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1 | US10923517B2 |
Solid-state imaging apparatus having output circuit unit for outputting a pixel signal
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Publication/Patent Number: US10923517B2 | Publication Date: 2021-02-16 | Application Number: 16/854,344 | Filing Date: 2020-04-21 | Inventor： Tanaka, Harumi Masuda, Yoshiaki Miyazawa, Shinji Ishida, Minoru | Assignee: Sony Corporation | IPC: H01L27/146 | Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit. | |||
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2 | US10919294B2 |
Liquid discharging device and liquid discharging method
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Publication/Patent Number: US10919294B2 | Publication Date: 2021-02-16 | Application Number: 16/354,880 | Filing Date: 2019-03-15 | Inventor： Fujita, Takuya Sakaguchi, Hiromi Nakamura, Yuta Shimura, Naoto Masuda, Yoshiaki Ueda, Tetsuto Nemoto, Yoshimi Taguma, Kenichi Toda, Naohiro Seno, Shinya Satoh, Nobuyuki | Assignee: Ricoh Company, Ltd. | IPC: B41J2/045 | Abstract: A liquid discharging device includes a carriage carrying a head configured to discharge a liquid onto a target, the liquid including an ink, the ink consisting water, an organic solvent, a coloring material, and a plurality of polysiloxane compounds, a driving unit configured to move the carriage and the target relatively to each other, a measuring unit configured to measure the distance between the carriage and the target, an image-capturing unit configured to capture a target image, and a setting unit configured to set a liquid discharging performance of the head based on a measurement result obtained by the measuring unit and the target image obtained by the image-capturing unit. | |||
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3 | US10872998B2 |
Chip size package, method of manufacturing the same, electronic device, and endoscope
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Publication/Patent Number: US10872998B2 | Publication Date: 2020-12-22 | Application Number: 16/085,695 | Filing Date: 2017-03-10 | Inventor： Masuda, Yoshiaki | Assignee: SONY CORPORATION | IPC: H01L31/12 | Abstract: The present disclosure relates to a chip size package that enables realization of a compact chip size package in which a solid-state imaging element and a light emitting element are integrated, a method of manufacturing the same, an electronic device, and an endoscope. The chip size package which is an aspect of the present disclosure is provided with a solid-state imaging element which generates a pixel signal according to incident light and a light emitting element which outputs irradiation light according to voltage applied in which the solid-state imaging element and the light emitting element are integrated. The present disclosure is applicable to, for example, a compact electronic device, a medical endoscope, and the like. | |||
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4 | US2020357839A1 |
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: US2020357839A1 | Publication Date: 2020-11-12 | Application Number: 16/938,324 | Filing Date: 2020-07-24 | Inventor： Miyazawa, Shinji Masuda, Yoshiaki | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like. | |||
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5 | EP3435414B1 |
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: EP3435414B1 | Publication Date: 2020-12-16 | Application Number: 17769970.9 | Filing Date: 2017-03-10 | Inventor： Miyazawa, Shinji Masuda, Yoshiaki | Assignee: Sony Corporation | IPC: H01L27/146 | ||||
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6 | US10680026B2 |
Semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus
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Publication/Patent Number: US10680026B2 | Publication Date: 2020-06-09 | Application Number: 16/085,962 | Filing Date: 2017-03-13 | Inventor： Masuda, Yoshiaki Ishida, Minoru | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices. | |||
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7 | US10777598B2 |
Image pickup device and electronic apparatus
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Publication/Patent Number: US10777598B2 | Publication Date: 2020-09-15 | Application Number: 16/085,415 | Filing Date: 2017-03-10 | Inventor： Miyazawa, Shinji Masuda, Yoshiaki | Assignee: Sony Corporation | IPC: H01L27/146 | Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like. |
