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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US10875987B2
Systems and methods for marking plastics
Publication/Patent Number: US10875987B2 Publication Date: 2020-12-29 Application Number: 16/400,868 Filing Date: 2019-05-01 Inventor: Malchow douglas stewart   Assignee: Sensors Unlimited, Inc.   IPC: G01J5/02 Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described.
2
EP3608962A1
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
Publication/Patent Number: EP3608962A1 Publication Date: 2020-02-12 Application Number: 19189836.0 Filing Date: 2019-08-02 Inventor: Zhang, Wei   Evans, Michael J.   Malchow douglas stewart   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of forming an array of photodiodes includes forming a cap layer (102) on a surface (104) of an absorption layer (106). The method includes forming a plurality of spaced apart pixel diffusion areas (116) in the cap layer (102). The method includes forming a mesa trench (124) with opposed sidewalls (126) through the cap layer (102), wherein the mesa trench (124) surrounds each of the pixel diffusion areas (116) separating the pixel diffusion areas (116) from one another. The method includes forming a sidewall passivation layer (128) over the sidewalls (126) of the mesa trench (124) and removing a portion of the sidewall passivation layer (128) to expose a respective contact (118) electrically connected to each of the pixel diffusion areas (116), but leaving the sidewalls (126) of the mesa trench covered with the sidewall passivation layer (128) wherein the contact (118) is open and uncovered for electrical connection.
3
US2020052012A1
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
Publication/Patent Number: US2020052012A1 Publication Date: 2020-02-13 Application Number: 16/057,191 Filing Date: 2018-08-07 Inventor: Zhang, Wei   Evans, Michael J.   Malchow douglas stewart   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection.
4
US202052012A1
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
Publication/Patent Number: US202052012A1 Publication Date: 2020-02-13 Application Number: 20/181,605 Filing Date: 2018-08-07 Inventor: Zhang, Wei   Malchow douglas stewart   Evans, Michael J.   Paik, Namwoong   Bereznycky, Paul L.   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection.
5
US10727267B2
Interconnect bump structures for photo detectors
Publication/Patent Number: US10727267B2 Publication Date: 2020-07-28 Application Number: 16/129,402 Filing Date: 2018-09-12 Inventor: Zhang, Wei   Malchow douglas stewart   Evans, Michael J.   Huang, Wei   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
6
US2020083272A1
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
Publication/Patent Number: US2020083272A1 Publication Date: 2020-03-12 Application Number: 16/129,402 Filing Date: 2018-09-12 Inventor: Zhang, Wei   Malchow douglas stewart   Evans, Michael J.   Huang, Wei   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
7
US2020312900A1
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
Publication/Patent Number: US2020312900A1 Publication Date: 2020-10-01 Application Number: 16/902,318 Filing Date: 2020-06-16 Inventor: Zhang, Wei   Malchow douglas stewart   Evans, Michael J.   Huang, Wei   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
8
EP3624191A1
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
Publication/Patent Number: EP3624191A1 Publication Date: 2020-03-18 Application Number: 19197065.6 Filing Date: 2019-09-12 Inventor: Zhang, Wei   Malchow douglas stewart   Evans, Michael J.   Huang, Wei   Bereznycky, Paul L.   Paik, Namwoong   Assignee: Sensors Unlimited, Inc.   IPC: H01L27/146 Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.
9
US2019256685A1
SYSTEMS AND METHODS FOR MARKING PLASTICS
Publication/Patent Number: US2019256685A1 Publication Date: 2019-08-22 Application Number: 16/400,868 Filing Date: 2019-05-01 Inventor: Malchow douglas stewart   Assignee: Sensors Unlimited, Inc.   IPC: G01N21/31 Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described.
10
US9485439B2
Shortwave infrared camera with bandwidth restriction
Publication/Patent Number: US9485439B2 Publication Date: 2016-11-01 Application Number: 14/171,859 Filing Date: 2014-02-04 Inventor: Malchow douglas stewart   Dixon, Peter   Rozploch, Robert   Assignee: Sensors Unlimited, Inc.   IPC: H04N5/33 Abstract: A camera comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed.
11
KR20150064674A
SHORTWAVE INFRARED CAMERA WITH BANDWIDTH RESTRICTION
Publication/Patent Number: KR20150064674A Publication Date: 2015-06-11 Application Number: 20140167977 Filing Date: 2014-11-28 Inventor: Dixon, Peter   Malchow douglas stewart   Rozploch, Robert   Assignee: SENSORS UNLIMITED, INC.   IPC: G01J5/48 Abstract: The present invention relates to a camera which comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a part of a shortwave infrared wavelength band and excludes other wavelengths. Also disclosed is a method to design the camera.
12
EP2882185A1
Shortwave infrared camera with bandwidth restriction
Publication/Patent Number: EP2882185A1 Publication Date: 2015-06-10 Application Number: 14194938.8 Filing Date: 2014-11-26 Inventor: Malchow douglas stewart   Dixon, Peter   Rozploch, Robert   Assignee: Sensors Unlimited, Inc.   IPC: H04N5/33 Abstract: A camera comprises an image plane 28 for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed.
13
US2015156426A1
SHORTWAVE INFRARED CAMERA WITH BANDWIDTH RESTRICTION
Publication/Patent Number: US2015156426A1 Publication Date: 2015-06-04 Application Number: 14/171,859 Filing Date: 2014-02-04 Inventor: Malchow douglas stewart   Dixon, Peter   Rozploch, Robert   Assignee: Sensors Unlimited, Inc.   IPC: H04N5/33 Abstract: A camera comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed.