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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2021020546A1
SEMICONDUCTOR DEVICE, IMAGING UNIT, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2021020546A1 Publication Date: 2021-01-21 Application Number: 16/978,576 Filing Date: 2019-02-18 Inventor: Kamei, Takahiro   Ootsuka, Yoichi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L23/48 Abstract: Provided is a semiconductor device having high planarity in an in-plane direction. This semiconductor device includes a semiconductor substrate, a first plating film pattern, a second plating film pattern, and an insulating layer. The semiconductor substrate has a first surface, and a second surface on a side opposite to the first surface. The first plating film pattern includes a first portion that covers a first regional portion of the first surface, and a second portion that is stacked to cover a portion of the first portion. The second plating film pattern includes a third portion that covers a second regional portion different from the first regional portion of the first surface, and also includes a fourth portion that is stacked to cover a portion of the third portion. A portion between the second portion and the fourth portion is filled with the insulating layer.
2
WO2020017205A1
IMAGING ELEMENT AND ELECTRONIC DEVICE
Publication/Patent Number: WO2020017205A1 Publication Date: 2020-01-23 Application Number: 2019023618 Filing Date: 2019-06-14 Inventor: Yoshida, Hirokazu   Ishii, Wataru   Matsuoka, Shinichi   Kamei, Takahiro   Ooka, Yutaka   Masuda, Yoshiaki   Saito, Sotetsu   Sato, Naoki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: An imaging element according to one embodiment of the present invention includes: a sensor substrate which has a light-receiving region in which a plurality of light-receiving elements is arranged and a surrounding region provided around the light-receiving region; a sealing member that is disposed facing one side of the sensor substrate; a resin layer that bonds together the sensor substrate and the sealing member; and a recessed part which is provided in the surrounding region on the one side of the sensor substrate and which has the resin layer embedded therein. The resin layer has one or a plurality of voids on the inside of the recessed part in plan view.
3
WO2019176454A1
SEMICONDUCTOR DEVICE, IMAGING APPARATUS, AND ELECTRONIC APPARATUS
Publication/Patent Number: WO2019176454A1 Publication Date: 2019-09-19 Application Number: 2019005808 Filing Date: 2019-02-18 Inventor: Ootsuka, Yoichi   Kamei, Takahiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: Provided is a semiconductor device having high flatness in the in-surface direction. This semiconductor device has a semiconductor substrate, a first plating film pattern, a second plating film pattern, and an insulation layer. The semiconductor substrate has a first surface, and a second surface on the opposite side to the first surface. The first plating film pattern includes: a first portion that covers a first area portion in the first surface; and a second portion that is laminated so as to cover a part of the first portion. The second plating film pattern includes: a third portion that covers a second area portion different from the first area portion in the first surface; and a fourth portion that is laminated so as to cover a part of the third portion. The insulation layer fills a space between the second portion and the fourth portion.
4
JP2019161046A
SEMICONDUCTOR DEVICE, IMAGING APPARATUS, AND ELECTRONIC EQUIPMENT
Publication/Patent Number: JP2019161046A Publication Date: 2019-09-19 Application Number: 2018046712 Filing Date: 2018-03-14 Inventor: Otsuka, Yoichi   Kamei, Takahiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: H04N5/369 Abstract: To provide a semiconductor device having a high flatness in an in-plane direction.SOLUTION: The semiconductor device includes: a semiconductor substrate; a first plating film pattern; a second plating film pattern; and an insulation layer. The semiconductor substrate includes: a first surface; and a second surface on the side opposite to the first surface. The first plating film pattern includes: a first part covering a first region part of the first surface; and a second part laminated so as to cover a part of the first part. The second plating film pattern includes: a third part covering a second region part different from the first region part out of the first surface; and a fourth part laminated so as to cover a part of the third part. The insulation layer fills a gap between the second part and the fourth part.SELECTED DRAWING: Figure 1A
5
US9419434B2
Power switching apparatus, power supply unit, and computer system
Publication/Patent Number: US9419434B2 Publication Date: 2016-08-16 Application Number: 14/254,382 Filing Date: 2014-04-16 Inventor: Eguchi, Susumu   Kamei, Takahiro   Assignee: FUJITSU LIMITED   FUJITSU ADVANCED ENGINEERING LIMITED   IPC: H02J3/38 Abstract: A power switching apparatus includes: a first input terminal to which first power is supplied; a second input terminal to which second power is supplied, the second power having a voltage that is lower than a voltage that the first power has; a first output terminal to supply to an outside the first power supplied to the first input terminal; and a second output terminal to supply to the outside the second power supplied to the second input terminal. First switching means manages the supplying of the second power from the first input terminal to the second output terminal. Second switching means manages the supplying of the second power from the second input terminal to the second output terminal. A processor manages the supplies of the first power and the second power using the first and second switching means.
