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1
US2020064396A1
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
Publication/Patent Number: US2020064396A1 Publication Date: 2020-02-27 Application Number: 16/522,551 Filing Date: 2019-07-25 Inventor: He, Jun   Lin, Yu-ting   Lin wei hsun   Kuo, Yung-liang   Lu, Yinlung   Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.   IPC: G01R31/28 Abstract: The present disclosure provides a method and a system for testing semiconductor device. The method includes the following operations. A wafer having an IC formed thereon is provided. The IC is energized by raising the voltage of the IC to a first voltage level during a first period. A stress signal is applied to the IC. The stress signal includes a plurality of sequences during a second period subsequent to the first period. Each of the sequence has a ramp-up stage and a ramp-down stage. The stress signal causes the voltage of the IC to fluctuate between a second voltage level and a third voltage level. Whether the IC complies with a test criterion is determined after applying the stress signal.
2
US2020348341A1
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2020348341A1 Publication Date: 2020-11-05 Application Number: 16/933,576 Filing Date: 2020-07-20 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
3
US10718790B2
Devices for high-density probing techniques and method of implementing the same
Publication/Patent Number: US10718790B2 Publication Date: 2020-07-21 Application Number: 16/378,288 Filing Date: 2019-04-08 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
4
US10274518B2
Devices for high-density probing techniques and method of implementing the same
Publication/Patent Number: US10274518B2 Publication Date: 2019-04-30 Application Number: 15/140,758 Filing Date: 2016-04-28 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
5
US2019302146A1
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2019302146A1 Publication Date: 2019-10-03 Application Number: 16/378,288 Filing Date: 2019-04-08 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
6
US9354254B2
Test-yield improvement devices for high-density probing techniques and method of implementing the same
Publication/Patent Number: US9354254B2 Publication Date: 2016-05-31 Application Number: 13/865,243 Filing Date: 2013-04-18 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R31/20 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
7
US2016313372A1
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2016313372A1 Publication Date: 2016-10-27 Application Number: 15/140,758 Filing Date: 2016-04-28 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
8
US9372227B2
Integrated circuit test system and method
Publication/Patent Number: US9372227B2 Publication Date: 2016-06-21 Application Number: 13/792,323 Filing Date: 2013-03-11 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Chen, Hao   Huang, Chung-han   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R31/20 Abstract: A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module.
9
TWI459576B
Ingaas-capped lwir quntum-dot infrared photodetectors
Publication/Patent Number: TWI459576B Publication Date: 2014-11-01 Application Number: 98132406 Filing Date: 2009-09-25 Inventor: Lin, Shih Yen   Tseng, Chi Che   Lin, Wei Hsun   Chao, Kuang Ping   Assignee: Academia Sinica   IPC: H01L31/0304 Abstract: The invention discloses InGaAs-capped InAs/GaAs quantum-dot infrared photodetectors (QDIPs). Enhanced detection wavelengths in the long-wavelength infrared range of the device are observed with decreasing InAs coverage. Compared with the standard QDIP without the InGaAs-capped layer
10
US2014253162A1
INTEGRATED CIRCUIT TEST SYSTEM AND METHOD
Publication/Patent Number: US2014253162A1 Publication Date: 2014-09-11 Application Number: 13/792,323 Filing Date: 2013-03-11 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Chen, Hao   Huang, Chung-han   Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.   IPC: G01R31/28 Abstract: A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module.
11
US2014266273A1
TEST-YIELD IMPROVEMENT DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2014266273A1 Publication Date: 2014-09-18 Application Number: 13/865,243 Filing Date: 2013-04-18 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin wei hsun   Hsu, Sen-kuei   Liu, De-jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
12
TWI400813B
Apparatus and method for forming quantum-dot and quantum-well mixed-mode infrared photodetector
Publication/Patent Number: TWI400813B Publication Date: 2013-07-01 Application Number: 97132489 Filing Date: 2008-08-26 Inventor: Lin, Shih Yen   Chou, Shu Ting   Tseng, Chi Che   Lin, Wei Hsun   Assignee: Academia Sinica   IPC: H01L31/101 Abstract: The present invention is disclosed that Quantum-dot (QD)/quantum-well (QW) mixed-mode infrared photodetector (MMIP) are demonstrated for multi-color detection in both the mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) ranges. The polarization-dependent response of the device has shown that the higher normal-incident absorption is observed for the MWIR peaks
13
TW201112435A
Ingaas-capped lwir quntum-dot infrared photodetectors
Publication/Patent Number: TW201112435A Publication Date: 2011-04-01 Application Number: 98132406 Filing Date: 2009-09-25 Inventor: Lin, Shih Yen   Tseng, Chi Che   Lin, Wei Hsun   Chao, Kuang Ping   Assignee: Academia Sinica   IPC: H01L31/0304 Abstract: The invention discloses InGaAs-capped InAs/GaAs quantum-dot infrared photodetectors (QDIPs). Enhanced detection wavelengths in the long-wavelength infrared range of the device are observed with decreasing InAs coverage. Compared with the standard QDIP without the InGaAs-capped layer
14
TW201010105A
Apparatus and method for forming quantum-dot and quantum-well mixed-mode infrared photodetector
Publication/Patent Number: TW201010105A Publication Date: 2010-03-01 Application Number: 97132489 Filing Date: 2008-08-26 Inventor: Lin, Shih Yen   Chou, Shu Ting   Tseng, Chi Che   Lin, Wei Hsun   Assignee: Academia Sinica   IPC: H01L31/101 Abstract: The present invention is disclosed that Quantum-dot (QD)/quantum-well (QW) mixed-mode infrared photodetector (MMIP) are demonstrated for multi-color detection in both the mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) ranges. The polarization-dependent response of the device has shown that the higher normal-incident absorption is observed for the MWIR peaks