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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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Inventor Inventor Assignee Assignee IPC IPC
1
US10699968B2
Semiconductor manufacturing apparatus
Publication/Patent Number: US10699968B2 Publication Date: 2020-06-30 Application Number: 13/408,293 Filing Date: 2012-02-29 Inventor: Takeya, Yukari   Iwamoto, Hayato   Hagimoto, Yoshiya   Motooka, Eizo   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L21/66 Abstract: A semiconductor manufacturing apparatus includes: a treatment chamber treating a treated film of a wafer using a desired chemical fluid; a film thickness measurement unit measuring an initial film thickness of the treated film before treatment and a final film thickness of the treated film after treatment; and a main body controlling unit calculating a treatment speed of the chemical fluid from the initial film thickness, the final film thickness, and a chemical fluid treatment time taken from the initial film thickness to the final film thickness to calculate a chemical fluid treatment time for a wafer to be treated next from the calculated treatment speed.
2
EP3540776A3
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3540776A3 Publication Date: 2020-01-08 Application Number: 19173175.1 Filing Date: 2014-12-12 Inventor: Komai, Naoki   Sasaki, Naoto   Ogawa, Naoki   Oinoue, Takashi   Iwamoto, Hayato   Ooka, Yutaka   Nagata, Masaya   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: A semiconductor device (1) includes a first semiconductor substrate (12) in which a pixel region (21) where pixel portions performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate (11) in which a logic circuit (23) processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate (18) protecting an on-chip lens (16) is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin (17) interposed therebetween.
3
US10249665B2
Solid-state imaging device and method of manufacturing solid-state imaging device
Publication/Patent Number: US10249665B2 Publication Date: 2019-04-02 Application Number: 12/805,090 Filing Date: 2010-07-12 Inventor: Yamamoto, Yuichi   Iwamoto, Hayato   Assignee: Sony Corporation   IPC: H01L23/544 Abstract: A solid state imaging device having a back-illuminated type structure in which a lens is formed on the back side of a silicon layer with a light-receiving sensor portion being formed thereon. Insulating layers are buried into the silicon layer around an image pickup region, with the insulating layer being buried around a contact layer that connects an electrode layer of a pad portion and an interconnection layer of the surface side. A method of manufacturing such a solid-state imaging device is also provided.
4
EP3540776A2
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3540776A2 Publication Date: 2019-09-18 Application Number: 19173175.1 Filing Date: 2014-12-12 Inventor: Komai, Naoki   Sasaki, Naoto   Ogawa, Naoki   Oinoue, Takashi   Iwamoto, Hayato   Ooka, Yutaka   Nagata, Masaya   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: A semiconductor device (1) includes a first semiconductor substrate (12) in which a pixel region (21) where pixel portions performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate (11) in which a logic circuit (23) processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate (18) protecting an on-chip lens (16) is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin (17) interposed therebetween.
5
EP3084831B1
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3084831B1 Publication Date: 2019-05-08 Application Number: 14821306.9 Filing Date: 2014-12-12 Inventor: Komai, Naoki   Sasaki, Naoto   Ogawa, Naoki   Oinoue, Takashi   Iwamoto, Hayato   Ooka, Yutaka   Nagata, Masaya   Assignee: Sony Corporation   IPC: H01L27/146