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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US10950515B2
Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus
Publication/Patent Number: US10950515B2 Publication Date: 2021-03-16 Application Number: 16/838,892 Filing Date: 2020-04-02 Inventor: Kishida, Eiichirou   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L23/31 Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
2
US2021134691A1
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2021134691A1 Publication Date: 2021-05-06 Application Number: 17/148,224 Filing Date: 2021-01-13 Inventor: Kishida, Eiichirou   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L23/31 Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
3
US10636714B2
Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus
Publication/Patent Number: US10636714B2 Publication Date: 2020-04-28 Application Number: 15/771,547 Filing Date: 2016-09-28 Inventor: Kishida, Eiichirou   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L23/31 Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
4
US2020235021A1
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2020235021A1 Publication Date: 2020-07-23 Application Number: 16/838,892 Filing Date: 2020-04-02 Inventor: Kishida, Eiichirou   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L23/31 Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
5
US10720459B2
Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients
Publication/Patent Number: US10720459B2 Publication Date: 2020-07-21 Application Number: 16/319,393 Filing Date: 2017-07-25 Inventor: Momiuchi, Yuta   Takaoka, Yuji   Nakayama, Hirokazu   Tanaka, Kiyohisa   Togawa, Miyoshi   Seki, Hirokazu   Kishida, Eiichirou   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/335 Abstract: The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.
6
US2019098237A1
SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING APPARATUS
Publication/Patent Number: US2019098237A1 Publication Date: 2019-03-28 Application Number: 15/772,584 Filing Date: 2016-10-14 Inventor: Tsukada, Atsushi   Kishida, Eiichirou   Nakatsuru, Daisuke   Kaji, Hiroyuki   Assignee: SONY CORPORATION   IPC: H04N5/369 Abstract: [Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.
7
US10506186B2
Solid-state imaging device and solid-state imaging apparatus
Publication/Patent Number: US10506186B2 Publication Date: 2019-12-10 Application Number: 15/772,584 Filing Date: 2016-10-14 Inventor: Tsukada, Atsushi   Kishida, Eiichirou   Nakatsuru, Daisuke   Kaji, Hiroyuki   Assignee: SONY CORPORATION   IPC: H04N5/369 Abstract: [Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.
8
US2019267418A1
IMAGING ELEMENT PACKAGE AND CAMERA MODULE
Publication/Patent Number: US2019267418A1 Publication Date: 2019-08-29 Application Number: 16/319,393 Filing Date: 2017-07-25 Inventor: Momiuchi, Yuta   Takaoka, Yuji   Nakayama, Hirokazu   Tanaka, Kiyohisa   Togawa, Miyoshi   Seki, Hirokazu   Kishida, Eiichirou   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.
9
US2018350707A1
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2018350707A1 Publication Date: 2018-12-06 Application Number: 15/771,547 Filing Date: 2016-09-28 Inventor: Kishida, Eiichirou   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L23/31 Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
10
WO2018030139A1
IMAGING ELEMENT PACKAGE AND CAMERA MODULE
Publication/Patent Number: WO2018030139A1 Publication Date: 2018-02-15 Application Number: 2017026767 Filing Date: 2017-07-25 Inventor: Takaoka, Yuji   Nakayama, Hirokazu   Seki, Hirokazu   Togawa, Miyoshi   Tanaka, Kiyohisa   Kishida, Eiichirou   Momiuchi, Yuta   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: The present technique relates to: an imaging element package which is able to have improved reliability; and a camera module. An imaging element package according to the present invention is provided with: a flexible substrate; an imaging element which is connected to a first surface of the flexible substrate; and a member which has a linear expansion coefficient different from that of the flexible substrate, and which is bonded to a second surface of the flexible substrate by means of an adhesive, said second surface being on the reverse side of the first surface. A portion of the adhesive is provided with a slit that intersects with the direction from the imaging element toward an end of the flexible substrate when viewed from the direction perpendicular to the flexible substrate. The present technique is applicable to a camera module.
11
US2018204870A1
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2018204870A1 Publication Date: 2018-07-19 Application Number: 15/743,911 Filing Date: 2016-07-14 Inventor: Seki, Hirokazu   Yamashita, Naoki   Nishioka, Emi   Kishida, Eiichirou   Tanaka, Kiyohisa   Takaoka, Yuji   Momiuchi, Yuta   Assignee: SONY CORPORATION   IPC: H01L23/00 Abstract: The present technology relates to a semiconductor device, a manufacturing method for the same, and an electronic apparatus, in which a chip size package can be more easily achieved by using flexible printed circuits. Provided is a semiconductor device including: a solid-state image sensor having a pixel array unit in which a plurality of pixels each having a photoelectric conversion element is two-dimensionally arranged in a matrix; and a flexible printed circuit having wiring adapted to connect a pad portion provided on an upper surface side to be located on a light receiving surface side of the solid-state image sensor to an external terminal provided on a lower surface side opposite to the upper surface side, in which the flexible printed circuit is arranged along respective surfaces of the solid-state image sensor such that a position of an end portion located on the upper surface side becomes a position different from a position in a space above the light receiving surface. The present technology can be applied at the time of packaging a CMOS image sensor, for example.
12
WO2017077792A1
SEMICONDUCTOR DEVICE
Publication/Patent Number: WO2017077792A1 Publication Date: 2017-05-11 Application Number: 2016078620 Filing Date: 2016-09-28 Inventor: Kishida, Eiichirou   Assignee: Sony Corporation   IPC: H01L21/301 Abstract: To suppress deterioration of light input/output environment of a semiconductor device wherein a translucent material is laminated on an optical element forming surface via an adhesive. Disclosed is a solid-state image pickup device that is provided with: a semiconductor element manufactured by means of chip-size packaging; a translucent material that is bonded using an adhesive so as to cover an optical element forming surface of the semiconductor element; and a side surface protection resin layer that covers the whole side surface where the layer structure of the semiconductor element and the translucent material is exposed.
13
WO2017081840A1
SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING APPARATUS
Publication/Patent Number: WO2017081840A1 Publication Date: 2017-05-18 Application Number: 2016004586 Filing Date: 2016-10-14 Inventor: Kaji, Hiroyuki   Tsukada, Atsushi   Kishida, Eiichirou   Nakatsuru, Daisuke   Assignee: Sony Corporation   IPC: H01L21/52 Abstract: [Problem] To provide a solid-state imaging device wherein deterioration of the characteristics of a solid-state imaging element due to the influence of a magnetic field line from a wiring line that is provided within a package is suppressed; and a solid-state imaging apparatus which comprises this solid-state imaging device. [Solution] A solid-state imaging device according to the present technique is provided with: a package; a sealing glass; a solid-state imaging element; and a shield. The package internally comprises a wiring line
14
WO2017018231A1
SEMICONDUCTOR DEVICE
Publication/Patent Number: WO2017018231A1 Publication Date: 2017-02-02 Application Number: 2016070874 Filing Date: 2016-07-14 Inventor: Seki, Hirokazu   Yamashita, Naoki   Tanaka, Kiyohisa   Momiuchi, Yuta   Nishioka, Emi   Kishida, Eiichirou   Takaoka, Yuji   Assignee: SONY CORPORATION   IPC: H01L23/12 Abstract: The present technology relates to a semiconductor device with which a chip size package can be more simply realized using a flexible printed board