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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2021111204A1
SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC EQUIPMENT
Publication/Patent Number: US2021111204A1 Publication Date: 2021-04-15 Application Number: 16/496,773 Filing Date: 2018-03-16 Inventor: Hagimoto, Yoshiya   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to a semiconductor device, a solid-state imaging device, and electronic equipment, which are able to suppress increase of resistivity to a high level at a connection portion between an ESV and a wiring layer and to improve reliability of an electric connection using an ESV. The semiconductor device according to a first aspect of the present technology has a plurality of semiconductor substrates layered, and includes: a through electrode penetrating a silicon layer of the semiconductor substrates; a wiring layer formed inside the semiconductor substrates; and a through electrode reception part connected to the wiring layer, in which the through electrode has a width smaller than the through electrode reception part, and the through electrode is electrically connected to the wiring layer via the through electrode reception part. The present technology is applicable, for example, to a CMOS image sensor.
2
EP3329313B1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: EP3329313B1 Publication Date: 2021-02-17 Application Number: 16751016.3 Filing Date: 2016-07-15 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B13/00
3
US202020733A1
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: US202020733A1 Publication Date: 2020-01-16 Application Number: 20/181,649 Filing Date: 2018-02-15 Inventor: Hagimoto, Yoshiya   Fujii, Nobutoshi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: [Solution] Provided is a semiconductor device including a plurality of substrates that is stacked, each of the substrates including a semiconductor substrate and a multi-layered wiring layer stacked on the semiconductor substrate, the semiconductor substrate having a circuit with a predetermined function formed thereon. Bonding surfaces between at least two substrates among the plurality of substrates have an electrode junction structure in which electrodes formed on the respective bonding surfaces are joined in direct contact with each other, the electrode junction structure being a structure for electrical connection between the two substrates. In at least one of the two substrates, at least one of the electrode constituting the electrode junction structure or a via for connection of the electrode to a wiring line in the multi-layered wiring layer is provided with a porous film, the porous film including a porous material, in at least a partial region between an electrically-conductive material and a sidewall of a through hole filled with the electrically-conductive material, the electrically-conductive material constituting the electrode and the via.
4
US2020020733A1
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2020020733A1 Publication Date: 2020-01-16 Application Number: 16/497,106 Filing Date: 2018-02-15 Inventor: Fujii, Nobutoshi   Hagimoto, Yoshiya   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: [Object] To enable reliability to be further improved in a semiconductor device. [Solution] Provided is a semiconductor device including a plurality of substrates that is stacked, each of the substrates including a semiconductor substrate and a multi-layered wiring layer stacked on the semiconductor substrate, the semiconductor substrate having a circuit with a predetermined function formed thereon. Bonding surfaces between at least two substrates among the plurality of substrates have an electrode junction structure in which electrodes formed on the respective bonding surfaces are joined in direct contact with each other, the electrode junction structure being a structure for electrical connection between the two substrates. In at least one of the two substrates, at least one of the electrode constituting the electrode junction structure or a via for connection of the electrode to a wiring line in the multi-layered wiring layer is provided with a porous film, the porous film including a porous material, in at least a partial region between an electrically-conductive material and a sidewall of a through hole filled with the electrically-conductive material, the electrically-conductive material constituting the electrode and the via.
5
US10753551B2
Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
Publication/Patent Number: US10753551B2 Publication Date: 2020-08-25 Application Number: 15/554,872 Filing Date: 2016-01-27 Inventor: Hasegawa, Toshiaki   Aoyagi, Kenichi   Hagimoto, Yoshiya   Fujii, Nobutoshi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H05K1/18 Abstract: An electronic component mounting substrate 10A is configured of an electronic component 20, and a mounting substrate 10 mounting the electronic component 20 thereon, in which concave parts 24 are formed on a mounting surface 23 of the electronic component 20 opposite to the mounting substrate 10, a connection part 39 is exposed at the bottom of the concave part 24, and electronic component attachment parts 12 provided on the mounting substrate 10 are soldered to the connection parts 39 provided in the electronic component 20.
