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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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Inventor Inventor Assignee Assignee IPC IPC
1
TWI531687B
Shunt plating machine and shunt electroplating method thereof
Publication/Patent Number: TWI531687B Publication Date: 2016-05-01 Application Number: 102133639 Filing Date: 2013-09-17 Inventor: Wu, Zong-han   He yao zong   Liao, Pen Yi   Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD.   IPC: C25D19/00 Abstract: A shunt plating machine is applicable for electroplating a plurality of circuit patterns to be plated
2
TWI531688B
Plating method featuring uniform coating thickness
Publication/Patent Number: TWI531688B Publication Date: 2016-05-01 Application Number: 102133470 Filing Date: 2013-09-16 Inventor: Huang, Bo-cheng   Lin, Fang-ru   Lin, Zheng-yi   Wu, Zong-han   He yao zong   Liao, Pen Yi   Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD.   IPC: C25D5/02 Abstract: A plating method featuring uniform coating thickness comprises the steps of: forming a first metal layer on the surface of a non-conductive substrate; processing the first metal layer
3
TW201512463A
Shunt plating machine and shunt electroplating method thereof
Publication/Patent Number: TW201512463A Publication Date: 2015-04-01 Application Number: 102133639 Filing Date: 2013-09-17 Inventor: Wu, Zong-han   He yao zong   Liao, Pen Yi   Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD.   IPC: C25D19/00 Abstract: A shunt plating machine is applicable for electroplating a plurality of circuit patterns to be plated
4
TW201512465A
Plating method featuring uniform coating thickness
Publication/Patent Number: TW201512465A Publication Date: 2015-04-01 Application Number: 102133470 Filing Date: 2013-09-16 Inventor: Huang, Bo-cheng   Lin, Fang-ru   Lin, Zheng-yi   Wu, Zong-han   He yao zong   Liao, Pen Yi   Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD.   IPC: C25D5/02 Abstract: A plating method featuring uniform coating thickness comprises the steps of: forming a first metal layer on the surface of a non-conductive substrate; processing the first metal layer