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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1 US2020020827A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020020827A1 Publication Date: 2020-01-16 Application Number: 16/505,331 Filing Date: 2019-07-08 Inventor: Ho, Hsin-ying   Chen, Ying-chung   Lai lu ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/08 Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.
2 US10689249B2
Semiconductor device package including a wall and a grounding ring exposed from the wall
Publication/Patent Number: US10689249B2 Publication Date: 2020-06-23 Application Number: 14/855,684 Filing Date: 2015-09-16 Inventor: Huang, Ching-han   Chan, Hsun-wei   Lai lu ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: B81B7/00 Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.
3 US202020827A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US202020827A1 Publication Date: 2020-01-16 Application Number: 20/191,650 Filing Date: 2019-07-08 Inventor: Chen, Ying-chung   Lai lu ming   Ho, Hsin-ying   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/26 Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.
4 US10782184B2
Optical device and method of manufacturing the same
Publication/Patent Number: US10782184B2 Publication Date: 2020-09-22 Application Number: 15/687,090 Filing Date: 2017-08-25 Inventor: Peng, Yu-min   Huang, Ching-han   Lai lu ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: G01J1/04 Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.
5 US2020194328A1
DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020194328A1 Publication Date: 2020-06-18 Application Number: 16/218,422 Filing Date: 2018-12-12 Inventor: Huang, Cheng-ling   Chen, Ying-chung   Lai lu ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/31 Abstract: A device package includes a first carrier, a lid and a chip. The first carrier includes a substrate having a first surface and a second surface opposite to the first surface. The substrate defines a through-hole extended from the first surface to the second surface. The through-hole includes a first opening proximal to the first surface, and a second opening proximal to the second surface. The first barrier dam is disposed on the first surface and surrounds the first opening of the through-hole. The second barrier dam is disposed on the second surface and surrounds the second opening of the through-hole. The lid is disposed on the first surface. The lid and the first carrier define a chamber. The chip is disposed on the first surface and in the chamber.
6 US10720751B2
Optical package structure, optical module, and method for manufacturing the same
Publication/Patent Number: US10720751B2 Publication Date: 2020-07-21 Application Number: 16/118,228 Filing Date: 2018-08-30 Inventor: Tsai, Yu-hsuan   Lai lu ming   Chen, Ying-chung   Tang, Shih-chieh   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: G02B6/02 Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
7 US10629787B2
Lid and an optical device package having the same
Publication/Patent Number: US10629787B2 Publication Date: 2020-04-21 Application Number: 15/466,502 Filing Date: 2017-03-22 Inventor: Ho, Hsin-ying   Chan, Hsun-wei   Chen, Ying-chung   Lai lu ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L33/58 Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.
8 US2020080841A1
OPTICAL MODULE AND METHOD OF MAKING THE SAME
Publication/Patent Number: US2020080841A1 Publication Date: 2020-03-12 Application Number: 16/683,117 Filing Date: 2019-11-13 Inventor: Chen, Ying-chung   Chan, Hsun-wei   Lai lu ming   Chen, Kuang-hsiung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: G01C3/08 Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
9 US2020259058A1
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020259058A1 Publication Date: 2020-08-13 Application Number: 16/862,447 Filing Date: 2020-04-29 Inventor: Wu, Mei-yi   Lai lu ming   Lee, Yu-ying   Chang, Yung-yi   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L33/62 Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
10 US2020328322A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2020328322A1 Publication Date: 2020-10-15 Application Number: 16/384,847 Filing Date: 2019-04-15 Inventor: Tsai, Hsiang-chen   Lai lu ming   Chan, Hsun-wei   Chen, Ying-chung   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L31/12 Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
11 US10665765B2
Semiconductor device package and a method of manufacturing the same
Publication/Patent Number: US10665765B2 Publication Date: 2020-05-26 Application Number: 15/860,567 Filing Date: 2018-01-02 Inventor: Wu, Mei-yi   Lai lu ming   Lee, Yu-ying   Chang, Yung-yi   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L33/62 Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
12 US10752494B2
Semiconductor device package
Publication/Patent Number: US10752494B2 Publication Date: 2020-08-25 Application Number: 16/212,609 Filing Date: 2018-12-06 Inventor: Tseng, Chi Sheng   Lai lu ming   Tang, Shih-chieh   Ho, Hsin-ying   Chan, Hsun-wei   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: B81B7/02 Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.
13 US2020002162A1
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication/Patent Number: US2020002162A1 Publication Date: 2020-01-02 Application Number: 16/452,370 Filing Date: 2019-06-25 Inventor: Tseng, Chi Sheng   Lai lu ming   Tsai, Yu-hsuan   Chen, Yin-hao   Wu, Hsin Lin   Yu, San-kuei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: B81C1/00 Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
14 US202002162A1
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication/Patent Number: US202002162A1 Publication Date: 2020-01-02 Application Number: 20/191,645 Filing Date: 2019-06-25 Inventor: Lai lu ming   Tsai, Yu-hsuan   Tseng, Chi Sheng   Chen, Yin-hao   Wu, Hsin Lin   Yu, San-kuei   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/498 Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
15 TW201926670A
Optical device and method of manufacturing the same
Publication/Patent Number: TW201926670A Publication Date: 2019-07-01 Application Number: 107104417 Filing Date: 2018-02-08 Inventor: Tang, Shih-chieh   Lai lu ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L27/15 Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.
16 US2019157492A1
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2019157492A1 Publication Date: 2019-05-23 Application Number: 15/821,302 Filing Date: 2017-11-22 Inventor: Lai lu ming   Tang, Shih-chieh   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L31/173 Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.
17 US10170658B2
Semiconductor package structures and method of manufacturing the same
Publication/Patent Number: US10170658B2 Publication Date: 2019-01-01 Application Number: 14/941,069 Filing Date: 2015-11-13 Inventor: Tsai, Yu-hsuan   Lai lu ming   Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.   IPC: H01L31/173 Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.
18 US2019348351A1
SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: US2019348351A1 Publication Date: 2019-11-14 Application Number: 15/977,966 Filing Date: 2018-05-11 Inventor: Lee, Tsann Huei   Lai lu ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/498 Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.
19 TW201901867A
Semiconductor device package and a method of manufacturing the same
Publication/Patent Number: TW201901867A Publication Date: 2019-01-01 Application Number: 106144702 Filing Date: 2017-12-20 Inventor: Huang, Ching-han   Shen, Chia-hung   Hsiao, Hsu-liang   Lai lu ming   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01L23/12 Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
20 US2019097387A1
OPTICAL PACKAGE STRUCTURE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: US2019097387A1 Publication Date: 2019-03-28 Application Number: 16/118,228 Filing Date: 2018-08-30 Inventor: Tsai, Yu-hsuan   Lai lu ming   Chen, Ying-chung   Tang, Shih-chieh   Assignee: Advanced Semiconductor Engineering, Inc.   IPC: H01S5/022 Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.