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1 | US2021005688A1 |
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
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Publication/Patent Number: US2021005688A1 | Publication Date: 2021-01-07 | Application Number: 16/968,824 | Filing Date: 2019-01-24 | Inventor： Shinya, Kimihiro Yamamoto, Atsushi Maeda, Kensaku | Assignee: Sony Semiconductor Solutions Corporation | IPC: H01L27/32 | Abstract: In a display device including a light emitting element, light extraction efficiency and a luminance viewing angle characteristic are improved. The display device includes a light emitting element, a condenser lens, and a scattering lens. The light emitting element is an element that emits light. The condenser lens is a lens that condenses the light emitted from the light emitting element. The scattering lens is a lens that scatters the light condensed by the condenser lens. Combination of the condenser lens and the scattering lens improves the light extraction efficiency and the luminance viewing angle characteristic. | |||
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2 | US10566403B2 |
Display device, manufacturing method for display device, and electronic device with substrate spacer
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Publication/Patent Number: US10566403B2 | Publication Date: 2020-02-18 | Application Number: 15/551,737 | Filing Date: 2015-11-09 | Inventor： Sakairi, Takashi Maeda, Kensaku | Assignee: Sony Corporation | IPC: G09G3/30 | Abstract: A display device of the present disclosure includes: a first substrate on which a pixel including a light emitting portion is formed; a second substrate arranged in a manner facing the first substrate; a color filter provided between the first substrate and the second substrate; and a substrate spacing setting unit provided in at least a peripheral portion of a display area of the first substrate made by forming pixels, and adapted to set substrate spacing between the first substrate and the second substrate. The substrate spacing setting unit is formed of at least two layers including: a first adjustment layer formed in a predetermined pattern on the first substrate; and a second adjustment layer stacked on the first adjustment layer in a step of forming the color filter by using a material same as a material of the color filter. | |||
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3 | US10539849B2 |
Color change member, light emitting device, display device and electronic apparatus
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Publication/Patent Number: US10539849B2 | Publication Date: 2020-01-21 | Application Number: 14/640,548 | Filing Date: 2015-03-06 | Inventor： Moriya, Yusuke Maeda, Kensaku | Assignee: JOLED INC. | IPC: G02F1/137 | Abstract: A color change member includes: a color change layer that has a light incident surface, a light emission surface, and a side surface; a first protective layer that is provided on the light incident surface of the color change layer; and a second protective layer that is provided on at least a part of the side surface of the color change layer. | |||
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4 | EP3587014B1 |
HARD TIP BAND-SAW BLADE
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Publication/Patent Number: EP3587014B1 | Publication Date: 2020-09-09 | Application Number: 18756795.3 | Filing Date: 2018-02-21 | Inventor： Yamashita, Yoshihiro Schloegl, Manfred Maeda, Kensaku | Assignee: Amada Holdings Co., Ltd. Amada Machine Tools Co., Ltd | IPC: B23D61/12 | ||||
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5 | EP3587014A1 |
HARD TIP BAND-SAW BLADE
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Publication/Patent Number: EP3587014A1 | Publication Date: 2020-01-01 | Application Number: 18756795.3 | Filing Date: 2018-02-21 | Inventor： Yamashita, Yoshihiro Schloegl, Manfred Maeda, Kensaku | Assignee: Amada Holdings Co., Ltd. Amada Machine Tools Co., Ltd | IPC: B23D61/12 | Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction. | |||
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6 | US2020066776A1 |
IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND METHOD
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Publication/Patent Number: US2020066776A1 | Publication Date: 2020-02-27 | Application Number: 16/592,081 | Filing Date: 2019-10-03 | Inventor： Ootsuka, Yoichi Yamamoto, Atsushi Maeda, Kensaku | Assignee: Sony Corporation | IPC: H01L27/146 | Abstract: There is provided an image pickup element including a non-planar layer having a non-planar light incident surface in a light receiving region, and a microlens of an inorganic material which is provided on a side of the light incident surface of the non-planar layer, and collects incident light. | |||
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7 | US10866345B2 |
Laminated lens structure, camera module, and method for manufacturing laminated lens structure
