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1 | TWI531687B |
Shunt plating machine and shunt electroplating method thereof
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Publication/Patent Number: TWI531687B | Publication Date: 2016-05-01 | Application Number: 102133639 | Filing Date: 2013-09-17 | Inventor： Wu, Zong-han He yao zong Liao, Pen Yi | Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD. | IPC: C25D19/00 | Abstract: A shunt plating machine is applicable for electroplating a plurality of circuit patterns to be plated | ||
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2 | TWI531688B |
Plating method featuring uniform coating thickness
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Publication/Patent Number: TWI531688B | Publication Date: 2016-05-01 | Application Number: 102133470 | Filing Date: 2013-09-16 | Inventor： Huang, Bo-cheng Lin, Fang-ru Lin, Zheng-yi Wu, Zong-han He yao zong Liao, Pen Yi | Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD. | IPC: C25D5/02 | Abstract: A plating method featuring uniform coating thickness comprises the steps of: forming a first metal layer on the surface of a non-conductive substrate; processing the first metal layer | ||
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3 | TW201512463A |
Shunt plating machine and shunt electroplating method thereof
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Publication/Patent Number: TW201512463A | Publication Date: 2015-04-01 | Application Number: 102133639 | Filing Date: 2013-09-17 | Inventor： Wu, Zong-han He yao zong Liao, Pen Yi | Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD. | IPC: C25D19/00 | Abstract: A shunt plating machine is applicable for electroplating a plurality of circuit patterns to be plated | ||
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4 | TW201512465A |
Plating method featuring uniform coating thickness
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Publication/Patent Number: TW201512465A | Publication Date: 2015-04-01 | Application Number: 102133470 | Filing Date: 2013-09-16 | Inventor： Huang, Bo-cheng Lin, Fang-ru Lin, Zheng-yi Wu, Zong-han He yao zong Liao, Pen Yi | Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD. | IPC: C25D5/02 | Abstract: A plating method featuring uniform coating thickness comprises the steps of: forming a first metal layer on the surface of a non-conductive substrate; processing the first metal layer |
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