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1 | US2020064396A1 |
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
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Publication/Patent Number: US2020064396A1 | Publication Date: 2020-02-27 | Application Number: 16/522,551 | Filing Date: 2019-07-25 | Inventor： He, Jun Lin, Yu-ting Lin wei hsun Kuo, Yung-liang Lu, Yinlung | Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. | IPC: G01R31/28 | Abstract: The present disclosure provides a method and a system for testing semiconductor device. The method includes the following operations. A wafer having an IC formed thereon is provided. The IC is energized by raising the voltage of the IC to a first voltage level during a first period. A stress signal is applied to the IC. The stress signal includes a plurality of sequences during a second period subsequent to the first period. Each of the sequence has a ramp-up stage and a ramp-down stage. The stress signal causes the voltage of the IC to fluctuate between a second voltage level and a third voltage level. Whether the IC complies with a test criterion is determined after applying the stress signal. | |||
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2 | US2020348341A1 |
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
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Publication/Patent Number: US2020348341A1 | Publication Date: 2020-11-05 | Application Number: 16/933,576 | Filing Date: 2020-07-20 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R1/073 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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3 | US10718790B2 |
Devices for high-density probing techniques and method of implementing the same
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Publication/Patent Number: US10718790B2 | Publication Date: 2020-07-21 | Application Number: 16/378,288 | Filing Date: 2019-04-08 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R1/073 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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4 | US10274518B2 |
Devices for high-density probing techniques and method of implementing the same
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Publication/Patent Number: US10274518B2 | Publication Date: 2019-04-30 | Application Number: 15/140,758 | Filing Date: 2016-04-28 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R1/073 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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5 | US2019302146A1 |
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
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Publication/Patent Number: US2019302146A1 | Publication Date: 2019-10-03 | Application Number: 16/378,288 | Filing Date: 2019-04-08 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R1/073 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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6 | US9354254B2 |
Test-yield improvement devices for high-density probing techniques and method of implementing the same
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Publication/Patent Number: US9354254B2 | Publication Date: 2016-05-31 | Application Number: 13/865,243 | Filing Date: 2013-04-18 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R31/20 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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7 | US2016313372A1 |
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
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Publication/Patent Number: US2016313372A1 | Publication Date: 2016-10-27 | Application Number: 15/140,758 | Filing Date: 2016-04-28 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. | IPC: G01R1/073 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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8 | US9372227B2 |
Integrated circuit test system and method
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Publication/Patent Number: US9372227B2 | Publication Date: 2016-06-21 | Application Number: 13/792,323 | Filing Date: 2013-03-11 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Chen, Hao Huang, Chung-han | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R31/20 | Abstract: A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module. | |||
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9 | TWI459576B |
Ingaas-capped lwir quntum-dot infrared photodetectors
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Publication/Patent Number: TWI459576B | Publication Date: 2014-11-01 | Application Number: 98132406 | Filing Date: 2009-09-25 | Inventor： Lin, Shih Yen Tseng, Chi Che Lin, Wei Hsun Chao, Kuang Ping | Assignee: Academia Sinica | IPC: H01L31/0304 | Abstract: The invention discloses InGaAs-capped InAs/GaAs quantum-dot infrared photodetectors (QDIPs). Enhanced detection wavelengths in the long-wavelength infrared range of the device are observed with decreasing InAs coverage. Compared with the standard QDIP without the InGaAs-capped layer | |||
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10 | US2014253162A1 |
INTEGRATED CIRCUIT TEST SYSTEM AND METHOD
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Publication/Patent Number: US2014253162A1 | Publication Date: 2014-09-11 | Application Number: 13/792,323 | Filing Date: 2013-03-11 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Chen, Hao Huang, Chung-han | Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. | IPC: G01R31/28 | Abstract: A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module. | |||
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11 | US2014266273A1 |
TEST-YIELD IMPROVEMENT DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
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Publication/Patent Number: US2014266273A1 | Publication Date: 2014-09-18 | Application Number: 13/865,243 | Filing Date: 2013-04-18 | Inventor： Wang, Mill-jer Peng, Ching-nen Lin, Hung-chih Lin wei hsun Hsu, Sen-kuei Liu, De-jian | Assignee: Taiwan Semiconductor Manufacturing Co., Ltd. | IPC: G01R1/073 | Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | |||
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12 | TWI400813B |
Apparatus and method for forming quantum-dot and quantum-well mixed-mode infrared photodetector
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Publication/Patent Number: TWI400813B | Publication Date: 2013-07-01 | Application Number: 97132489 | Filing Date: 2008-08-26 | Inventor： Lin, Shih Yen Chou, Shu Ting Tseng, Chi Che Lin, Wei Hsun | Assignee: Academia Sinica | IPC: H01L31/101 | Abstract: The present invention is disclosed that Quantum-dot (QD)/quantum-well (QW) mixed-mode infrared photodetector (MMIP) are demonstrated for multi-color detection in both the mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) ranges. The polarization-dependent response of the device has shown that the higher normal-incident absorption is observed for the MWIR peaks | |||
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13 | TW201112435A |
Ingaas-capped lwir quntum-dot infrared photodetectors
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Publication/Patent Number: TW201112435A | Publication Date: 2011-04-01 | Application Number: 98132406 | Filing Date: 2009-09-25 | Inventor： Lin, Shih Yen Tseng, Chi Che Lin, Wei Hsun Chao, Kuang Ping | Assignee: Academia Sinica | IPC: H01L31/0304 | Abstract: The invention discloses InGaAs-capped InAs/GaAs quantum-dot infrared photodetectors (QDIPs). Enhanced detection wavelengths in the long-wavelength infrared range of the device are observed with decreasing InAs coverage. Compared with the standard QDIP without the InGaAs-capped layer | |||
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14 | TW201010105A |
Apparatus and method for forming quantum-dot and quantum-well mixed-mode infrared photodetector
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Publication/Patent Number: TW201010105A | Publication Date: 2010-03-01 | Application Number: 97132489 | Filing Date: 2008-08-26 | Inventor： Lin, Shih Yen Chou, Shu Ting Tseng, Chi Che Lin, Wei Hsun | Assignee: Academia Sinica | IPC: H01L31/101 | Abstract: The present invention is disclosed that Quantum-dot (QD)/quantum-well (QW) mixed-mode infrared photodetector (MMIP) are demonstrated for multi-color detection in both the mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) ranges. The polarization-dependent response of the device has shown that the higher normal-incident absorption is observed for the MWIR peaks |
3.Current Quota