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1
US2021050322A1
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
Publication/Patent Number: US2021050322A1 Publication Date: 2021-02-18 Application Number: 17/086,785 Filing Date: 2020-11-02 Inventor: Sato, Hiroaki   Kang, Teck-gyu   Haba, Belgacem   Osborn, Philip R.   Wang, Wei-shun   Chau, Ellis   Mohammed, Ilyas   Masuda, Norihito   Sakuma, Kazuo   Hashimoto, Kiyoaki   Inetaro, Kurosawa   Kikuchi, Tomoyuki   Assignee: Tessera, Inc.   IPC: H01L23/00 Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
2
US2020062927A1
ORGANIC-INORGANIC HYBRID COMPOSITION, AND ARTICLE AND OPTICAL COMPONENT INCLUDING THE SAME
Publication/Patent Number: US2020062927A1 Publication Date: 2020-02-27 Application Number: 16/549,907 Filing Date: 2019-08-23 Inventor: Kikuchi, Tomoyuki   Oishi, Yoshiyuki   Kamitani, Ryosuke   Yamada, Yukika   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: C08K9/06 Abstract: An organic-inorganic hybrid composition including a polymer having a triazine ring structure in a main chain of the polymer (A); an inorganic particulate (B); and a surface-treating agent having a triazine ring structure represented by Formula (1)(C): wherein, in Formula (1), R1 is a carboxyl group, a phosphoric acid group, a sulfo group, or a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group, or a substituted or unsubstituted amino group, wherein a number median diameter (Dn50) of the inorganic particulate (B) is greater than or equal to about 1 nm and less than or equal to about 20 nm.
3
US2020062907A1
TRIAZINE RING-CONTAINING POLYMER, AND THERMOPLASTIC ARTICLE AND OPTICAL COMPONENT INCLUDING THE SAME
Publication/Patent Number: US2020062907A1 Publication Date: 2020-02-27 Application Number: 16/549,885 Filing Date: 2019-08-23 Inventor: Oishi, Yoshiyuki   Kamitani, Ryosuke   Kikuchi, Tomoyuki   Yamada, Yukika   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: C08G75/04 Abstract: Disclosed is a triazine ring-containing polymer including a repeating unit represented by Formula (1) and has a number average molecular weight of greater than about 20000 g/mol and less than or equal to about 50000 g/mol: wherein, in Formula (1), R1 is each independently a C1 to C5 alkyl group and R2 is each independently a divalent group having at least one aromatic hydrocarbon group.
4
US2020362112A1
TRIAZINE RING-CONTAINING POLYMER, AND THERMOPLASTIC ARTICLE AND OPTICAL PART INCLUDING SAME
Publication/Patent Number: US2020362112A1 Publication Date: 2020-11-19 Application Number: 15/931,237 Filing Date: 2020-05-13 Inventor: Oishi, Yoshiyuki   Miyazaki, Eigo   Kikuchi, Tomoyuki   Yamada, Yukika   Assignee: SAMSUNG ELECTRONICS CO., LTD.   National University Corporation Iwat University   IPC: C08G73/06 Abstract: A triazine ring-containing polymer including a structural unit represented by General Formula 1: *-[A-B-]-*  General Formula 1 wherein, in General Formula 1, A is represented by General Formula 2, B is represented by General Formula 3, and * indicates a point linked to another group or structural unit: wherein, in General Formula 2 and General Formula 3, L, R1 to R6, m1, n1, and * are the same as defined in the detailed description.
5
US2020208011A1
BARRIER FILMS AND QUANTUM DOT POLYMER COMPOSITE ARTICLES INCLUDING THE SAME
Publication/Patent Number: US2020208011A1 Publication Date: 2020-07-02 Application Number: 16/812,447 Filing Date: 2020-03-09 Inventor: Kikuchi, Tomoyuki   Jang, Eunjoo   Kang, Hyun A   Won, Nayoun   Cho, Oul   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: C09D181/00 Abstract: A barrier film comprising: a substrate; a first layer disposed on the substrate and comprising an oxidation product of polysilazane; and a second layer disposed directly on the first layer and comprising a thiol-ene polymer, wherein the polysilazane comprises a repeating unit represented by Chemical Formula 1, wherein R1 and R2 are each independently hydrogen, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an alkylsilyl group, an alkylamino group, an alkoxy group, or an aromatic hydrocarbon group, and wherein the thiol-ene polymer is a polymerization product of a monomer combination including a first monomer having at least two thiol groups at its terminal end and a second monomer having at least two carbon-carbon unsaturated bond-containing groups at its terminal end.
