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1 | US10875987B2 |
Systems and methods for marking plastics
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Publication/Patent Number: US10875987B2 | Publication Date: 2020-12-29 | Application Number: 16/400,868 | Filing Date: 2019-05-01 | Inventor： Malchow douglas stewart | Assignee: Sensors Unlimited, Inc. | IPC: G01J5/02 | Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described. | |||
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2 | EP3608962A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: EP3608962A1 | Publication Date: 2020-02-12 | Application Number: 19189836.0 | Filing Date: 2019-08-02 | Inventor： Zhang, Wei Evans, Michael J. Malchow douglas stewart Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer (102) on a surface (104) of an absorption layer (106). The method includes forming a plurality of spaced apart pixel diffusion areas (116) in the cap layer (102). The method includes forming a mesa trench (124) with opposed sidewalls (126) through the cap layer (102), wherein the mesa trench (124) surrounds each of the pixel diffusion areas (116) separating the pixel diffusion areas (116) from one another. The method includes forming a sidewall passivation layer (128) over the sidewalls (126) of the mesa trench (124) and removing a portion of the sidewall passivation layer (128) to expose a respective contact (118) electrically connected to each of the pixel diffusion areas (116), but leaving the sidewalls (126) of the mesa trench covered with the sidewall passivation layer (128) wherein the contact (118) is open and uncovered for electrical connection. | |||
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3 | US2020052012A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: US2020052012A1 | Publication Date: 2020-02-13 | Application Number: 16/057,191 | Filing Date: 2018-08-07 | Inventor： Zhang, Wei Evans, Michael J. Malchow douglas stewart Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection. | |||
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4 | US202052012A1 |
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
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Publication/Patent Number: US202052012A1 | Publication Date: 2020-02-13 | Application Number: 20/181,605 | Filing Date: 2018-08-07 | Inventor： Zhang, Wei Malchow douglas stewart Evans, Michael J. Paik, Namwoong Bereznycky, Paul L. | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection. | |||
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5 | US10727267B2 |
Interconnect bump structures for photo detectors
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Publication/Patent Number: US10727267B2 | Publication Date: 2020-07-28 | Application Number: 16/129,402 | Filing Date: 2018-09-12 | Inventor： Zhang, Wei Malchow douglas stewart Evans, Michael J. Huang, Wei Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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6 | US2020083272A1 |
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
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Publication/Patent Number: US2020083272A1 | Publication Date: 2020-03-12 | Application Number: 16/129,402 | Filing Date: 2018-09-12 | Inventor： Zhang, Wei Malchow douglas stewart Evans, Michael J. Huang, Wei Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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7 | US2020312900A1 |
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
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Publication/Patent Number: US2020312900A1 | Publication Date: 2020-10-01 | Application Number: 16/902,318 | Filing Date: 2020-06-16 | Inventor： Zhang, Wei Malchow douglas stewart Evans, Michael J. Huang, Wei Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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8 | EP3624191A1 |
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
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Publication/Patent Number: EP3624191A1 | Publication Date: 2020-03-18 | Application Number: 19197065.6 | Filing Date: 2019-09-12 | Inventor： Zhang, Wei Malchow douglas stewart Evans, Michael J. Huang, Wei Bereznycky, Paul L. Paik, Namwoong | Assignee: Sensors Unlimited, Inc. | IPC: H01L27/146 | Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays. | |||
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9 | US2019256685A1 |
SYSTEMS AND METHODS FOR MARKING PLASTICS
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Publication/Patent Number: US2019256685A1 | Publication Date: 2019-08-22 | Application Number: 16/400,868 | Filing Date: 2019-05-01 | Inventor： Malchow douglas stewart | Assignee: Sensors Unlimited, Inc. | IPC: G01N21/31 | Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described. | |||
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10 | US9485439B2 |
Shortwave infrared camera with bandwidth restriction
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Publication/Patent Number: US9485439B2 | Publication Date: 2016-11-01 | Application Number: 14/171,859 | Filing Date: 2014-02-04 | Inventor： Malchow douglas stewart Dixon, Peter Rozploch, Robert | Assignee: Sensors Unlimited, Inc. | IPC: H04N5/33 | Abstract: A camera comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed. | |||
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11 | KR20150064674A |
SHORTWAVE INFRARED CAMERA WITH BANDWIDTH RESTRICTION
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Publication/Patent Number: KR20150064674A | Publication Date: 2015-06-11 | Application Number: 20140167977 | Filing Date: 2014-11-28 | Inventor： Dixon, Peter Malchow douglas stewart Rozploch, Robert | Assignee: SENSORS UNLIMITED, INC. | IPC: G01J5/48 | Abstract: The present invention relates to a camera which comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a part of a shortwave infrared wavelength band and excludes other wavelengths. Also disclosed is a method to design the camera. | |||
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12 | EP2882185A1 |
Shortwave infrared camera with bandwidth restriction
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Publication/Patent Number: EP2882185A1 | Publication Date: 2015-06-10 | Application Number: 14194938.8 | Filing Date: 2014-11-26 | Inventor： Malchow douglas stewart Dixon, Peter Rozploch, Robert | Assignee: Sensors Unlimited, Inc. | IPC: H04N5/33 | Abstract: A camera comprises an image plane 28 for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed. | |||
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13 | US2015156426A1 |
SHORTWAVE INFRARED CAMERA WITH BANDWIDTH RESTRICTION
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Publication/Patent Number: US2015156426A1 | Publication Date: 2015-06-04 | Application Number: 14/171,859 | Filing Date: 2014-02-04 | Inventor： Malchow douglas stewart Dixon, Peter Rozploch, Robert | Assignee: Sensors Unlimited, Inc. | IPC: H04N5/33 | Abstract: A camera comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed. |
3.Current Quota