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1 | US202050051A1 |
LCOS DISPLAY PANEL HAVING UV CUT FILTER
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Publication/Patent Number: US202050051A1 | Publication Date: 2020-02-13 | Application Number: 20/181,605 | Filing Date: 2018-08-08 | Inventor： Ko pei wen Fan, Chun-sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02F1/1339 | Abstract: A LCOS display panel comprises a silicon substrate, a pixel structure on the silicon substrate, a first and a second PI (polyimide) layers, a LC (liquid crystal) layer between the first and the second PI layers, wherein the second PI layer is disposed on the pixel structure, and the LC layer is disposed on the second PI layer, a glass substrate, an ITO (indium tin oxide) layer, a dam sealing a perimeter of the LCOS display panel to enclose the LC layer within the dam, wherein the dam is disposed between the first and second PI layers, and holds the silicon substrate and the glass substrate together, and a UV (ultra violet) cut filter in an active area of the LCOS display panel, wherein the active area of the LCOS display panel includes the LC layer and the pixel structure. | |||
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2 | US2020050051A1 |
LCOS DISPLAY PANEL HAVING UV CUT FILTER
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Publication/Patent Number: US2020050051A1 | Publication Date: 2020-02-13 | Application Number: 16/057,950 | Filing Date: 2018-08-08 | Inventor： Ko pei wen Fan, Chun-sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02F1/1335 | Abstract: A LCOS display panel comprises a silicon substrate, a pixel structure on the silicon substrate, a first and a second PI (polyimide) layers, a LC (liquid crystal) layer between the first and the second PI layers, wherein the second PI layer is disposed on the pixel structure, and the LC layer is disposed on the second PI layer, a glass substrate, an ITO (indium tin oxide) layer, a dam sealing a perimeter of the LCOS display panel to enclose the LC layer within the dam, wherein the dam is disposed between the first and second PI layers, and holds the silicon substrate and the glass substrate together, and a UV (ultra violet) cut filter in an active area of the LCOS display panel, wherein the active area of the LCOS display panel includes the LC layer and the pixel structure. | |||
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3 | US2020124902A1 |
LCOS DISPLAY WITH LIGHT ABSORBING LAYER
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Publication/Patent Number: US2020124902A1 | Publication Date: 2020-04-23 | Application Number: 16/164,469 | Filing Date: 2018-10-18 | Inventor： Ko pei wen Fan, Chun-sheng | Assignee: OmniVision Technologies, Inc. | IPC: G02F1/1333 | Abstract: An example liquid crystal display device includes a circuit substrate, an array of conductive mirrors formed on the substrate, a light absorbing material disposed between the conductive mirrors, a transparent plate disposed over the array of conductive mirrors, and liquid crystal material disposed between the conductive mirrors and the transparent plate. The light absorbing material can also be disposed around the peripheral region of the array of the conductive mirrors. In an example display, the light absorbing material is black and/or has a light absorbing efficiency of at least fifty percent. | |||
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4 | US10607974B2 |
Micro LED display and manufacturing method thereof
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Publication/Patent Number: US10607974B2 | Publication Date: 2020-03-31 | Application Number: 16/120,835 | Filing Date: 2018-09-04 | Inventor： Fan, Regis Ko pei wen Fan, Chun-sheng | Assignee: OMNIVISION SEMICONDUCTOR (SHANGHAI) CO., LTD. | IPC: H01L25/16 | Abstract: A micro LED display and a manufacturing method thereof are disclosed. A plurality of electrode structures is formed on a first surface of a substrate, and a plurality of circuit structure are formed in the substrate, where the circuit structures are electrically connected to the electrode structures. An LED functional layer is formed on the substrate, and includes a plurality of mutually isolated LED functional structures, where the LED functional structures are corresponding and electrically connected to the electrode structures. An electrode layer covers the LED functional layer and is electrically connected to the LED functional structures. Micro lenses are formed on the electrode layer and corresponding to the LED functional structures. Therefore, all the LED functional structures can be wholly used as a light-emitting region of a pixel, improving light emission efficiency of the micro LED display. | |||
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5 | US2020027865A1 |
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
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Publication/Patent Number: US2020027865A1 | Publication Date: 2020-01-23 | Application Number: 16/120,835 | Filing Date: 2018-09-04 | Inventor： Fan, Regis Ko pei wen Fan, Chun-sheng | Assignee: OmniVision Semiconductor (Shanghai) Co., Ltd. | IPC: H01L25/16 | Abstract: A micro LED display and a manufacturing method thereof are disclosed. A plurality of electrode structures is formed on a first surface of a substrate, and a plurality of circuit structure are formed in the substrate, where the circuit structures are electrically connected to the electrode structures. An LED functional layer is formed on the substrate, and includes a plurality of mutually isolated LED functional structures, where the LED functional structures are corresponding and electrically connected to the electrode structures. An electrode layer covers the LED functional layer and is electrically connected to the LED functional structures. Micro lenses are formed on the electrode layer and corresponding to the LED functional structures. Therefore, all the LED functional structures can be wholly used as a light-emitting region of a pixel, improving light emission efficiency of the micro LED display. | |||
