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1
JP2019014112A
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MOLD
Publication/Patent Number: JP2019014112A Publication Date: 2019-01-31 Application Number: 2017131905 Filing Date: 2017-07-05 Inventor: Matsutani, Hiroyasu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B3/00 Abstract: To make it possible to control a lens shape with high precision.SOLUTION: The mold includes an abutting portion for abutting against a substrate when forming a resin material on the substrate into a predetermined shape. In a state where the abutting portion is abutted against the substrate, a space for allowing the resin material to flow in and out is formed. The present technology can be applied to, for example, a mold for forming a lens resin portion of a solid-state imaging device.SELECTED DRAWING: Figure 3
2
JP2018120115A
AF MODULE, CAMERA MODULE, AND ELECTRONIC APPARATUS
Publication/Patent Number: JP2018120115A Publication Date: 2018-08-02 Application Number: 2017011993 Filing Date: 2017-01-26 Inventor: Fukuyama, Munekatsu   Ishida, Minoru   Ito, Hiroyuki   Iwasaki, Masanori   Matsutani, Hiroyasu   Fujii, Nobutoshi   Moriya, Yusuke   Hayashi, Toshihiko   Oshima, Keiji   Tazawa, Hiroshi   Saito, Taku   Shiraiwa, Toshiaki   Sato, Shuzo   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G03B15/00 Abstract: PROBLEM TO BE SOLVED: To provide a camera module that can be applied for various uses.SOLUTION: An AF module has a stacked lens structure in which lens-attached substrates are directly bonded together for stacking, where each lens-attached substrate has a lens inside a through-hole formed on a substrate, and an AF driving part that adjusts the distance between the stacked lens structure and a light receiving element. The technique is applicable, for example, to a camera module and the like.SELECTED DRAWING: Figure 94
3
JP2017032800A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032800A Publication Date: 2017-02-09 Application Number: 2015152923 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Yoshioka, Hirotaka   Matsutani, Hiroyasu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C39/10 Abstract: PROBLEM TO BE SOLVED: To reduce an influence of air in a void portion between lenses of adjacent layers of a laminated lens structure.SOLUTION: A substrate with a lens has a plurality of through holes formed therein
4
JP2017032796A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032796A Publication Date: 2017-02-09 Application Number: 2015152918 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Kurobe, Toshihiro   Saito, Sotetsu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C39/10 Abstract: PROBLEM TO BE SOLVED: To suppress occurrence of contamination of damage of a lens.SOLUTION: A manufacturing apparatus makes a lens resin portion stick a spacer thicker than the height projecting from a substrate onto the substrate. The manufacturing apparatus includes: molding a lens resin portion inside of a through hole formed on a substrate using a die formed of two layers of a mold; molding the lens resin portion; and then releasing the lens resin portion from the other mold substrate in a state in which one mold is stuck onto the substrate. The present technology can be applied
5
JP2017032799A
SEMICONDUCTOR DEVICE
Publication/Patent Number: JP2017032799A Publication Date: 2017-02-09 Application Number: 2015152922 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Okamoto, Masaki   Matsutani, Hiroyasu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B3/00 Abstract: PROBLEM TO BE SOLVED: To reduce chipping effect when a plurality of laminated substrates are singulated.SOLUTION: A semiconductor device comprises laminated substrates on which a groove is formed for surrounding a pattern composed of predetermined circuits or components. This technique is applicable for a laminated lens structure in which an open hole is formed on each layer and a lens is arranged inside the open hole
6
JP2017032797A
LAMINATED LENS STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: JP2017032797A Publication Date: 2017-02-09 Application Number: 2015152919 Filing Date: 2015-07-31 Inventor: Yamamoto, Atsushi   Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Takeuchi, Koichi   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Kurobe, Toshihiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B7/02 Abstract: PROBLEM TO BE SOLVED: To align substrates with lenses in which lenses are arranged with high precision.SOLUTION: A laminated lens structure is laminated by joining substrates with lenses where lenses are arranged inside of a through hole formed on the substrate based on an alignment mark by direct joint. The through hole and the alignment mark are simultaneously formed. The present technology can be applied to a camera module integrated with a laminated lens structure formed by laminating at least three substrates with first to third lenses that are a substrate with a lense where a through hole is formed on the substrate and the lens is formed inside of the through hole