6
US8943963B2
Method for producing metal thin film
Publication/Patent Number: US8943963B2 Publication Date: 2015-02-03 Application Number: 13/233,581 Filing Date: 2011-09-15 Inventor: Tanaka, Masanobu   Ishihara, Hirotsugu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: Sony Corporation   IPC: B41F1/00 Abstract: A method for producing a metal thin film on a substrate includes: a step of applying an ink to a flat blanket; a first transfer step of bringing the first blanket and a letterpress having a predetermined pattern of projections into contact by a pressure compression while the flat blanked and the letterpress being disposed opposite each other, to selectively transfer a portion of the ink on the flat blanket corresponding to the projections to the letterpress; a second transfer step of bringing the flat blanket obtained after the first transfer step and the substrate into contact by pressure compression while the flat blanket and the substrate being disposed opposite each other, to transfer the ink remaining on the flat blanket to the substrate; and a step of subjecting the substrate obtained after the second transfer step to electroless plating to deposit a metal thin film on the substrate.
7
US8943968B2
Method for producing metal thin film
Publication/Patent Number: US8943968B2 Publication Date: 2015-02-03 Application Number: 13/346,051 Filing Date: 2012-01-09 Inventor: Tanaka, Masanobu   Ishihara, Hirotsugu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: Sony Corporation   IPC: B41F1/00 Abstract: A method for producing a metal thin film on a substrate includes: a step of applying an ink to a flat blanket; a first transfer step of bringing the first blanket and a letterpress having a predetermined pattern of projections into contact by a pressure compression while the flat blanked and the letterpress being disposed opposite each other, to selectively transfer a portion of the ink on the flat blanket corresponding to the projections to the letterpress; a second transfer step of bringing the flat blanket obtained after the first transfer step and the substrate into contact by pressure compression while the flat blanket and the substrate being disposed opposite each other, to transfer the ink remaining on the flat blanket to the substrate; and a step of subjecting the substrate obtained after the second transfer step to electroless plating to deposit a metal thin film on the substrate.
8
US2014225438A1
POWER SWITCHING APPARATUS, POWER SUPPLY UNIT, AND COMPUTER SYSTEM
Publication/Patent Number: US2014225438A1 Publication Date: 2014-08-14 Application Number: 14/254,382 Filing Date: 2014-04-16 Inventor: Eguchi, Susumu   Kamei, Takahiro   Assignee: FUJITSU LIMITED   FUJITSU ADVANCED ENGINEERING LIMITED   IPC: H02J1/00 Abstract: A power switching apparatus includes: a first input terminal to which first power is supplied; a second input terminal to which second power is supplied, the second power having a voltage that is lower than a voltage that the first power has; a first output terminal to supply to an outside the first power supplied to the first input terminal; and a second output terminal to supply to the outside the second power supplied to the second input terminal. First switching means manages the supplying of the second power from the first input terminal to the second output terminal. Second switching means manages the supplying of the second power from the second input terminal to the second output terminal. A processor manages the supplies of the first power and the second power using the first and second switching means.
9
JP5380958B2
TRANSFER PATTERN FORMING METHOD AND TRANSFER PATTERN FORMING BLANKET
Publication/Patent Number: JP5380958B2 Publication Date: 2014-01-08 Application Number: 2008227759 Filing Date: 2008-09-05 Inventor: Ishihara, Hiroshi   Tanaka, Masanobu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: SONY CORP   IPC: B41F17/14 Abstract: PROBLEM TO BE SOLVED: To perform excellent transfer in both pattern transfer to a blanket and to a substrate. SOLUTION: This transfer pattern forming method includes: an application process for applying ink 2 to the surface of a PDMS (polydimethylsiloxane) layer 12 using the blanket 1 which is formed by laminating a hard base material 11 formed with a recess 11a and the PDMS layer 12 softer than the base material 11 and where the PDMS layer 12 is thicker in the position of the recess 11a than the other part; a first transfer process for using a plate 3 provided with a recess 3a in the position of a pattern to be formed
10
JP5527454B2
TRANSFER DEVICE
Publication/Patent Number: JP5527454B2 Publication Date: 2014-06-18 Application Number: 2013068654 Filing Date: 2013-03-28 Inventor: Ishihara, Hiroshi   Tanaka, Masanobu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: SONY CORP   IPC: B41F1/00 Abstract: PROBLEM TO BE SOLVED: To provide a forming method of a metal thin film
11
JP5195439B2
PRINTING METHOD AND METHOD OF MANUFACTURING DISPLAY DEVICE
Publication/Patent Number: JP5195439B2 Publication Date: 2013-05-08 Application Number: 2009001248 Filing Date: 2009-01-07 Inventor: Tanaka, Masanobu   Kamei, Takahiro   Assignee: SONY CORP   IPC: B41F17/14 Abstract: PROBLEM TO BE SOLVED: To provide a printing method which can make a clear-cut printing compared with the conventional method
12
US8381649B2
Printing method and display apparatus manufacturing method
Publication/Patent Number: US8381649B2 Publication Date: 2013-02-26 Application Number: 12/646,476 Filing Date: 2009-12-23 Inventor: Tanaka, Masanobu   Kamei, Takahiro   Assignee: Sony Corporation   IPC: B41F16/00 Abstract: A printing method including the steps of, forming a transfer layer on a blanket, forming a groove portion on the transfer layer by pressing a protrusion portion of a mold member including the protrusion portion having a predetermined pattern against the transfer layer, the groove portion having the pattern corresponding to the protrusion portion, forming a print pattern layer on the blanket by causing the transfer layer on the blanket and a relief printing plate including a convex portion having a pattern corresponding to a reverse pattern of the protrusion portion to face each other and pressure-contacting them so that a portion on the transfer layer corresponding to the convex portion is selectively eliminated, and transferring the print pattern layer onto a substrate to be printed by causing the print pattern layer on the blanket and the substrate to be printed to face each other and pressure-contacting them.
