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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US10784300B1
Solid-state imaging devices
Publication/Patent Number: US10784300B1 Publication Date: 2020-09-22 Application Number: 16/385,463 Filing Date: 2019-04-16 Inventor: Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H01L27/146 Abstract: The solid-state imaging device includes a first set of units disposed in a substrate and including a first pixel unit, a second pixel unit and a third pixel unit. The first pixel unit, the second pixel unit and the third pixel unit are sequentially arranged and include respective photoelectric conversion elements. The solid-state imaging device also includes a metal grid structure disposed over the first set of units and including a first portion and a second portion. The first portion is disposed between the first pixel unit and the second pixel unit and has a first width. The second portion is disposed between the second pixel unit and the third pixel unit and has a second width that is greater than the first width.
2
US10566365B2
Image sensor
Publication/Patent Number: US10566365B2 Publication Date: 2020-02-18 Application Number: 14/722,730 Filing Date: 2015-05-27 Inventor: Chen, Li-wei   Lin chi han   Tu, Zong-ru   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H01L27/146 Abstract: An image sensor includes a sensing layer, a first microlens, and a number of second microlenses. The first microlens is disposed on the sensing layer. The second microlenses are disposed on the sensing layer adjacent to the first microlens. The diameter of the first microlens is greater than the diameter of each of the second microlenses.
3
US10675657B2
Optical elements and method for fabricating the same
Publication/Patent Number: US10675657B2 Publication Date: 2020-06-09 Application Number: 16/031,277 Filing Date: 2018-07-10 Inventor: Cheng, Sheng-chuan   Chen, Huang-jen   Lin chi han   Wu, Han-lin   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: B05D3/10 Abstract: A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of metal grids are formed on the substrate. A first organic layer is formed on the substrate between the plurality of metal grids. A second organic layer is formed on the first organic layer and the plurality of metal grids. The second organic layer and the first organic layer are etched to leave the plurality of metal grids and a plurality of patterned second organic layers on the plurality of metal grids. An optical element fabricated by the method is also provided.
4
US2020254485A1
OPTICAL ELEMENTS
Publication/Patent Number: US2020254485A1 Publication Date: 2020-08-13 Application Number: 16/863,196 Filing Date: 2020-04-30 Inventor: Cheng, Sheng-chuan   Chen, Huang-jen   Lin chi han   Wu, Han-lin   Assignee: VisEra Technologies Company Limited   IPC: B05D5/06 Abstract: An optical element is provided. The optical element includes a substrate; a plurality of metal grids formed on the substrate; an oxide layer formed on the substrate between the plurality of metal grids; and a plurality of organic layers formed on the plurality of metal grids, wherein the width of the organic layer is greater than the width of the metal grid, and there is at least one gap between the organic layer and the oxide layer.
5
US202016628A1
OPTICAL ELEMENTS AND METHOD FOR FABRICATING THE SAME
Publication/Patent Number: US202016628A1 Publication Date: 2020-01-16 Application Number: 20/181,603 Filing Date: 2018-07-10 Inventor: Lin chi han   Chen, Huang-jen   Wu, Han-lin   Cheng, Sheng-chuan   Assignee: VisEra Technologies Company Limited   IPC: B05D7/14 Abstract: A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of metal grids are formed on the substrate. A first organic layer is formed on the substrate between the plurality of metal grids. A second organic layer is formed on the first organic layer and the plurality of metal grids. The second organic layer and the first organic layer are etched to leave the plurality of metal grids and a plurality of patterned second organic layers on the plurality of metal grids. An optical element fabricated by the method is also provided.
6
US2020108573A1
OPTICAL ELEMENTS AND METHOD FOR FABRICATING THE SAME
Publication/Patent Number: US2020108573A1 Publication Date: 2020-04-09 Application Number: 16/150,804 Filing Date: 2018-10-03 Inventor: Cheng, Sheng-chuan   Chen, Hao-min   Lin chi han   Wu, Han-lin   Assignee: VisEra Technologies Company Limited   IPC: B29D11/00 Abstract: A method for fabricating an optical element is provided. A substrate is provided. A plurality of metal grids are formed on the substrate. An organic layer is formed on the substrate and the metal grids. The organic layer is etched to form a first patterned organic layer including a plurality of first protrusion portions and a plurality of first trenches surrounded by the first protrusion portions. The first patterned organic layer is etched to form a second patterned organic layer including a plurality of second protrusion portions and a plurality of second trenches surrounded by the second protrusion portions. Each second protrusion portion covers one metal grid. There is a distance between the center axis of one second protrusion portion of the second patterned organic layer and the center axis of one metal grid covered by the one second protrusion portion of the second patterned organic layer.