7
JP2017030252A
STACKED LENS STRUCTURE
Publication/Patent Number: JP2017030252A Publication Date: 2017-02-09 Application Number: 2015152917 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Takeuchi, Koichi   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Hikichi, Kunihiko   Matsutani, Hiroyasu   Kurobe, Toshihiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C33/12 Abstract: PROBLEM TO BE SOLVED: To reduce a positional shift of a lens in a stacked lens structure.SOLUTION: A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift which occurs in the position of each of the through-holes during manufacturing processes. A lens is formed on an inner side of each of the through-holes by using: a first mold in which a plurality of first transfer surfaces used for forming a first surface of each of the lenses is disposed at a position shifted from a second target position according to a second shift which occurs in the position of the first surface of each of the lenses during the manufacturing processes; and a second mold in which a plurality of second transfer surfaces used for forming a second surface of each of the lenses is disposed at a position shifted from a third target position according to a third shift which occurs in the position of the second surface of each of the lenses. The plurality of substrates having the lenses formed therein is formed by direct bonding
8
JP2017032798A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032798A Publication Date: 2017-02-09 Application Number: 2015152920 Filing Date: 2015-07-31 Inventor: Iwasaki, Masanori   Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Hagimoto, Masaya   Oikami, Takashi   Moriya, Yusuke   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B1/111 Abstract: PROBLEM TO BE SOLVED: To suppress reduction of an image quality.SOLUTION: A through hole is formed on
9
JP2016001681A
SOLID STATE IMAGE PICKUP ELEMENT
Publication/Patent Number: JP2016001681A Publication Date: 2016-01-07 Application Number: 2014121289 Filing Date: 2014-06-12 Inventor: Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To inhibit warpage caused by bonding of substrates despite responding to a request of downsizing.SOLUTION: A solid state image pickup element comprises a transparent insulating substrate
10
JP5966381B2
SEMICONDUCTOR LASER AND MANUFACTURING METHOD THEREFOR
Publication/Patent Number: JP5966381B2 Publication Date: 2016-08-10 Application Number: 2012012655 Filing Date: 2012-01-25 Inventor: Sato, Kei   Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: H01S5/028 Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor laser in which increase in a driving current is suppressed
11
JP5853389B2
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication/Patent Number: JP5853389B2 Publication Date: 2016-02-09 Application Number: 2011071043 Filing Date: 2011-03-28 Inventor: Tabuchi, Kiyotaka   Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: B23K20/00 Abstract: PROBLEM TO BE SOLVED: To achieve improvement in bonding accuracy in a semiconductor device in which semiconductor substrates are bonded with each other.SOLUTION: A semiconductor device 79 comprises a first semiconductor substrate 31 and a second semiconductor substrate 45
12
JP5825398B2
SOLID-STATE IMAGE SENSOR
Publication/Patent Number: JP5825398B2 Publication Date: 2015-12-02 Application Number: 2014103003 Filing Date: 2014-05-19 Inventor: Maeda, Kensaku   Matsutani, Hiroyasu   Moriya, Yusuke   Assignee: SONY CORP   IPC: H01L21/318 Abstract: PROBLEM TO BE SOLVED: To provide a solid-state image sensor which is capable of suppressing surface defects caused by a film stress difference at an interface of each layer and is excellent in condensing characteristics.SOLUTION: The solid-state image sensor comprises: a photoelectric conversion part 12 formed in a semiconductor substrate 11; light transmission insulating layers 17 and 18; a first flattening layer 19; a color filter 20 having a step on its surface; a second flattening layer 21 made of an organic material; a stress relaxation layer 22; a microlens layer 23 made of an inorganic material; and a transparent resin layer 24. The film stresses of the microlens layer 23
13
JP5446485B2
SOLID-STATE IMAGING ELEMENT AND METHOD OF MANUFACTURING THE SAME
Publication/Patent Number: JP5446485B2 Publication Date: 2014-03-19 Application Number: 2009139352 Filing Date: 2009-06-10 Inventor: Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To provide a solid-state imaging element which is easily manufactured by facilitating control over a lens shape
14
JP2014078673A
SOLID STATE IMAGE PICKUP DEVICE
Publication/Patent Number: JP2014078673A Publication Date: 2014-05-01 Application Number: 2012258402 Filing Date: 2012-11-27 Inventor: Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To provide a solid state image pickup device which improves the collection efficiency to an organic photoelectric conversion layer while maintaining the reliability.SOLUTION: A solid state image pickup device includes: multiple picture elements
15
JP2014168098A
SOLID-STATE IMAGE SENSOR
Publication/Patent Number: JP2014168098A Publication Date: 2014-09-11 Application Number: 2014103003 Filing Date: 2014-05-19 Inventor: Maeda, Kensaku   Matsutani, Hiroyasu   Moriya, Yusuke   Assignee: SONY CORP   IPC: H01L21/318 Abstract: PROBLEM TO BE SOLVED: To provide a solid-state image sensor which is capable of suppressing surface defects caused by a film stress difference at an interface of each layer and is excellent in condensing characteristics.SOLUTION: The solid-state image sensor comprises: a photoelectric conversion part 12 formed in a semiconductor substrate 11; light transmission insulating layers 17 and 18; a first flattening layer 19; a color filter 20 having a step on its surface; a second flattening layer 21 made of an organic material; a stress relaxation layer 22; a microlens layer 23 made of an inorganic material; and a transparent resin layer 24. The film stresses of the microlens layer 23
16
JP5418044B2
SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: JP5418044B2 Publication Date: 2014-02-19 Application Number: 2009177562 Filing Date: 2009-07-30 Inventor: Takahashi, Hiroshi   Yoshioka, Hiroshi   Hayashi, Toshihiko   Yoshihara, Ikuo   Inoue, Keiji   Aonuma, Masayoshi   Umebayashi, Hiroshi   Otsuka, Yoichi   Sasaki, Naoto   Osada, Masaya   Kitamura, Yuya   Matsutani, Hiroyasu   Kanaguchi, Tokihisa   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To easily form a color filter layer and a micro lens and to form a through-hole where a through electrode is formed on a substrate of a solid-state image pickup device by energy beam processing. SOLUTION: The solid-state image pickup device includes a first substrate 11 in which a light receiving part 61 which photoelectrically converts incident light is formed and a wiring part 41 is formed on a light incidence-side
17
JP2013153030A
SEMICONDUCTOR LASER AND MANUFACTURING METHOD THEREFOR
Publication/Patent Number: JP2013153030A Publication Date: 2013-08-08 Application Number: 2012012655 Filing Date: 2012-01-25 Inventor: Sato, Kei   Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: H01S5/028 Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor laser in which increase in a driving current is suppressed
18
JP2012174937A
SEMICONDUCTOR DEVICE
Publication/Patent Number: JP2012174937A Publication Date: 2012-09-10 Application Number: 2011036375 Filing Date: 2011-02-22 Inventor: Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: H01L21/02 Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device formed by bonding substrates to each other in which reliability is enhanced by enhancing adhesion of the bonded surfaces thereby reducing the peeling and chipping of wafers
19
JP2012204810A
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication/Patent Number: JP2012204810A Publication Date: 2012-10-22 Application Number: 2011071043 Filing Date: 2011-03-28 Inventor: Tabuchi, Kiyotaka   Matsutani, Hiroyasu   Assignee: SONY CORP   IPC: B23K20/00 Abstract: PROBLEM TO BE SOLVED: To achieve improvement in bonding accuracy in a semiconductor device in which semiconductor substrates are bonded with each other.SOLUTION: A semiconductor device 79 comprises a first semiconductor substrate 31 and a second semiconductor substrate 45
20
JP2012023251A
SOLID STATE IMAGING ELEMENT
Publication/Patent Number: JP2012023251A Publication Date: 2012-02-02 Application Number: 2010161083 Filing Date: 2010-07-15 Inventor: Maeda, Kensaku   Matsutani, Hiroyasu   Moriya, Yusuke   Assignee: SONY CORP   IPC: H01L27/14 Abstract: PROBLEM TO BE SOLVED: To provide a solid state imaging element which is excellent in a light collecting property.SOLUTION: A solid state imaging element includes: a semiconductor substrate 11; a photoelectric conversion part formed over the semiconductor substrate 11; and an organic material layer and an inorganic material layer laminated over the semiconductor substrate through at least one stress relieving layer 22.
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