| No. | Publication Number | Title | Publication/Patent Number Publication/Patent Number |
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1 | US10622404B2 |
Imaging device, manufacturing method, and substrate dividing method
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Publication/Patent Number: US10622404B2 | Publication Date: 2020-04-14 | Application Number: 15/740,958 | Filing Date: 2016-07-19 | Inventor： Yamaguchi, Masanari Takachi, Taizo Furuse, Shunsuke Oinoue, Takashi Ikebe, Yuki | Assignee: Sony Semiconductor Solutions Corporation | IPC: H01L27/146 | Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer. | |||
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2 | US2020212087A1 |
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
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Publication/Patent Number: US2020212087A1 | Publication Date: 2020-07-02 | Application Number: 16/815,842 | Filing Date: 2020-03-11 | Inventor： Yamaguchi, Masanari Takachi, Taizo Furuse, Shunsuke Oinoue, Takashi Ikebe, Yuki | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H01L27/146 | Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer. | |||
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3 | US2020273897A1 |
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
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Publication/Patent Number: US2020273897A1 | Publication Date: 2020-08-27 | Application Number: 16/807,049 | Filing Date: 2020-03-02 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. | |||
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4 | US10608028B2 |
Image sensor having improved dicing properties
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Publication/Patent Number: US10608028B2 | Publication Date: 2020-03-31 | Application Number: 16/045,973 | Filing Date: 2018-07-26 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/00 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. | |||
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5 | US2019244996A1 |
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: US2019244996A1 | Publication Date: 2019-08-08 | Application Number: 16/389,052 | Filing Date: 2019-04-19 | Inventor： Ooka, Yutaka Furuse, Shunsuke Maeda, Kensaku Moriya, Yusuke Miyazawa, Shinji Hirano, Takaaki | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan. | |||
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6 | US10332924B2 |
Package and electronic apparatus including a package having a microlens layer and color filter layer
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Publication/Patent Number: US10332924B2 | Publication Date: 2019-06-25 | Application Number: 15/910,274 | Filing Date: 2018-03-02 | Inventor： Hirano, Takaaki Miyazawa, Shinji Maeda, Kensaku Moriya, Yusuke Furuse, Shunsuke Ooka, Yutaka | Assignee: Sony Corporation | IPC: H04N5/374 | Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan. | |||
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7 | US2018197906A1 |
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
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Publication/Patent Number: US2018197906A1 | Publication Date: 2018-07-12 | Application Number: 15/740,958 | Filing Date: 2016-07-19 | Inventor： Ikebe, Yuki Oinoue, Takashi Furuse, Shunsuke Takachi, Taizo Yamaguchi, Masanari | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H01L27/146 | Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer. | |||
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8 | EP3326202A1 |
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
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Publication/Patent Number: EP3326202A1 | Publication Date: 2018-05-30 | Application Number: 16748357.7 | Filing Date: 2016-07-19 | Inventor： Yamaguchi, Masanari Takachi, Taizo Furuse, Shunsuke Oinoue, Takashi Ikebe, Yuki | Assignee: Sony Semiconductor Solutions Corporation | IPC: H01L27/146 | ||||
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9 | KR20180033460A |
촬상 소자, 제조 방법, 및 기판 분할 방법
Title (English):
Photographic element, fabrication method and method of dividing substrate
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Publication/Patent Number: KR20180033460A | Publication Date: 2018-04-03 | Application Number: 20177036540 | Filing Date: 2016-07-19 | Inventor： Yamaguchi, Masanari Takachi, Taizo Furuse, Shunsuke Oinoue, Takashi Ikebe, Yuki | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H01L27/146 | Abstract: 본 발명의 촬상 소자 및 그 제조 방법은, 제1의 기판과, 상기 제1의 기판에 인접하는 제2의 기판을 포함하고, 상기 제2의 기판의 측벽이 블레이드 다이싱부 및 스텔스 다이싱부를 포함하는 하나 이상의 다이싱부를 포함하고; 제1의 기판과, 투명층과, 상기 제1의 기판과 상기 투명층 사이의 접착층과, 상기 제1의 기판이 상기 접착층과의 사이에 배치되는 제2의 기판과, 상기 접착층으로부터 상기 제2의 기판까지 연장되며, 상기 접착층으로 채워지는 홈을 포함한다. | |||
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10 | US2018190700A1 |
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: US2018190700A1 | Publication Date: 2018-07-05 | Application Number: 15/910,274 | Filing Date: 2018-03-02 | Inventor： Ooka, Yutaka Furuse, Shunsuke Moriya, Yusuke Maeda, Kensaku Miyazawa, Shinji Hirano, Takaaki | Assignee: SONY CORPORATION | IPC: H04N5/374 | Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan. | |||
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11 | US9941318B2 |
Semiconductor device and electronic apparatus including an organic material layer between a dummy lens and a transparent substrate
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Publication/Patent Number: US9941318B2 | Publication Date: 2018-04-10 | Application Number: 15/621,871 | Filing Date: 2017-06-13 | Inventor： Hirano, Takaaki Miyazawa, Shinji Maeda, Kensaku Moriya, Yusuke Furuse, Shunsuke Ooka, Yutaka | Assignee: Sony Corporation | IPC: H04N5/374 | Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan. | |||
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12 | US2018331142A1 |
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
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Publication/Patent Number: US2018331142A1 | Publication Date: 2018-11-15 | Application Number: 16/045,973 | Filing Date: 2018-07-26 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. |