7
US10850462B2
Optical elements and method for fabricating the same
Publication/Patent Number: US10850462B2 Publication Date: 2020-12-01 Application Number: 16/150,804 Filing Date: 2018-10-03 Inventor: Cheng, Sheng-chuan   Chen, Hao-min   Lin chi han   Wu, Han-lin   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: G02B3/00 Abstract: A method for fabricating an optical element is provided. A substrate is provided. A plurality of metal grids are formed on the substrate. An organic layer is formed on the substrate and the metal grids. The organic layer is etched to form a first patterned organic layer including a plurality of first protrusion portions and a plurality of first trenches surrounded by the first protrusion portions. The first patterned organic layer is etched to form a second patterned organic layer including a plurality of second protrusion portions and a plurality of second trenches surrounded by the second protrusion portions. Each second protrusion portion covers one metal grid. There is a distance between the center axis of one second protrusion portion of the second patterned organic layer and the center axis of one metal grid covered by the one second protrusion portion of the second patterned organic layer.
8
US2020016628A1
OPTICAL ELEMENTS AND METHOD FOR FABRICATING THE SAME
Publication/Patent Number: US2020016628A1 Publication Date: 2020-01-16 Application Number: 16/031,277 Filing Date: 2018-07-10 Inventor: Cheng, Sheng-chuan   Chen, Huang-jen   Lin chi han   Wu, Han-lin   Assignee: VisEra Technologies Company Limited   IPC: B05D5/06 Abstract: A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of metal grids are formed on the substrate. A first organic layer is formed on the substrate between the plurality of metal grids. A second organic layer is formed on the first organic layer and the plurality of metal grids. The second organic layer and the first organic layer are etched to leave the plurality of metal grids and a plurality of patterned second organic layers on the plurality of metal grids. An optical element fabricated by the method is also provided.
9
US10462431B2
Image sensors
Publication/Patent Number: US10462431B2 Publication Date: 2019-10-29 Application Number: 14/683,792 Filing Date: 2015-04-10 Inventor: Huang, Tzu-wei   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H01L27/146 Abstract: An image sensor is provided. The image sensor includes a semiconductor substrate containing a plurality of photoelectric conversion elements. A color filter array is disposed above the semiconductor substrate. The color filter array includes a first color filter, a second color filter and a third color filter. The image sensor further includes an isolated partition disposed in the color filter array to surround one of the first, second and third color filters. The isolated partition has a refractive index that is lower than the refractive indexes of the first, second and third color filters.
