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1
US2020227253A1
SUPERCRITICAL DRYING APPARATUS AND METHOD OF DRYING SUBSTRATE USING THE SAME
Publication/Patent Number: US2020227253A1 Publication Date: 2020-07-16 Application Number: 16/561,078 Filing Date: 2019-09-05 Inventor: Park, Sangjine   Cho, Byung-kwon   Jeong, Jihoon   Kim, Youngtak   Ko, Yongsun   Jeon, Seulgee   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: H01L21/02 Abstract: A supercritical drying apparatus and a method of drying a substrate, the apparatus including a drying chamber configured to receive a supercritical fluid and to dry a substrate; a chuck in the drying chamber, the chuck being configured to receive the substrate; and a particle remover in the drying chamber, the particle remover being configured to remove dry particles from the substrate by heating the substrate with radiant heat.
2
US2020388484A1
WAFER CLEANING APPARATUS BASED ON LIGHT IRRADIATION AND WAFER CLEANING SYSTEM INCLUDING THE SAME
Publication/Patent Number: US2020388484A1 Publication Date: 2020-12-10 Application Number: 16/744,667 Filing Date: 2020-01-16 Inventor: Cho, Byungkwon   Park, Sangjine   Ko, Yongsun   Jeon, Seulgee   Jeong, Jihoon   Hong, Seongsik   Assignee: Samsung Electronics Co., Ltd.   IPC: H01L21/02 Abstract: Provided are a wafer cleaning apparatus based on light irradiation capable of effectively cleaning residue on a wafer without damaging the wafer, and a wafer cleaning system including the cleaning apparatus. The wafer cleaning apparatus is configured to clean residue on the wafer by light irradiation and includes: a light irradiation unit configured to irradiate light onto the wafer during the light irradiation; a wafer processing unit configured accommodate the wafer and to control a position of the wafer such that the light is irradiated onto the wafer during the light irradiation; and a cooling unit configured to cool the wafer after the light irradiation has been completed. The light irradiation unit, the wafer processing unit, and the cooling unit are sequentially arranged in a vertical structure with the light irradiation unit above the wafer processing unit and the wafer processing unit above the cooling unit.