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6 | US202027865A1 |
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
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Publication/Patent Number: US202027865A1 | Publication Date: 2020-01-23 | Application Number: 20/181,612 | Filing Date: 2018-09-04 | Inventor： Fan, Regis Fan, Chun-sheng Ko pei wen | Assignee: OmniVision Semiconductor (Shanghai) Co., Ltd. | IPC: H01L33/62 | Abstract: A micro LED display and a manufacturing method thereof are disclosed. A plurality of electrode structures is formed on a first surface of a substrate, and a plurality of circuit structure are formed in the substrate, where the circuit structures are electrically connected to the electrode structures. An LED functional layer is formed on the substrate, and includes a plurality of mutually isolated LED functional structures, where the LED functional structures are corresponding and electrically connected to the electrode structures. An electrode layer covers the LED functional layer and is electrically connected to the LED functional structures. Micro lenses are formed on the electrode layer and corresponding to the LED functional structures. Therefore, all the LED functional structures can be wholly used as a light-emitting region of a pixel, improving light emission efficiency of the micro LED display. | |||
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7 | US9899563B2 |
Method of fabricating light-emitting diode with a micro-structure lens
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Publication/Patent Number: US9899563B2 | Publication Date: 2018-02-20 | Application Number: 14/620,481 | Filing Date: 2015-02-12 | Inventor： Lee, Hsiao-wen Tsai, Shang-yu Ko pei wen | Assignee: EPISTAR CORPORATION | IPC: H01L33/60 | Abstract: A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens. | |||
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8 | US9625107B2 |
Light-emitting-diode-based light bulb
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Publication/Patent Number: US9625107B2 | Publication Date: 2017-04-18 | Application Number: 14/316,942 | Filing Date: 2014-06-27 | Inventor： Guo, Sheng-shin Yeh, Wei-yu Sun, Chih-hsuan Ko pei wen | Assignee: EPISTAR CORPORATION | IPC: F21K9/232 | Abstract: A lighting apparatus includes a first substrate, a plurality of first light-emitting devices disposed on the first substrate, a second substrate disposed over the first substrate, and a plurality of second light-emitting devices disposed on the second substrate. A reflective surface is disposed between the first substrate and the second substrate. The reflective surface is configured to reflect light emitted by at least some of the first light-emitting devices in a direction that is at least partially toward the first substrate. The reflective surface has one of: a saw-patterned side view profile, or a curved side view profile that is free of having an inflection point. | |||
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9 | US9347624B2 |
Lighting apparatus having improved light output uniformity and thermal dissipation
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Publication/Patent Number: US9347624B2 | Publication Date: 2016-05-24 | Application Number: 14/598,282 | Filing Date: 2015-01-16 | Inventor： Ko pei wen Yeh, Wei-yu | Assignee: EPISTAR CORPORATION | IPC: F21V13/02 | Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup. | |||
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10 | TWI515387B |
Street light and lighting instrument thereof
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Publication/Patent Number: TWI515387B | Publication Date: 2016-01-01 | Application Number: 101145397 | Filing Date: 2012-12-04 | Inventor： Ko, Pei Wen Wang, Jin Hua Sun, Chih Hsuan Fu, Hsueh Hung | Assignee: Epistar Corporation | IPC: F21L2/00 | Abstract: The present disclosure involves a street light. The street light includes a base | |||
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11 | TWI534390B |
Illumination structure and method for fabricating the same
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Publication/Patent Number: TWI534390B | Publication Date: 2016-05-21 | Application Number: 101123685 | Filing Date: 2012-07-02 | Inventor： Tseng, Chi Xiang Lee, Hsiao Wen Guo, Sheng Shin Ko, Pei Wen Sun, Chih Hsuan Yeh, Wei Yu | Assignee: Epistar Corporation | IPC: F21V5/04 | Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate. A lens secured on the substrate and over the LED device. A diffuser cap secured on the substrate and covering the lens | |||
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12 | US9447948B2 |
LED lighting apparatus with flexible light modules
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Publication/Patent Number: US9447948B2 | Publication Date: 2016-09-20 | Application Number: 14/224,891 | Filing Date: 2014-03-25 | Inventor： Wang, Jin-hua Fu, Hsueh-hung Ko pei wen Sun, Chih-hsuan | Assignee: EPISTAR CORPORATION | IPC: F21V29/00 | Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings. | |||
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13 | US2016215939A1 |
