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1 | US10892496B2 |
Catalyst for solid polymer fuel cell and production method for the same
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Publication/Patent Number: US10892496B2 | Publication Date: 2021-01-12 | Application Number: 15/323,286 | Filing Date: 2015-07-21 | Inventor： Ishida, Minoru Matsutani, Koichi | Assignee: TANAKA KIKINZOKU KOGYO K.K. | IPC: H01M4/92 | Abstract: The present invention provides a catalyst for a solid polymer fuel cell, having excellent initial activity and good durability and a production method thereof. The present invention is a catalyst for a solid polymer fuel cell, including catalyst particles composed of platinum or a platinum alloy supported on a carbon powder carrier, the catalyst having sulfo groups (—SO3H) at least on the catalyst particles, and the catalyst further having a fluorine compound having a C—F bond supported at least on the catalyst particles. It is preferred in the catalyst of the present invention that sulfur content is 800 ppm or more and 5000 ppm or less based on the mass of the whole catalyst and the amount of the fluorine compound is 3 mass % or more and 24 mass % or less based on the mass of the whole catalyst. | |||
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2 | US10903503B2 |
Catalyst for solid polymer fuel cell and method for producing same
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Publication/Patent Number: US10903503B2 | Publication Date: 2021-01-26 | Application Number: 16/580,154 | Filing Date: 2019-09-24 | Inventor： Ishida, Minoru Matsutani, Koichi | Assignee: TANAKA KIKINZOKU KOGYO K.K. | IPC: H01M4/90 | Abstract: The present invention is a catalyst for a solid polymer fuel cell including: catalyst particles of platinum, cobalt and manganese; and a carbon powder carrier supporting the catalyst particles, wherein the component ratio (molar ratio) of the platinum, cobalt and manganese of the catalyst particles is of Pt:Co:Mn=1:0.06 to 0.39:0.04 to 0.33, and wherein in an X-ray diffraction analysis of the catalyst particles, the peak intensity ratio of a Co—Mn alloy appearing around 2θ=27° is 0.15 or less on the basis of a main peak appearing around 2θ=40°. It is particularly preferred that the catalyst have a peak ratio of a peak of a CoPt3 alloy and an MnPt3 alloy appearing around 2θ=32° of 0.14 or more on the basis of a main peak. | |||
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3 | US10923517B2 |
Solid-state imaging apparatus having output circuit unit for outputting a pixel signal
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Publication/Patent Number: US10923517B2 | Publication Date: 2021-02-16 | Application Number: 16/854,344 | Filing Date: 2020-04-21 | Inventor： Tanaka, Harumi Masuda, Yoshiaki Miyazawa, Shinji Ishida, Minoru | Assignee: Sony Corporation | IPC: H01L27/146 | Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit. | |||
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4 | US10886869B2 |
Control apparatus and vehicle drive system
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Publication/Patent Number: US10886869B2 | Publication Date: 2021-01-05 | Application Number: 16/532,661 | Filing Date: 2019-08-06 | Inventor： Ishida, Minoru Katayama, Naoki Sakuishi, Tsubasa Takahashi, Yuki | Assignee: DENSO CORPORATION | IPC: H02P29/00 | Abstract: A control apparatus is applied to a vehicle including (i) a rotating electrical machine and (ii) a wheel speed sensor detecting a wheel speed. The control apparatus sets a rotation angle of the rotating electrical machine based on an estimated value of the rotation angle which is estimated based on a detection value of the wheel speed sensor. | |||
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5 | US2021084249A1 |
IMAGING ELEMENT
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Publication/Patent Number: US2021084249A1 | Publication Date: 2021-03-18 | Application Number: 16/956,141 | Filing Date: 2018-12-27 | Inventor： Nakazawa, Keiichi Kitano, Yoshiaki Yamashita, Hirofumi Ishida, Minoru | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H04N5/369 | Abstract: An imaging element according to an embodiment of the present disclosure includes: a first substrate, a second substrate, and a third substrate that are stacked in this order. The first substrate including a sensor pixel that performs photoelectric conversion and the second substrate including a readout circuit are electrically coupled to each other by a first through wiring line provided in an interlayer insulating film. The second substrate and the third substrate including a logic circuit are electrically coupled to each other by a junction between pad electrodes or a second through wiring line penetrating through a semiconductor substrate. | |||
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6 | US2021104572A1 |
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: US2021104572A1 | Publication Date: 2021-04-08 | Application Number: 16/498,739 | Filing Date: 2018-03-23 | Inventor： Kameshima, Takatoshi Hashiguchi, Hideto Mitsuhashi, Ikue Horikoshi, Hiroshi Shohji, Reijiroh Ishida, Minoru Iijima, Tadashi Haneda, Masaki | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H01L27/146 | Abstract: There is provided a solid-state imaging device including first, second, and third substrates stacked in this order. The first substrate includes a first semiconductor substrate and a first wiring layer. A pixel unit is formed on the first semiconductor substrate. The second substrate includes a second semiconductor substrate and a second wiring layer. The third substrate includes a third semiconductor substrate and a third wiring layer. A first coupling structure couples two of the first, second, and third substrates to each other includes a via. The via has a structure in which electrically-conductive materials are embedded in one through hole and another through hole, or a structure in which films including electrically-conductive materials are formed on inner walls of the through holes. The one through hole exposes a first wiring line in one of the wiring layers. The other through hole exposes a second wiring line in another wiring layer. | |||
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7 | US2021104571A1 |
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
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