2017-12-05 | Application Number: 14/960,132 | Filing Date: 2015-12-04 | Inventor： Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02B21/06 | Abstract: A microscope attachment includes a lens apparatus with one or more lenses, a light source, and a sample holder. The sample holder is disposed between the lens apparatus and the light source and is positioned to transmit light from the light source through the sample holder and through the lens apparatus. The lens apparatus is disposed to enlarge an optical area in the sample holder. An attachment mechanism is disposed to connect the microscope attachment to a personal electronic device. | |||
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52 | TW201717376A |
Chip-scale packaged image sensor packages with black masking and associated packaging methods
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Publication/Patent Number: TW201717376A | Publication Date: 2017-05-16 | Application Number: 105133116 | Filing Date: 2016-10-13 | Inventor： Lin, Wei Feng Fan, Chun Sheng | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: H01L21/56 | Abstract: A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate | |||
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53 | US9568789B2 |
Panel carrier for a liquid crystal on silicon panel and method for electrically interconnecting same
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Publication/Patent Number: US9568789B2 | Publication Date: 2017-02-14 | Application Number: 14/547,986 | Filing Date: 2014-11-19 | Inventor： Lin, Wei-feng Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02F1/1345 | Abstract: A liquid-crystal-on-silicon (LCOS) panel includes a wafer having bond pads thereon, a liquid crystal layer, and a conductive layer. The panel carrier for the LCOS panel includes a conductive-layer electrode for electrically connecting the conductive layer to a printed circuit assembly (PCA), address electrodes for electrically connecting the bond pads to the PCA, and a cavity for holding the LCOS panel. The cavity includes a conductive pad for electrically connecting the conductive layer to the conductive-layer electrode, and bond-pad electrodes for electrically connecting each bond pad to a respective address electrode. A method for electrically connecting an LCOS panel to a panel carrier includes a step of electrically connecting each bond pad to a respective address electrode, and a step of electrically connecting the conductive layer to the conductive pad. | |||
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54 | US2017125467A1 |
Chip-Scale Packaged Image Sensor Packages With Black Masking And Associated Packaging Methods
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Publication/Patent Number: US2017125467A1 | Publication Date: 2017-05-04 | Application Number: 14/930,912 | Filing Date: 2015-11-03 | Inventor： Lin, Wei-feng Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: H01L27/146 | Abstract: A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b) forming black mask in the slots such that the black mask, for each of the image sensors, spans perimeter of the cover glass as viewed cross-sectionally along optical axis of the image sensors, and (c) dicing through the black mask in the slots to singulate a plurality of chip-scale packaged image sensors each including one of the image sensors and the cover glass bonded thereto, with sides of the cover glass facing away from the optical axis being at least partly covered by the black mask. | |||
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55 | US9812478B2 |
Aerogel-encapsulated image sensor and manufacturing method for same
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Publication/Patent Number: US9812478B2 | Publication Date: 2017-11-07 | Application Number: 14/639,610 | Filing Date: 2015-03-05 | Inventor： Fan chun sheng Lin, Wei-feng | Assignee: OmniVision Technologies, Inc. | IPC: H01L31/0216 | Abstract: An aerogel-encapsulated image sensor includes a device die with an image sensor fabricated thereon and an aerogel layer that encapsulates the image sensor. A method for encapsulating image sensor pixel arrays of respective bare image sensors formed on a sensor array sheet may include injecting an uncured aerogel portion on each image sensor pixel array, and curing each uncured aerogel portion. The step of curing may include at least one of (a) super-critical drying, (b) surface-modification drying, and (c) pinhole drying an uncured aerogel portion. The method may further include singulating the sensor array sheet into a plurality of aerogel-encapsulated image sensors. A method for encapsulating image sensor pixel arrays of respective bare image sensors on a device wafer may include forming an aerogel layer on each bare image sensor. The step of forming may include at least one of spin-coating, dip-coating, and spray-coating the aerogel layer. | |||
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56 | US9653504B1 |
Chip-scale packaged image sensor packages with black masking and associated packaging methods
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Publication/Patent Number: US9653504B1 | Publication Date: 2017-05-16 | Application Number: 14/930,912 | Filing Date: 2015-11-03 | Inventor： Lin, Wei-feng Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: H01L27/146 | Abstract: A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b) forming black mask in the slots such that the black mask, for each of the image sensors, spans perimeter of the cover glass as viewed cross-sectionally along optical axis of the image sensors, and (c) dicing through the black mask in the slots to singulate a plurality of chip-scale packaged image sensors each including one of the image sensors and the cover glass bonded thereto, with sides of the cover glass facing away from the optical axis being at least partly covered by the black mask. | |||
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57 | US2017109115A1 |
MULTI-PROJECTOR DISPLAY BOX
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Publication/Patent Number: US2017109115A1 | Publication Date: 2017-04-20 | Application Number: 14/885,305 | Filing Date: 2015-10-16 | Inventor： Fan chun sheng Lin, Wei-feng | Assignee: OmniVision Technologies, Inc. | IPC: G06F3/14 | Abstract: A novel multi-display projection box includes a housing that is short and wide, a set of display panels, a set of projectors, and a controller. In a particular embodiment the set of display panels includes two display panels, each coupled to opposite sides of the housing. The set of projectors includes two projectors placed adjacent opposite side walls of the housing. One of the projectors projects a first image onto one of the display panels and the other projector projects a second image onto the other display panel. The first and second image can include product information corresponding to goods placed atop the projection box in a retail store. | |||
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58 | TW201729174A |
Multi-projector display box
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Publication/Patent Number: TW201729174A | Publication Date: 2017-08-16 | Application Number: 105116883 | Filing Date: 2016-05-30 | Inventor： Lin, Wei-feng Fan chun sheng | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: G09F9/30 | Abstract: A novel multi-display projection box includes a housing that is short and wide | |||
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59 | TWI572898B |
Systems and methods for aligning a near-eye display device
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Publication/Patent Number: TWI572898B | Publication Date: 2017-03-01 | Application Number: 103117954 | Filing Date: 2014-05-22 | Inventor： Huang, Wei-feng Fan, Chun Sheng Wang, Yen Sung Liu, Yi Wei | Assignee: OMNIVISION TECHNOLOGIES, INC. | IPC: G02B27/01 | Abstract: A near-eye display system includes (a) a near-eye display device | |||
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60 | US9740030B2 |
Near-eye display systems, devices and methods
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Publication/Patent Number: US9740030B2 | Publication Date: 2017-08-22 | Application Number: 14/278,474 | Filing Date: 2014-05-15 | Inventor： Liu, Yi-wei Huang, Wei-feng Wang, Yen-sung Fan chun sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02F1/1335 | Abstract: A near-eye display device includes (a) a display unit having a liquid-crystal-on-silicon (LCOS) display and a first polarizing beam splitter interface for (i) reflecting illumination light from an illumination module towards the liquid-crystal-on-silicon display and (ii) transmitting display light from the LCOS display based on the illumination light, and (b) a viewing unit having an imaging objective that forms an image of the LCOS display for the pupil based on the display light, and a second polarizing beam splitter interface for (i) reflecting reflected display light from the imaging objective towards the pupil and (ii) transmitting ambient light from an ambient scene towards a pupil, the second polarizing beam splitter interface and the first polarizing beam splitter interface being orthogonal to a common plane. |
3.Current Quota