WIDE ANGLE BASED INDOOR LIGHTING LAMP
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Publication/Patent Number: US2016215939A1 | Publication Date: 2016-07-28 | Application Number: 15/091,174 | Filing Date: 2016-04-05 | Inventor： Tseng, Chi Xiang Lee, Hsiao-wen Guo, Sheng-shin Ko pei wen Sun, Chih-hsuan Yeh, Wei-yu | Assignee: EPISTAR CORPORATION | IPC: F21K99/00 | Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a substrate. A light-emitting diode (LED) is disposed over the substrate. A first lens is disposed over the LED. A second lens is disposed over the first lens. The first lens and the second lens are configured to refract light that is emitted by the LED backward. | |||
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14 | TWI497008B |
Lighting device for direct and indirect light
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Publication/Patent Number: TWI497008B | Publication Date: 2015-08-21 | Application Number: 101121469 | Filing Date: 2012-06-15 | Inventor： Ko, Pei Wen Yeh, Wei Yu | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: F21V19/00 | Abstract: A lighting device includes at least one heat sink. At least two light emitting diode (LED) modules are mounted on the at least one heat sink so that a first LED module of the at least two LED modules generally radiates lights in a first direction for a direct lighting and a second LED module of the at least two LED modules generally radiates light in a second direction for an indirect lighting by reflecting on a surface. | |||
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15 | US9140421B2 |
Lighting device for direct and indirect lighting
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Publication/Patent Number: US9140421B2 | Publication Date: 2015-09-22 | Application Number: 13/209,258 | Filing Date: 2011-08-12 | Inventor： Yeh, Wei-yu Ko pei wen | Assignee: TSMC Solid State Lighting Ltd. | IPC: F21V21/00 | Abstract: A lighting device includes a first heat sink having a first surface and a second surface opposite the first surface, a second heat sink having a third surface and a fourth surface opposite the third surface. The third surface of the second heat sink is bonded to the second surface of the first heat sink. The lighting device further includes a plurality of first light emitting diode (LED) modules mounted on the first surface of the first heat sink; and a plurality of second light emitting diode (LED) modules mounted on the fourth surface of the second heat sink. One or more the first LED modules generally radiates lights in a first direction. One or more the second LED modules generally radiates lights in a second direction. The first and second LED modules are covered by respective non-reflective caps. The first LED module and the second LED module are configured to be selectively turned on or off according to a predefined algorithm. The first LED modules are arranged on an outer region of the lighting device, and the second LED modules are arranged on an inner region of the lighting device. The inner region is circumferentially surrounded by the outer region. | |||
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16 | US8939611B2 |
Lighting apparatus having improved light output uniformity and thermal dissipation
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Publication/Patent Number: US8939611B2 | Publication Date: 2015-01-27 | Application Number: 13/293,272 | Filing Date: 2011-11-10 | Inventor： Ko pei wen Yeh, Wei-yu | Assignee: TSMC Solid State Lighting Ltd. | IPC: F21V29/00 | Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup. | |||
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17 | US2015124448A1 |
LIGHTING APPARATUS HAVING IMPROVED LIGHT OUTPUT UNIFORMITY AND THERMAL DISSIPATION
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Publication/Patent Number: US2015124448A1 | Publication Date: 2015-05-07 | Application Number: 14/598,282 | Filing Date: 2015-01-16 | Inventor： Ko pei wen Yeh, Wei-yu | Assignee: TSMC Solid State Lighting Ltd. | IPC: F21K99/00 | Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup. | |||
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18 | TWI499100B |
Light emitting diode carrier assemblies and method of fabricating the same
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Publication/Patent Number: TWI499100B | Publication Date: 2015-09-01 | Application Number: 101115723 | Filing Date: 2012-05-03 | Inventor： Ko, Pei Wen Sun, Chih Hsuan Yeh, Wei Yu Fu, Hsueh Hung | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: H01L33/62 | Abstract: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount | |||
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19 | US2015162490A1 |
LIGHT EMITTING DIODE WITH MICRO-STRUCTURE LENS
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Publication/Patent Number: US2015162490A1 | Publication Date: 2015-06-11 | Application Number: 14/620,481 | Filing Date: 2015-02-12 | Inventor： Lee, Hsiao-wen Tsai, Shang-yu Ko pei wen | Assignee: TSMC Solid State Lighting Ltd. | IPC: H01L33/00 | Abstract: A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens. | |||
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20 | US8969894B2 |
Light emitting diode with a micro-structure lens having a ridged surface
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Publication/Patent Number: US8969894B2 | Publication Date: 2015-03-03 | Application Number: 13/087,564 | Filing Date: 2011-04-15 | Inventor： Lee, Hsiao-wen Tsai, Shang-yu Ko pei wen | Assignee: TSMC Solid State Lighting Ltd. | IPC: H01L33/00 | Abstract: A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens. |
3.Current Quota