10
US10170511B1
Solid-state imaging devices having a microlens layer with dummy structures
Publication/Patent Number: US10170511B1 Publication Date: 2019-01-01 Application Number: 15/616,390 Filing Date: 2017-06-07 Inventor: Huang, Tzu-wei   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H04N5/335 Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
11
TW201904041A
Solid-state imaging devices
Publication/Patent Number: TW201904041A Publication Date: 2019-01-16 Application Number: 106138299 Filing Date: 2017-11-06 Inventor: Huang, Tzu-wei   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: G02B3/00 Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
12
JP2018207086A
SOLID-STATE IMAGING ELEMENT INCLUDING MICROLENS LAYER WITH DUMMY STRUCTURE
Publication/Patent Number: JP2018207086A Publication Date: 2018-12-27 Application Number: 2017157805 Filing Date: 2017-08-18 Inventor: Lin chi han   Huang, Tzu-wei   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H04N5/335 Abstract: To provide a solid-state imaging element including a microlens layer with a dummy structure.SOLUTION: A solid-state imaging element comprises a sensing region, a pad region, and a peripheral region arranged between the sensing region and the pad region. The solid-state imaging element includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and arranged in the sensing region, and a bond pad arranged on the semiconductor substrate and in the pad region. The solid-state imaging element further includes a microlens layer arranged on the semiconductor substrate. The microlens layer includes a microlens array arranged in the sensing region and a first dummy structure arranged in the pad region. The first dummy structure includes a plurality of first microlens elements arranged so as to surround a bond pad region. Moreover, the solid-state imaging element includes a protection film conformally formed on an upper surface of the microlens layer.SELECTED DRAWING: Figure 1
13
TWI629776B
Solid-state imaging devices
Publication/Patent Number: TWI629776B Publication Date: 2018-07-11 Application Number: 106138299 Filing Date: 2017-11-06 Inventor: Huang, Tzu-wei   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: G02B3/00 Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
14
US2018358396A1
SOLID-STATE IMAGING DEVICES HAVING A MICROLENS LAYER WITH DUMMY STRUCTURES
Publication/Patent Number: US2018358396A1 Publication Date: 2018-12-13 Application Number: 15/616,390 Filing Date: 2017-06-07 Inventor: Huang, Tzu-wei   Lin chi han   Assignee: VisEra Technologies Company Limited   IPC: H01L27/146 Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
15
TW201712855A
Solid-state imaging devices
Publication/Patent Number: TW201712855A Publication Date: 2017-04-01 Application Number: 105103239 Filing Date: 2016-02-02 Inventor: Chang, Chih Chieh   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H01L27/146 Abstract: A solid-state imaging device includes a substrate containing a plurality of photoelectric conversion elements arranged into a pixel array. A color filter layer including a plurality of color filter segments is disposed above the photoelectric conversion elements. A partition grid includes a plurality of partitions
16
TWI595784B
Image sensors
Publication/Patent Number: TWI595784B Publication Date: 2017-08-11 Application Number: 104132796 Filing Date: 2015-10-06 Inventor: Huang, Tzu Wei   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H04N5/335 Abstract: An image sensor is provided. The image sensor includes a semiconductor substrate containing a plurality of photoelectric conversion elements. A color filter array is disposed above the semiconductor substrate. The color filter array includes a first color filter
17
TWI591811B
Solid-state imaging devices
Publication/Patent Number: TWI591811B Publication Date: 2017-07-11 Application Number: 105103239 Filing Date: 2016-02-02 Inventor: Chang, Chih Chieh   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H01L27/146 Abstract: A solid-state imaging device includes a substrate containing a plurality of photoelectric conversion elements arranged into a pixel array. A color filter layer including a plurality of color filter segments is disposed above the photoelectric conversion elements. A partition grid includes a plurality of partitions
18
TWI567961B
IMAGE SENSOR
Publication/Patent Number: TWI567961B Publication Date: 2017-01-21 Application Number: 104138011 Filing Date: 2015-11-18 Inventor: Chen, Li Wei   Tu, Zong Ru   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LIMITED   IPC: H01L27/146 Abstract: An image sensor includes a sensing layer
19
US9634049B2
Solid-state imaging devices with enhanced angular response
Publication/Patent Number: US9634049B2 Publication Date: 2017-04-25 Application Number: 14/861,378 Filing Date: 2015-09-22 Inventor: Chang, Chih-chieh   Lin chi han   Assignee: Visera Technologies Company Limited   IPC: H01L27/146 Abstract: A solid-state imaging device includes a substrate containing a plurality of photoelectric conversion elements arranged into a pixel array. A color filter layer including a plurality of color filter segments is disposed above the photoelectric conversion elements. A partition grid includes a plurality of partitions, and each of the partitions is disposed between two adjacent color filter segments. The color filter layer and the partition grid are disposed in the same layer. In addition, the partitions include a first partition disposed at a center line of the pixel array and a second partition disposed at an edge of the pixel array. The second partition has a top width that is larger than the top width of the first partition.
20
JP2017063171A
SOLID-STATE IMAGING DEVICE
Publication/Patent Number: JP2017063171A Publication Date: 2017-03-30 Application Number: 2016013140 Filing Date: 2016-01-27 Inventor: Chang, Chih-chieh   Lin chi han   Assignee: VISERA TECHNOLOGIES COMPANY LTD   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To provide an imaging device