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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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Inventor Inventor Assignee Assignee IPC IPC
1
US2020348341A1
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2020348341A1 Publication Date: 2020-11-05 Application Number: 16/933,576 Filing Date: 2020-07-20 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
2
US10718790B2
Devices for high-density probing techniques and method of implementing the same
Publication/Patent Number: US10718790B2 Publication Date: 2020-07-21 Application Number: 16/378,288 Filing Date: 2019-04-08 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
3
US10274518B2
Devices for high-density probing techniques and method of implementing the same
Publication/Patent Number: US10274518B2 Publication Date: 2019-04-30 Application Number: 15/140,758 Filing Date: 2016-04-28 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
4
US2019302146A1
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2019302146A1 Publication Date: 2019-10-03 Application Number: 16/378,288 Filing Date: 2019-04-08 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
5
US9354254B2
Test-yield improvement devices for high-density probing techniques and method of implementing the same
Publication/Patent Number: US9354254B2 Publication Date: 2016-05-31 Application Number: 13/865,243 Filing Date: 2013-04-18 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R31/20 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
6
US2016313372A1
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2016313372A1 Publication Date: 2016-10-27 Application Number: 15/140,758 Filing Date: 2016-04-28 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
7
US2014266273A1
TEST-YIELD IMPROVEMENT DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME
Publication/Patent Number: US2014266273A1 Publication Date: 2014-09-18 Application Number: 13/865,243 Filing Date: 2013-04-18 Inventor: Wang, Mill-jer   Peng, Ching-nen   Lin, Hung-chih   Lin, Wei-hsun   Hsu, Sen-kuei   Liu de jian   Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.   IPC: G01R1/073 Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
8
TW200823614A
System and method for controlling long-distance digital switches
Publication/Patent Number: TW200823614A Publication Date: 2008-06-01 Application Number: 95143812 Filing Date: 2006-11-27 Inventor: Zhang, Zhi-yong   Liu de jian   Assignee: Hon Hai Precision Industry Co., Ltd.   IPC: G05B19/10 Abstract: A system for controlling long-distance digital switches is disclosed. The system includes a computer. The computer is connected with a device for controlling long-distance switches via a network. The device is connected with an electrical outlet