6
US10717866B2
Organic-inorganic hybrid composition, and article and optical component including the same
Publication/Patent Number: US10717866B2 Publication Date: 2020-07-21 Application Number: 15/903,562 Filing Date: 2018-02-23 Inventor: Oishi, Yoshiyuki   Miyao, Hiroshi   Kikuchi, Tomoyuki   Yamada, Yukika   Kamitani, Ryosuke   Assignee: Samsung Electronics Co., Ltd.   IPC: C08L69/00 Abstract: Disclosed an organic-inorganic hybrid composition including a polymer (A) including a triazine ring structure represented by General Formula (1) in a polymer main chain structure; wherein, in the formula, R1 is a substituted or unsubstituted alkyl group, aryl group, aralkyl group, amino group, arylamino group, alkylthio group, or arylthio group, an inorganic particulate (B); and a surface-treatment agent (C) including an acidic functional group wherein the polymer (A) is a thermoplastic polymer having a glass transition temperature (Tg) and a number median diameter (Dn50) of the inorganic particulate (B) is greater than or equal to about 1 nm and less than or equal to about 20 nm, and an article and an optical component including the organic-inorganic hybrid composition.
7
US10559726B2
Layered structures and quantum dot sheets and electronic devices including the same
Publication/Patent Number: US10559726B2 Publication Date: 2020-02-11 Application Number: 15/581,861 Filing Date: 2017-04-28 Inventor: Kang, Hyun A   Won, Nayoun   Jang, Eun Joo   Kwon, Ha Il   Lee, Jeong Hee   Cho, Oul   Kikuchi, Tomoyuki   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: C09K11/02 Abstract: A layered structure having a first layer including a polymerization product of a monomer combination including a first monomer having at least two thiol groups at its terminal end and a second monomer having at least two carbon-carbon unsaturated bond-containing groups at its terminal end, wherein the first monomer includes a first thiol compound represented by Chemical Formula 1-1 including a thioglycolate moiety and a second thiol represented by Chemical Formula 1-2, and wherein the second monomer includes an ene compound represented by Chemical Formula 2: wherein in Chemical Formulae 1-1, 1-2, and 2, groups and variables are the same as described in the specification.
8
US10593643B2
Package-on-package assembly with wire bonds to encapsulation surface
Publication/Patent Number: US10593643B2 Publication Date: 2020-03-17 Application Number: 16/058,425 Filing Date: 2018-08-08 Inventor: Kikuchi, Tomoyuki   Inetaro, Kurosawa   Hashimoto, Kiyoaki   Sakuma, Kazuo   Masuda, Norihito   Mohammed, Ilyas   Chau, Ellis   Wang, Wei-shun   Osborn, Philip R.   Haba, Belgacem   Kang, Teck-gyu   Sato, Hiroaki   Assignee: Tessera, Inc.   IPC: H01L23/538 Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
9
US10833044B2
Package-on-package assembly with wire bonds to encapsulation surface
Publication/Patent Number: US10833044B2 Publication Date: 2020-11-10 Application Number: 16/778,899 Filing Date: 2020-01-31 Inventor: Sato, Hiroaki   Kang, Teck-gyu   Haba, Belgacem   Osborn, Philip R.   Wang, Wei-shun   Chau, Ellis   Mohammed, Ilyas   Masuda, Norihito   Sakuma, Kazuo   Hashimoto, Kiyoaki   Inetaro, Kurosawa   Kikuchi, Tomoyuki   Assignee: Tessera, Inc.   IPC: H01L23/00 Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
10
US2020168579A1
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
Publication/Patent Number: US2020168579A1 Publication Date: 2020-05-28 Application Number: 16/778,899 Filing Date: 2020-01-31 Inventor: Sato, Hiroaki   Kang, Teck-gyu   Haba, Belgacem   Osborn, Philip R.   Wang, Wei-shun   Chau, Ellis   Mohammed, Ilyas   Masuda, Norihito   Sakuma, Kazuo   Hashimoto, Kiyoaki   Inetaro, Kurosawa   Kikuchi, Tomoyuki   Assignee: Tessera, Inc.   IPC: H01L23/00 Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
11
JP2019056232A
CONSTRUCTION METHOD OF UNDERGROUND STRUCTURE
Publication/Patent Number: JP2019056232A Publication Date: 2019-04-11 Application Number: 2017180943 Filing Date: 2017-09-21 Inventor: Ishikawa, Kazuhiro   Ichizuka, Takahiro   Kikuchi, Tomoyuki   Hirai, Atsushi   Assignee: TAISEI CORP   IPC: E21D13/00 Abstract: To provide a construction method of an underground structure which can construct an underground structure in a further shorter construction period as compared with the conventional inverted construction method.SOLUTION: A construction method of an underground structure is a construction method of an underground frame 2 having a plurality of floors, and comprises a step S11 of excavating the ground 4 surrounded by an earth retaining wall 30, a step S12 of constructing a first floor frame body 21 including a part of an underground outer peripheral wall 20a on an excavated bottom surface 35 as a precedent construction frame 40 and joining the precedent construction frame 40 to the earth retaining wall 30, steps S13 and S13a of constructing an upper body of the precedent construction frame 40 and excavating a depth of two floors downward from the excavated bottom surface 35, and steps S14, S15, S15a, S15b, S16, S17, 17a, 17b of repeating steps S12, S13 and S13a.SELECTED DRAWING: Figure 3
