Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
EP3329315B1
STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3329315B1 Publication Date: 2021-03-31 Application Number: 16751020.5 Filing Date: 2016-07-19 Inventor: Yamamoto, Atsushi   Takeuchi, Koichi   Kurobe, Toshihiro   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B13/00
2
US10712543B2
Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate
Publication/Patent Number: US10712543B2 Publication Date: 2020-07-14 Application Number: 15/741,354 Filing Date: 2016-07-15 Inventor: Hikichi, Kunihiko   Takeuchi, Koichi   Kurobe, Toshihiro   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B3/00 Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.
3
US10627549B2
Stacked lens structure, method of manufacturing the same, and electronic apparatus
Publication/Patent Number: US10627549B2 Publication Date: 2020-04-21 Application Number: 15/741,528 Filing Date: 2016-07-19 Inventor: Yamamoto, Atsushi   Takeuchi, Koichi   Kurobe, Toshihiro   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B3/08 Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. The alignment mark is formed simultaneously with the through-hole. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
4
US2019004293A1
STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS, MOLD, METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE
Publication/Patent Number: US2019004293A1 Publication Date: 2019-01-03 Application Number: 15/741,354 Filing Date: 2016-07-15 Inventor: Hikichi, Kunihiko   Takeuchi, Koichi   Kurobe, Toshihiro   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G02B13/00 Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.
5
US201904293A1
STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS, MOLD, METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE
Publication/Patent Number: US201904293A1 Publication Date: 2019-01-03 Application Number: 20/161,574 Filing Date: 2016-07-15 Inventor: Ishida, Minoru   Takeuchi, Koichi   Hikichi, Kunihiko   Shiraiwa, Toshiaki   Itou, Hiroyuki   Fujii, Nobutoshi   Matsugai, Hiroyasu   Tazawa, Hiroshi   Kurobe, Toshihiro   Saito, Suguru   Ohshima, Keiji   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.
6
US2018196170A1
LENS-ATTACHED SUBSTRATE, STACKED LENS STRUCTURE, CAMERA MODULE, AND MANUFACTURING APPARATUS AND METHOD
Publication/Patent Number: US2018196170A1 Publication Date: 2018-07-12 Application Number: 15/741,335 Filing Date: 2016-07-15 Inventor: Ishida, Minoru   Shiraiwa, Toshiaki   Fujii, Nobutoshi   Ohshima, Keiji   Saito, Suguru   Itou, Hiroyuki   Matsugai, Hiroyasu   Saito, Sotetsu   Kurobe, Toshihiro   Tazawa, Hiroshi   Assignee: Sony Semiconductor Solutions Corporation   IPC: B29C43/50 Abstract: To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.