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1
US10923517B2
Solid-state imaging apparatus having output circuit unit for outputting a pixel signal
Publication/Patent Number: US10923517B2 Publication Date: 2021-02-16 Application Number: 16/854,344 Filing Date: 2020-04-21 Inventor: Tanaka, Harumi   Masuda, Yoshiaki   Miyazawa, Shinji   Ishida, Minoru   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.
2
US10919294B2
Liquid discharging device and liquid discharging method
Publication/Patent Number: US10919294B2 Publication Date: 2021-02-16 Application Number: 16/354,880 Filing Date: 2019-03-15 Inventor: Fujita, Takuya   Sakaguchi, Hiromi   Nakamura, Yuta   Shimura, Naoto   Masuda, Yoshiaki   Ueda, Tetsuto   Nemoto, Yoshimi   Taguma, Kenichi   Toda, Naohiro   Seno, Shinya   Satoh, Nobuyuki   Assignee: Ricoh Company, Ltd.   IPC: B41J2/045 Abstract: A liquid discharging device includes a carriage carrying a head configured to discharge a liquid onto a target, the liquid including an ink, the ink consisting water, an organic solvent, a coloring material, and a plurality of polysiloxane compounds, a driving unit configured to move the carriage and the target relatively to each other, a measuring unit configured to measure the distance between the carriage and the target, an image-capturing unit configured to capture a target image, and a setting unit configured to set a liquid discharging performance of the head based on a measurement result obtained by the measuring unit and the target image obtained by the image-capturing unit.
3
US10872998B2
Chip size package, method of manufacturing the same, electronic device, and endoscope
Publication/Patent Number: US10872998B2 Publication Date: 2020-12-22 Application Number: 16/085,695 Filing Date: 2017-03-10 Inventor: Masuda, Yoshiaki   Assignee: SONY CORPORATION   IPC: H01L31/12 Abstract: The present disclosure relates to a chip size package that enables realization of a compact chip size package in which a solid-state imaging element and a light emitting element are integrated, a method of manufacturing the same, an electronic device, and an endoscope. The chip size package which is an aspect of the present disclosure is provided with a solid-state imaging element which generates a pixel signal according to incident light and a light emitting element which outputs irradiation light according to voltage applied in which the solid-state imaging element and the light emitting element are integrated. The present disclosure is applicable to, for example, a compact electronic device, a medical endoscope, and the like.
4
US2020357839A1
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2020357839A1 Publication Date: 2020-11-12 Application Number: 16/938,324 Filing Date: 2020-07-24 Inventor: Miyazawa, Shinji   Masuda, Yoshiaki   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.
5
EP3435414B1
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3435414B1 Publication Date: 2020-12-16 Application Number: 17769970.9 Filing Date: 2017-03-10 Inventor: Miyazawa, Shinji   Masuda, Yoshiaki   Assignee: Sony Corporation   IPC: H01L27/146
6
US10680026B2
Semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus
Publication/Patent Number: US10680026B2 Publication Date: 2020-06-09 Application Number: 16/085,962 Filing Date: 2017-03-13 Inventor: Masuda, Yoshiaki   Ishida, Minoru   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices.
7
US10777598B2
Image pickup device and electronic apparatus
Publication/Patent Number: US10777598B2 Publication Date: 2020-09-15 Application Number: 16/085,415 Filing Date: 2017-03-10 Inventor: Miyazawa, Shinji   Masuda, Yoshiaki   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.