12
JP2019120864A
IMAGING LENS
Publication/Patent Number: JP2019120864A Publication Date: 2019-07-22 Application Number: 2018001813 Filing Date: 2018-01-10 Inventor: Kikuchi, Tomoyuki   Yamada, Yukitaka   Konuma, Osamu   Maruyama, Koichi   Kamiya, Ryosuke   Kanezashi, Yasuo   Assignee: SAMSUNG ELECTRONICS CO LTD   IPC: G02B13/18 Abstract: To provide an imaging lens that can realize both small size and high performance.SOLUTION: In a third lens 13, which is the first negative lens when viewed from the object side, in a lens group, the refractive index for the d line is 1.66 or more, and the Abbe number is 21 or less.SELECTED DRAWING: Figure 1
13
EP3239197B1
LAYERED STRUCTURES AND QUANTUM DOT SHEETS AND ELECTRONIC DEVICES INCLUDING THE SAME
Publication/Patent Number: EP3239197B1 Publication Date: 2019-01-23 Application Number: 17168408.7 Filing Date: 2017-04-27 Inventor: Kang, Hyun A   Won, Nayoun   Jang, Eun Joo   Kwon, Ha Il   Lee, Jeong Hee   Cho, Oul   Kikuchi, Tomoyuki   Assignee: Samsung Electronics Co., Ltd.   IPC: C08F222/26
14
JP2018138627A
ORGANIC/INORGANIC COMPOSITE COMPOSITION
Publication/Patent Number: JP2018138627A Publication Date: 2018-09-06 Application Number: 2017032993 Filing Date: 2017-02-24 Inventor: Kikuchi, Tomoyuki   Yamada, Yukitaka   Kamiya, Ryosuke   Miyao, Chu   Assignee: SAMSUNG ELECTRONICS CO LTD   IPC: G02B1/04 Abstract: PROBLEM TO BE SOLVED: To provide an organic/inorganic composite composition improved in moldability and optical characteristics.SOLUTION: An organic/inorganic composite composition contains thermoplastic resin (A) and inorganic particles (B), and satisfies (1)-(3) requirements. (1) a melt viscosity when a shear rate is 1,000(1/s) is 10-1,000 Pa s. (2) when power approximating a relation between a melt viscosity and a shear rate and showing by Y=AX, a value of B is -2≤B
15
JP2018138624A
ORGANIC-INORGANIC COMPOSITE COMPOSITION, AND MOLDING AND OPTICAL COMPONENT CONTAINING THE SAME
Publication/Patent Number: JP2018138624A Publication Date: 2018-09-06 Application Number: 2017032989 Filing Date: 2017-02-24 Inventor: Kikuchi, Tomoyuki   Yamada, Yukitaka   Kamiya, Ryosuke   Miyao, Chu   Assignee: SAMSUNG ELECTRONICS CO LTD   IPC: G02B1/04 Abstract: PROBLEM TO BE SOLVED: To provide an organic-inorganic composite composition that has a high refractive index, excellent light transmissivity and heat resistance, and physical properties suitable for injection molding; namely, it resists gelation and has excellent die releasability.SOLUTION: An organic-inorganic composite composition contains a carboxyl group-containing polycarbonate of a predetermined structure, an inorganic fine particle, and a surface treatment agent of a predetermined structure.SELECTED DRAWING: None
16
JP2018138626A
ORGANIC-INORGANIC COMPOSITE COMPOSITION, AND MOLDING AND OPTICAL COMPONENT CONTAINING THE SAME
Publication/Patent Number: JP2018138626A Publication Date: 2018-09-06 Application Number: 2017032992 Filing Date: 2017-02-24 Inventor: Kikuchi, Tomoyuki   Yamada, Yukitaka   Kamiya, Ryosuke   Miyao, Chu   Assignee: SAMSUNG ELECTRONICS CO LTD   IPC: C08K9/04 Abstract: PROBLEM TO BE SOLVED: To provide an organic-inorganic composite composition that has a high refractive index, has high light transmissivity, and high total light transmittance.SOLUTION: An organic-inorganic composite composition contains a thermoplastic resin, and an inorganic fine particle surface-modified with an organic surface-modification agent. The organic surface-modification agent has a pKa of 2.00 or more and 6.00 or less, and an absolute value of a difference in solubility parameter between the thermoplastic resin and the organic surface-modification agent is 4 or less.SELECTED DRAWING: None
17
US2018244915A1
ORGANIC-INORGANIC HYBRID COMPOSITION, AND ARTICLE AND OPTICAL COMPONENT INCLUDING THE SAME
Publication/Patent Number: US2018244915A1 Publication Date: 2018-08-30 Application Number: 15/903,562 Filing Date: 2018-02-23 Inventor: Oishi, Yoshiyuki   Miyao, Hiroshi   Kikuchi, Tomoyuki   Yamada, Yukika   Kamitani, Ryosuke   Assignee: Samsung Electronics Co., Ltd.   IPC: C08L69/00 Abstract: Disclosed an organic-inorganic hybrid composition including a polymer (A) including a triazine ring structure represented by General Formula (1) in a polymer main chain structure; wherein, in the formula, R1 is a substituted or unsubstituted alkyl group, aryl group, aralkyl group, amino group, arylamino group, alkylthio group, or arylthio group, an inorganic particulate (B); and a surface-treatment agent (C) including an acidic functional group wherein the polymer (A) is a thermoplastic polymer having a glass transition temperature (Tg) and a number median diameter (Dn50) of the inorganic particulate (B) is greater than or equal to about 1 nm and less than or equal to about 20 nm, and an article and an optical component including the organic-inorganic hybrid composition.