6
US10707258B2
Semiconductor device with multiple substrates electrically connected through an insulating film
Publication/Patent Number: US10707258B2 Publication Date: 2020-07-07 Application Number: 15/987,278 Filing Date: 2018-05-23 Inventor: Fujii, Nobutoshi   Hagimoto, Yoshiya   Aoyagi, Kenichi   Kagawa, Yoshihisa   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: A semiconductor device includes a first substrate having an attaching surface on which first electrodes and a first insulating film are exposed, an insulating thin film that covers the attaching surface of the first substrate, and a second substrate which has an attaching surface on which second electrodes and a second insulating film are exposed and is attached to the first substrate in a state in which the attaching surface of the second substrate and the attaching surface of the first substrate are attached together sandwiching the insulating thin film therebetween, and the first electrodes and the second electrodes deform and break a part of the insulating thin film so as to be directly electrically connected to each other.
7
US10699968B2
Semiconductor manufacturing apparatus
Publication/Patent Number: US10699968B2 Publication Date: 2020-06-30 Application Number: 13/408,293 Filing Date: 2012-02-29 Inventor: Takeya, Yukari   Iwamoto, Hayato   Hagimoto, Yoshiya   Motooka, Eizo   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L21/66 Abstract: A semiconductor manufacturing apparatus includes: a treatment chamber treating a treated film of a wafer using a desired chemical fluid; a film thickness measurement unit measuring an initial film thickness of the treated film before treatment and a final film thickness of the treated film after treatment; and a main body controlling unit calculating a treatment speed of the chemical fluid from the initial film thickness, the final film thickness, and a chemical fluid treatment time taken from the initial film thickness to the final film thickness to calculate a chemical fluid treatment time for a wafer to be treated next from the calculated treatment speed.
8
US10804313B2
Semiconductor device and solid-state imaging device
Publication/Patent Number: US10804313B2 Publication Date: 2020-10-13 Application Number: 16/001,278 Filing Date: 2018-06-06 Inventor: Kagawa, Yoshihisa   Fujii, Nobutoshi   Fukasawa, Masanaga   Kaneguchi, Tokihisa   Hagimoto, Yoshiya   Aoyagi, Kenichi   Mitsuhashi, Ikue   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present technology relates to a semiconductor device and a solid-state imaging device of which crack resistance can be improved in a simpler way. The semiconductor device has an upper substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and a second substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and is joined to the upper substrate. In addition, a pad for wire bonding or probing is formed in the upper substrate, and pads for protecting corner or side parts of the pad for wire bonding or probing are radially laminated and provided in each of the wiring layers between the pad and the Si substrate of the lower substrate. The present technology can be applied to a solid-state imaging device.
9
US2020083262A1
SOLID-STATE IMAGE SENSING DEVICE AND ELECTRONIC DEVICE
Publication/Patent Number: US2020083262A1 Publication Date: 2020-03-12 Application Number: 16/683,379 Filing Date: 2019-11-14 Inventor: Tayanaka, Hiroshi   Akiyama, Kentaro   Sakano, Yorito   Oinoue, Takashi   Hagimoto, Yoshiya   Matsumura, Yusuke   Sato, Naoyuki   Miyanami, Yuki   Ueda, Yoichi   Matsumoto, Ryosuke   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to a solid-state image sensing device and an electronic device for reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.
10
US202049959A1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: US202049959A1 Publication Date: 2020-02-13 Application Number: 20/191,650 Filing Date: 2019-07-10 Inventor: Ishida, Minoru   Iwasaki, Masanori   Hagimoto, Yoshiya   Shiraiwa, Toshiaki   Itou, Hiroyuki   Fujii, Nobutoshi   Matsugai, Hiroyasu   Moriya, Yusuke   Tazawa, Hiroshi   Oinoue, Takashi   Saito, Suguru   Ohshima, Keiji   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B27/00 Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
11
US2020049959A1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: US2020049959A1 Publication Date: 2020-02-13 Application Number: 16/507,984 Filing Date: 2019-07-10 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G02B13/00 Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.