Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
US2021005688A1
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
Publication/Patent Number: US2021005688A1 Publication Date: 2021-01-07 Application Number: 16/968,824 Filing Date: 2019-01-24 Inventor: Shinya, Kimihiro   Yamamoto, Atsushi   Maeda, Kensaku   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/32 Abstract: In a display device including a light emitting element, light extraction efficiency and a luminance viewing angle characteristic are improved. The display device includes a light emitting element, a condenser lens, and a scattering lens. The light emitting element is an element that emits light. The condenser lens is a lens that condenses the light emitted from the light emitting element. The scattering lens is a lens that scatters the light condensed by the condenser lens. Combination of the condenser lens and the scattering lens improves the light extraction efficiency and the luminance viewing angle characteristic.
2
US10566403B2
Display device, manufacturing method for display device, and electronic device with substrate spacer
Publication/Patent Number: US10566403B2 Publication Date: 2020-02-18 Application Number: 15/551,737 Filing Date: 2015-11-09 Inventor: Sakairi, Takashi   Maeda, Kensaku   Assignee: Sony Corporation   IPC: G09G3/30 Abstract: A display device of the present disclosure includes: a first substrate on which a pixel including a light emitting portion is formed; a second substrate arranged in a manner facing the first substrate; a color filter provided between the first substrate and the second substrate; and a substrate spacing setting unit provided in at least a peripheral portion of a display area of the first substrate made by forming pixels, and adapted to set substrate spacing between the first substrate and the second substrate. The substrate spacing setting unit is formed of at least two layers including: a first adjustment layer formed in a predetermined pattern on the first substrate; and a second adjustment layer stacked on the first adjustment layer in a step of forming the color filter by using a material same as a material of the color filter.
3
US10539849B2
Color change member, light emitting device, display device and electronic apparatus
Publication/Patent Number: US10539849B2 Publication Date: 2020-01-21 Application Number: 14/640,548 Filing Date: 2015-03-06 Inventor: Moriya, Yusuke   Maeda, Kensaku   Assignee: JOLED INC.   IPC: G02F1/137 Abstract: A color change member includes: a color change layer that has a light incident surface, a light emission surface, and a side surface; a first protective layer that is provided on the light incident surface of the color change layer; and a second protective layer that is provided on at least a part of the side surface of the color change layer.
4
EP3587014B1
HARD TIP BAND-SAW BLADE
Publication/Patent Number: EP3587014B1 Publication Date: 2020-09-09 Application Number: 18756795.3 Filing Date: 2018-02-21 Inventor: Yamashita, Yoshihiro   Schloegl, Manfred   Maeda, Kensaku   Assignee: Amada Holdings Co., Ltd.   Amada Machine Tools Co., Ltd   IPC: B23D61/12
5
EP3587014A1
HARD TIP BAND-SAW BLADE
Publication/Patent Number: EP3587014A1 Publication Date: 2020-01-01 Application Number: 18756795.3 Filing Date: 2018-02-21 Inventor: Yamashita, Yoshihiro   Schloegl, Manfred   Maeda, Kensaku   Assignee: Amada Holdings Co., Ltd.   Amada Machine Tools Co., Ltd   IPC: B23D61/12 Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction.
6
US2020066776A1
IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND METHOD
Publication/Patent Number: US2020066776A1 Publication Date: 2020-02-27 Application Number: 16/592,081 Filing Date: 2019-10-03 Inventor: Ootsuka, Yoichi   Yamamoto, Atsushi   Maeda, Kensaku   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: There is provided an image pickup element including a non-planar layer having a non-planar light incident surface in a light receiving region, and a microlens of an inorganic material which is provided on a side of the light incident surface of the non-planar layer, and collects incident light.
7
US10866345B2
Laminated lens structure, camera module, and method for manufacturing laminated lens structure
Publication/Patent Number: US10866345B2 Publication Date: 2020-12-15 Application Number: 16/323,917 Filing Date: 2017-06-27 Inventor: Yamamoto, Atsushi   Matsugai, Hiroyasu   Maeda, Kensaku   Ogita, Tomoharu   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B3/00 Abstract: To prevent the resin from oozing out during the lens molding due to the capillary action. A laminated lens structure according to the present disclosure includes: a plurality of lens structures including a substrate provided with an opening part, a lens inserted into the opening part to be fixed to the substrate, and a recessed part provided at an area in which a lateral face of the opening part and a surface of the substrate are intersected, and recessed more than the surface of the substrate. The lenses are arrayed in an optical axis direction by the substrates being joined. This configuration makes it possible to prevent the resin from oozing out during the lens molding due to the capillary action.
8
US202009669A1
HARD TIP BAND-SAW BLADE
Publication/Patent Number: US202009669A1 Publication Date: 2020-01-09 Application Number: 20/181,648 Filing Date: 2018-02-21 Inventor: Maeda, Kensaku   Schloegl, Manfred   Yamashita, Yoshihiro   Assignee: AMADA MACHINE TOOLS COMPANY, LTD.   AMADA HOLDINGS CO., LTD.   IPC: B23D61/12 Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction.
9
US2020009669A1
HARD TIP BAND-SAW BLADE
Publication/Patent Number: US2020009669A1 Publication Date: 2020-01-09 Application Number: 16/482,849 Filing Date: 2018-02-21 Inventor: Yamashita, Yoshihiro   Schloegl, Manfred   Maeda, Kensaku   Assignee: AMADA HOLDINGS CO., LTD.   AMADA MACHINE TOOLS COMPANY, LTD.   IPC: B23D61/12 Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction.
10
US2020395575A1
LIGHT-EMITTING MODULE, DISPLAY DEVICE, AND METHODS FOR MANUFACTURING THE LIGHT-EMITTING MODULE AND THE DISPLAY DEVICE
Publication/Patent Number: US2020395575A1 Publication Date: 2020-12-17 Application Number: 16/956,907 Filing Date: 2018-11-28 Inventor: Maeda, Kensaku   Shinya, Kimihiro   Yamamoto, Atsushi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L51/52 Abstract: To simplify a process of manufacturing a light-emitting module for displaying an image. The light-emitting module includes light-emitting elements, a protective layer, color changing members, and an optical layer. The light-emitting elements are arranged on a substrate. The protective layer is formed in such a way as to cover the light-emitting elements. The color changing members are disposed in such a way as to correspond to at least some of the light-emitting elements with the protective layer interposed between the color changing members and the some of the light-emitting elements. The optical layer is formed in such a way as to cover the color changing members and the protective layer. This optical layer condenses or scatters light with its curved shape.
11
US10821531B2
Hard tip band-saw blade
Publication/Patent Number: US10821531B2 Publication Date: 2020-11-03 Application Number: 16/482,849 Filing Date: 2018-02-21 Inventor: Yamashita, Yoshihiro   Schloegl, Manfred   Maeda, Kensaku   Assignee: AMADA HOLDINGS CO., LTD.   AMADA MACHINE TOOLS COMPANY, LTD.   IPC: B23D61/12 Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction.
12
US10608028B2
Image sensor having improved dicing properties
Publication/Patent Number: US10608028B2 Publication Date: 2020-03-31 Application Number: 16/045,973 Filing Date: 2018-07-26 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/00 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
13
US2020273897A1
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
Publication/Patent Number: US2020273897A1 Publication Date: 2020-08-27 Application Number: 16/807,049 Filing Date: 2020-03-02 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.