Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
US10622404B2
Imaging device, manufacturing method, and substrate dividing method
Publication/Patent Number: US10622404B2 Publication Date: 2020-04-14 Application Number: 15/740,958 Filing Date: 2016-07-19 Inventor: Yamaguchi, Masanari   Takachi, Taizo   Furuse, Shunsuke   Oinoue, Takashi   Ikebe, Yuki   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
2
US2020212087A1
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
Publication/Patent Number: US2020212087A1 Publication Date: 2020-07-02 Application Number: 16/815,842 Filing Date: 2020-03-11 Inventor: Yamaguchi, Masanari   Takachi, Taizo   Furuse, Shunsuke   Oinoue, Takashi   Ikebe, Yuki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
3
US2020273897A1
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
Publication/Patent Number: US2020273897A1 Publication Date: 2020-08-27 Application Number: 16/807,049 Filing Date: 2020-03-02 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
4
US10608028B2
Image sensor having improved dicing properties
Publication/Patent Number: US10608028B2 Publication Date: 2020-03-31 Application Number: 16/045,973 Filing Date: 2018-07-26 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/00 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
5
US2019244996A1
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2019244996A1 Publication Date: 2019-08-08 Application Number: 16/389,052 Filing Date: 2019-04-19 Inventor: Ooka, Yutaka   Furuse, Shunsuke   Maeda, Kensaku   Moriya, Yusuke   Miyazawa, Shinji   Hirano, Takaaki   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
6
US10332924B2
Package and electronic apparatus including a package having a microlens layer and color filter layer
Publication/Patent Number: US10332924B2 Publication Date: 2019-06-25 Application Number: 15/910,274 Filing Date: 2018-03-02 Inventor: Hirano, Takaaki   Miyazawa, Shinji   Maeda, Kensaku   Moriya, Yusuke   Furuse, Shunsuke   Ooka, Yutaka   Assignee: Sony Corporation   IPC: H04N5/374 Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
7
US2018197906A1
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
Publication/Patent Number: US2018197906A1 Publication Date: 2018-07-12 Application Number: 15/740,958 Filing Date: 2016-07-19 Inventor: Ikebe, Yuki   Oinoue, Takashi   Furuse, Shunsuke   Takachi, Taizo   Yamaguchi, Masanari   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
8
EP3326202A1
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
Publication/Patent Number: EP3326202A1 Publication Date: 2018-05-30 Application Number: 16748357.7 Filing Date: 2016-07-19 Inventor: Yamaguchi, Masanari   Takachi, Taizo   Furuse, Shunsuke   Oinoue, Takashi   Ikebe, Yuki   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146
9
KR20180033460A
촬상 소자, 제조 방법, 및 기판 분할 방법
Title (English): Photographic element, fabrication method and method of dividing substrate
Publication/Patent Number: KR20180033460A Publication Date: 2018-04-03 Application Number: 20177036540 Filing Date: 2016-07-19 Inventor: Yamaguchi, Masanari   Takachi, Taizo   Furuse, Shunsuke   Oinoue, Takashi   Ikebe, Yuki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: 본 발명의 촬상 소자 및 그 제조 방법은, 제1의 기판과, 상기 제1의 기판에 인접하는 제2의 기판을 포함하고, 상기 제2의 기판의 측벽이 블레이드 다이싱부 및 스텔스 다이싱부를 포함하는 하나 이상의 다이싱부를 포함하고; 제1의 기판과, 투명층과, 상기 제1의 기판과 상기 투명층 사이의 접착층과, 상기 제1의 기판이 상기 접착층과의 사이에 배치되는 제2의 기판과, 상기 접착층으로부터 상기 제2의 기판까지 연장되며, 상기 접착층으로 채워지는 홈을 포함한다.
10
US2018190700A1
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2018190700A1 Publication Date: 2018-07-05 Application Number: 15/910,274 Filing Date: 2018-03-02 Inventor: Ooka, Yutaka   Furuse, Shunsuke   Moriya, Yusuke   Maeda, Kensaku   Miyazawa, Shinji   Hirano, Takaaki   Assignee: SONY CORPORATION   IPC: H04N5/374 Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
11
US9941318B2
Semiconductor device and electronic apparatus including an organic material layer between a dummy lens and a transparent substrate
Publication/Patent Number: US9941318B2 Publication Date: 2018-04-10 Application Number: 15/621,871 Filing Date: 2017-06-13 Inventor: Hirano, Takaaki   Miyazawa, Shinji   Maeda, Kensaku   Moriya, Yusuke   Furuse, Shunsuke   Ooka, Yutaka   Assignee: Sony Corporation   IPC: H04N5/374 Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
12
US2018331142A1
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
Publication/Patent Number: US2018331142A1 Publication Date: 2018-11-15 Application Number: 16/045,973 Filing Date: 2018-07-26 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.