13
WO2013065136A1
POWER SUPPLY SWITCHING DEVICE
Publication/Patent Number: WO2013065136A1 Publication Date: 2013-05-10 Application Number: 2011075229 Filing Date: 2011-11-01 Inventor: Kamei, Takahiro   Eguchi, Susumu   Assignee: Fujitsu Limited   KAMEI, TAKAHIRO   FUJITSU ADVANCED ENGINEERING LIMITED   EGUCHI, SUSUMU   IPC: G06F1/26 Abstract: One system to which the present invention has been applied is predicated on being provided with: a first input terminal to which a first power is supplied; a second input terminal to which a second power of a lower voltage than the first power is supplied; a first output terminal for supplying
14
JP5376136B2
METHOD AND DEVICE FOR FORMING PATTERN
Publication/Patent Number: JP5376136B2 Publication Date: 2013-12-25 Application Number: 2009090175 Filing Date: 2009-04-02 Inventor: Ishihara, Hiroshi   Tanaka, Masanobu   Kamei, Takahiro   Chin, Kaisho   Assignee: SONY CORP   IPC: B05C11/04 Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a pattern which can highly precisely form a high-definition pattern. SOLUTION: A hollow 17 is formed as a template structure 18 on a substrate 11
15
JP5177260B2
PATTERN TRANSFER METHOD
Publication/Patent Number: JP5177260B2 Publication Date: 2013-04-03 Application Number: 2011168000 Filing Date: 2011-08-01 Inventor: Ishihara, Hiroshi   Tanaka, Masanobu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: SONY CORP   IPC: H05K3/12 Abstract: PROBLEM TO BE SOLVED: To provide a forming method of a metal thin film which can be made finer and higher in yield than before
16
JP2013154643A
TRANSFER DEVICE
Publication/Patent Number: JP2013154643A Publication Date: 2013-08-15 Application Number: 2013068654 Filing Date: 2013-03-28 Inventor: Ishihara, Hiroshi   Tanaka, Masanobu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: SONY CORP   IPC: B41F1/00 Abstract: PROBLEM TO BE SOLVED: To provide a forming method of a metal thin film
17
JP2013032022A
TRANSFER DEVICE
Publication/Patent Number: JP2013032022A Publication Date: 2013-02-14 Application Number: 2012249304 Filing Date: 2012-11-13 Inventor: Ishihara, Hiroshi   Tanaka, Masanobu   Shimamura, Toshiki   Kamei, Takahiro   Assignee: SONY CORP   IPC: B41F1/00 Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a metal thin film
18
KR101222420B1
METHOD FOR MAKING THIN-FILM SEMICONDUCTOR DEVICE
Publication/Patent Number: KR101222420B1 Publication Date: 2013-01-16 Application Number: 20050091280 Filing Date: 2005-09-29 Inventor: Machida, Akio   Akao, Hirotaka   Nakao, Isamu   Kamei, Takahiro   Assignee: Sony Corporation   IPC: H01L29/786
19
US8394728B2
Film deposition method and manufacturing method of semiconductor device
Publication/Patent Number: US8394728B2 Publication Date: 2013-03-12 Application Number: 12/694,342 Filing Date: 2010-01-27 Inventor: Akao, Hirotaka   Kaino, Yuriko   Kamei, Takahiro   Hara, Masaki   Kurihara, Kenichi   Assignee: Sony Corporation   IPC: H01L21/469 Abstract: A film deposition method includes the steps of: coating a solution containing a polysilane compound on a substrate to form a coating film and then carrying out a first thermal treatment in an inert atmosphere, thereby forming the coating film into a silicon film; forming a coating film containing a polysilane compound on the silicon film and then carrying out a second thermal treatment in an inert atmosphere or a reducing atmosphere, thereby forming the coating film into a silicon oxide precursor film; and carrying out a third thermal treatment in an oxidizing atmosphere, thereby forming the silicon oxide precursor film into a silicon oxide film and simultaneously densifying the silicon film.
20
JP4904221B2
SENSOR ASSEMBLY
Publication/Patent Number: JP4904221B2 Publication Date: 2012-03-28 Application Number: 2007207081 Filing Date: 2007-08-08 Inventor: Kamei, Takahiro   Eguchi, Yoshimasa   Assignee: HONDA MOTOR CO LTD   IPC: B60R19/48 Abstract: PROBLEM TO BE SOLVED: To provide a sensor assembly capable of precisely detecting the load at crash. SOLUTION: The sensor assembly 10 comprises sensor elements 47
Total 23 pages