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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
EP3329315B1
STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3329315B1 Publication Date: 2021-03-31 Application Number: 16751020.5 Filing Date: 2016-07-19 Inventor: Yamamoto, Atsushi   Takeuchi, Koichi   Kurobe, Toshihiro   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B13/00
2
EP3329313B1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: EP3329313B1 Publication Date: 2021-02-17 Application Number: 16751016.3 Filing Date: 2016-07-15 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B13/00
3
US2020328248A1
CAMERA PACKAGE, MANUFACTURING METHOD OF CAMERA PACKAGE, AND ELECTRONIC DEVICE
Publication/Patent Number: US2020328248A1 Publication Date: 2020-10-15 Application Number: 16/956,746 Filing Date: 2018-12-21 Inventor: Matsugai, Hiroyasu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to a camera package, a manufacturing method of a camera package, and an electronic device capable of reducing a manufacturing cost for forming a lens. The manufacturing method of the camera package according to the present disclosure includes forming a high-contact angle film around a lens forming region on an upper side of a transparent substrate that protects a solid-state imaging element, dropping a lens material in the lens forming region on the upper side of the transparent substrate, and molding the dropped lens material by a mold to form a lens. The present disclosure is applicable to, for example, a camera package and the like in which a lens is arranged above a solid-state imaging element.
4
US10854667B2
Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
Publication/Patent Number: US10854667B2 Publication Date: 2020-12-01 Application Number: 16/430,218 Filing Date: 2019-06-03 Inventor: Matsugai, Hiroyasu   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: There is provided solid-state imaging devices and methods of forming the same, the solid-state imaging devices including: a semiconductor substrate; a glass substrate; an adhesion layer provided between the semiconductor substrate and the glass substrate; and a warpage correction film provided adjacent to one of the semiconductor substrate and the glass substrate.
5
US10866345B2
Laminated lens structure, camera module, and method for manufacturing laminated lens structure
Publication/Patent Number: US10866345B2 Publication Date: 2020-12-15 Application Number: 16/323,917 Filing Date: 2017-06-27 Inventor: Yamamoto, Atsushi   Matsugai, Hiroyasu   Maeda, Kensaku   Ogita, Tomoharu   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B3/00 Abstract: To prevent the resin from oozing out during the lens molding due to the capillary action. A laminated lens structure according to the present disclosure includes: a plurality of lens structures including a substrate provided with an opening part, a lens inserted into the opening part to be fixed to the substrate, and a recessed part provided at an area in which a lateral face of the opening part and a surface of the substrate are intersected, and recessed more than the surface of the substrate. The lenses are arrayed in an optical axis direction by the substrates being joined. This configuration makes it possible to prevent the resin from oozing out during the lens molding due to the capillary action.
6
US10534162B2
Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device
Publication/Patent Number: US10534162B2 Publication Date: 2020-01-14 Application Number: 15/741,549 Filing Date: 2016-07-19 Inventor: Yoshioka, Hirotaka   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B27/10 Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.
7
US10690814B2
Lens substrate, semiconductor device, and electronic apparatus
Publication/Patent Number: US10690814B2 Publication Date: 2020-06-23 Application Number: 15/747,302 Filing Date: 2016-07-19 Inventor: Shiraiwa, Toshiaki   Okamoto, Masaki   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B3/00 Abstract: Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.
8
EP3329312B1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
Publication/Patent Number: EP3329312B1 Publication Date: 2020-09-23 Application Number: 16751021.3 Filing Date: 2016-07-19 Inventor: Yoshioka, Hirotaka   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B7/02