18
KR20180098156A
ORGANIC-INORGANIC HYBRID COMPOSITION AND ARTICLE AND OPTICAL COMPONENT INCLUDING THE SAME
Publication/Patent Number: KR20180098156A Publication Date: 2018-09-03 Application Number: 20180021277 Filing Date: 2018-02-22 Inventor: Kamitani, Ryosuke   Kikuchi, Tomoyuki   Yamada, Yukika   Miyao, Hiroshi   Oishi, Yoshiyuki   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: C08G75/20 Abstract: The present invention relates to an organic/inorganic composite composition, and a molded article and an optical component including the same. The organic/inorganic composite composition comprises: a polymer (A) including triazine ring structure represented by general formula (1) in a main chain of a polymer; an inorganic fine particle (B); and a surface treating agent (C) including an acidic functional group, wherein the polymer (A) is a thermoplastic polymer having a glass transition temperature (Tg), and a median diameter (Dn50) of a number standard of the inorganic fine particle (B) is 1 to 20 nm. In general formula (1), R_1 represents a substituted or unsubstituted alkyl group, aryl group, aralkyl group, amino group, aryl amino group, alkylthio group or arylthiol group. The present invention is able to provide an organic/inorganic composite composition which has a high refractive index and is suitable for a molding process such as injection molding.
19
JP2018138625A
ORGANIC-INORGANIC COMPOSITE COMPOSITION, AND MOLDING AND OPTICAL COMPONENT CONTAINING THE SAME
Publication/Patent Number: JP2018138625A Publication Date: 2018-09-06 Application Number: 2017032990 Filing Date: 2017-02-24 Inventor: Kikuchi, Tomoyuki   Yamada, Yukitaka   Kamiya, Ryosuke   Oishi, Yoshiyuki   Miyao, Chu   Assignee: SAMSUNG ELECTRONICS CO LTD   IPC: C08L81/02 Abstract: PROBLEM TO BE SOLVED: To provide an organic-inorganic composite composition that has a high refractive index and is suitable for a molding step such as injection molding.SOLUTION: An organic-inorganic composite composition contains: a polymer (A) having, in the polymer main chain structure, a triazine ring structure of a predetermined structure; an inorganic fine particle (B); and a surface treatment agent (C) having an acidic functional group. The polymer (A) is a thermoplastic polymer with a glass transition temperature (Tg). The inorganic fine particles (B) have a number-based median size (Dn50) of 1 nm or more and 20 nm or less.SELECTED DRAWING: None
20
US10053556B2
Barrier coating compositions, composites prepared therefrom, and quantum dot polymer composite articles including the same
Publication/Patent Number: US10053556B2 Publication Date: 2018-08-21 Application Number: 14/920,189 Filing Date: 2015-10-22 Inventor: Koh, Haeng Deog   Cho, Oul   Won, Nayoun   Kang, Hyun A   Jang, Eunjoo   Kikuchi, Tomoyuki   Assignee: SAMSUNG ELECTRONICS CO., LTD.   IPC: C08F226/06 Abstract: A barrier coating composition including: a monomer combination including a first monomer having at least two thiol groups at its terminal end and a second monomer having at least two carbon-carbon unsaturated bond-containing groups at its terminal end; and a plurality of organo-modified clay particles dispersed in the monomer combination, wherein the organo-modified clay particles include a compound having a hydrocarbyl group linked to a heteroatom, and wherein the compound is a primary, secondary, or tertiary amine, a quaternary organoammonium salt, a primary, secondary, or tertiary phosphine, a quaternary organophosphonium salt, a thiol including an amine group, or a combination thereof.
Total 8 pages