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Publication/Patent Number: US10866345B2 | Publication Date: 2020-12-15 | Application Number: 16/323,917 | Filing Date: 2017-06-27 | Inventor： Yamamoto, Atsushi Matsugai, Hiroyasu Maeda, Kensaku Ogita, Tomoharu | Assignee: Sony Semiconductor Solutions Corporation | IPC: G02B3/00 | Abstract: To prevent the resin from oozing out during the lens molding due to the capillary action. A laminated lens structure according to the present disclosure includes: a plurality of lens structures including a substrate provided with an opening part, a lens inserted into the opening part to be fixed to the substrate, and a recessed part provided at an area in which a lateral face of the opening part and a surface of the substrate are intersected, and recessed more than the surface of the substrate. The lenses are arrayed in an optical axis direction by the substrates being joined. This configuration makes it possible to prevent the resin from oozing out during the lens molding due to the capillary action. | |||
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8 | US202009669A1 |
HARD TIP BAND-SAW BLADE
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Publication/Patent Number: US202009669A1 | Publication Date: 2020-01-09 | Application Number: 20/181,648 | Filing Date: 2018-02-21 | Inventor： Maeda, Kensaku Schloegl, Manfred Yamashita, Yoshihiro | Assignee: AMADA MACHINE TOOLS COMPANY, LTD. AMADA HOLDINGS CO., LTD. | IPC: B23D61/12 | Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction. | |||
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9 | US2020009669A1 |
HARD TIP BAND-SAW BLADE
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Publication/Patent Number: US2020009669A1 | Publication Date: 2020-01-09 | Application Number: 16/482,849 | Filing Date: 2018-02-21 | Inventor： Yamashita, Yoshihiro Schloegl, Manfred Maeda, Kensaku | Assignee: AMADA HOLDINGS CO., LTD. AMADA MACHINE TOOLS COMPANY, LTD. | IPC: B23D61/12 | Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction. | |||
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10 | US2020395575A1 |
LIGHT-EMITTING MODULE, DISPLAY DEVICE, AND METHODS FOR MANUFACTURING THE LIGHT-EMITTING MODULE AND THE DISPLAY DEVICE
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Publication/Patent Number: US2020395575A1 | Publication Date: 2020-12-17 | Application Number: 16/956,907 | Filing Date: 2018-11-28 | Inventor： Maeda, Kensaku Shinya, Kimihiro Yamamoto, Atsushi | Assignee: Sony Semiconductor Solutions Corporation | IPC: H01L51/52 | Abstract: To simplify a process of manufacturing a light-emitting module for displaying an image. The light-emitting module includes light-emitting elements, a protective layer, color changing members, and an optical layer. The light-emitting elements are arranged on a substrate. The protective layer is formed in such a way as to cover the light-emitting elements. The color changing members are disposed in such a way as to correspond to at least some of the light-emitting elements with the protective layer interposed between the color changing members and the some of the light-emitting elements. The optical layer is formed in such a way as to cover the color changing members and the protective layer. This optical layer condenses or scatters light with its curved shape. | |||
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11 | US10821531B2 |
Hard tip band-saw blade
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Publication/Patent Number: US10821531B2 | Publication Date: 2020-11-03 | Application Number: 16/482,849 | Filing Date: 2018-02-21 | Inventor： Yamashita, Yoshihiro Schloegl, Manfred Maeda, Kensaku | Assignee: AMADA HOLDINGS CO., LTD. AMADA MACHINE TOOLS COMPANY, LTD. | IPC: B23D61/12 | Abstract: A hard tip band-saw blade includes alternating sawtooth groups. Each of the sawtooth groups includes two sawtooth subgroups. The first sawtooth subgroup includes, as a plurality of sawteeth, a first leading tooth and a first following tooth and the second sawtooth subgroup includes, as a plurality of sawteeth, a second leading tooth, a second following tooth, and a third following tooth. Each tooth top corner part of a hard tip of the first following tooth, a tooth top corner part on a left side of a hard tip of the second following tooth, and a tooth top corner part on a right side of a hard tip of the third following tooth most outwardly protrude in a left-right direction. | |||
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12 | US10608028B2 |
Image sensor having improved dicing properties
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Publication/Patent Number: US10608028B2 | Publication Date: 2020-03-31 | Application Number: 16/045,973 | Filing Date: 2018-07-26 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/00 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. | |||
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13 | US2020273897A1 |
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
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Publication/Patent Number: US2020273897A1 | Publication Date: 2020-08-27 | Application Number: 16/807,049 | Filing Date: 2020-03-02 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. |
