Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
US10892496B2
Catalyst for solid polymer fuel cell and production method for the same
Publication/Patent Number: US10892496B2 Publication Date: 2021-01-12 Application Number: 15/323,286 Filing Date: 2015-07-21 Inventor: Ishida, Minoru   Matsutani, Koichi   Assignee: TANAKA KIKINZOKU KOGYO K.K.   IPC: H01M4/92 Abstract: The present invention provides a catalyst for a solid polymer fuel cell, having excellent initial activity and good durability and a production method thereof. The present invention is a catalyst for a solid polymer fuel cell, including catalyst particles composed of platinum or a platinum alloy supported on a carbon powder carrier, the catalyst having sulfo groups (—SO3H) at least on the catalyst particles, and the catalyst further having a fluorine compound having a C—F bond supported at least on the catalyst particles. It is preferred in the catalyst of the present invention that sulfur content is 800 ppm or more and 5000 ppm or less based on the mass of the whole catalyst and the amount of the fluorine compound is 3 mass % or more and 24 mass % or less based on the mass of the whole catalyst.
2
US10903503B2
Catalyst for solid polymer fuel cell and method for producing same
Publication/Patent Number: US10903503B2 Publication Date: 2021-01-26 Application Number: 16/580,154 Filing Date: 2019-09-24 Inventor: Ishida, Minoru   Matsutani, Koichi   Assignee: TANAKA KIKINZOKU KOGYO K.K.   IPC: H01M4/90 Abstract: The present invention is a catalyst for a solid polymer fuel cell including: catalyst particles of platinum, cobalt and manganese; and a carbon powder carrier supporting the catalyst particles, wherein the component ratio (molar ratio) of the platinum, cobalt and manganese of the catalyst particles is of Pt:Co:Mn=1:0.06 to 0.39:0.04 to 0.33, and wherein in an X-ray diffraction analysis of the catalyst particles, the peak intensity ratio of a Co—Mn alloy appearing around 2θ=27° is 0.15 or less on the basis of a main peak appearing around 2θ=40°. It is particularly preferred that the catalyst have a peak ratio of a peak of a CoPt3 alloy and an MnPt3 alloy appearing around 2θ=32° of 0.14 or more on the basis of a main peak.
3
US10923517B2
Solid-state imaging apparatus having output circuit unit for outputting a pixel signal
Publication/Patent Number: US10923517B2 Publication Date: 2021-02-16 Application Number: 16/854,344 Filing Date: 2020-04-21 Inventor: Tanaka, Harumi   Masuda, Yoshiaki   Miyazawa, Shinji   Ishida, Minoru   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.
4
US10886869B2
Control apparatus and vehicle drive system
Publication/Patent Number: US10886869B2 Publication Date: 2021-01-05 Application Number: 16/532,661 Filing Date: 2019-08-06 Inventor: Ishida, Minoru   Katayama, Naoki   Sakuishi, Tsubasa   Takahashi, Yuki   Assignee: DENSO CORPORATION   IPC: H02P29/00 Abstract: A control apparatus is applied to a vehicle including (i) a rotating electrical machine and (ii) a wheel speed sensor detecting a wheel speed. The control apparatus sets a rotation angle of the rotating electrical machine based on an estimated value of the rotation angle which is estimated based on a detection value of the wheel speed sensor.
5
US2021084249A1
IMAGING ELEMENT
Publication/Patent Number: US2021084249A1 Publication Date: 2021-03-18 Application Number: 16/956,141 Filing Date: 2018-12-27 Inventor: Nakazawa, Keiichi   Kitano, Yoshiaki   Yamashita, Hirofumi   Ishida, Minoru   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: An imaging element according to an embodiment of the present disclosure includes: a first substrate, a second substrate, and a third substrate that are stacked in this order. The first substrate including a sensor pixel that performs photoelectric conversion and the second substrate including a readout circuit are electrically coupled to each other by a first through wiring line provided in an interlayer insulating film. The second substrate and the third substrate including a logic circuit are electrically coupled to each other by a junction between pad electrodes or a second through wiring line penetrating through a semiconductor substrate.
6
US2021104572A1
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2021104572A1 Publication Date: 2021-04-08 Application Number: 16/498,739 Filing Date: 2018-03-23 Inventor: Kameshima, Takatoshi   Hashiguchi, Hideto   Mitsuhashi, Ikue   Horikoshi, Hiroshi   Shohji, Reijiroh   Ishida, Minoru   Iijima, Tadashi   Haneda, Masaki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: There is provided a solid-state imaging device including first, second, and third substrates stacked in this order. The first substrate includes a first semiconductor substrate and a first wiring layer. A pixel unit is formed on the first semiconductor substrate. The second substrate includes a second semiconductor substrate and a second wiring layer. The third substrate includes a third semiconductor substrate and a third wiring layer. A first coupling structure couples two of the first, second, and third substrates to each other includes a via. The via has a structure in which electrically-conductive materials are embedded in one through hole and another through hole, or a structure in which films including electrically-conductive materials are formed on inner walls of the through holes. The one through hole exposes a first wiring line in one of the wiring layers. The other through hole exposes a second wiring line in another wiring layer.
7
US2021104571A1
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS