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1 | US10923517B2 |
Solid-state imaging apparatus having output circuit unit for outputting a pixel signal
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Publication/Patent Number: US10923517B2 | Publication Date: 2021-02-16 | Application Number: 16/854,344 | Filing Date: 2020-04-21 | Inventor： Tanaka, Harumi Masuda, Yoshiaki Miyazawa, Shinji Ishida, Minoru | Assignee: Sony Corporation | IPC: H01L27/146 | Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit. | |||
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2 | US2020357839A1 |
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: US2020357839A1 | Publication Date: 2020-11-12 | Application Number: 16/938,324 | Filing Date: 2020-07-24 | Inventor： Miyazawa, Shinji Masuda, Yoshiaki | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like. | |||
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3 | EP3435414B1 |
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
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Publication/Patent Number: EP3435414B1 | Publication Date: 2020-12-16 | Application Number: 17769970.9 | Filing Date: 2017-03-10 | Inventor： Miyazawa, Shinji Masuda, Yoshiaki | Assignee: Sony Corporation | IPC: H01L27/146 | ||||
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4 | US10756130B2 |
Solid-state image sensor and electronic device
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Publication/Patent Number: US10756130B2 | Publication Date: 2020-08-25 | Application Number: 15/912,186 | Filing Date: 2018-03-05 | Inventor： Miyazawa, Shinji Ooka, Yutaka | Assignee: Sony Corporation | IPC: H01L27/00 | Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate. | |||
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5 | US2020279883A1 |
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
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Publication/Patent Number: US2020279883A1 | Publication Date: 2020-09-03 | Application Number: 16/874,442 | Filing Date: 2020-05-14 | Inventor： Miyazawa, Shinji Ooka, Yutaka | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate. | |||
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6 | US10777598B2 |
Image pickup device and electronic apparatus
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Publication/Patent Number: US10777598B2 | Publication Date: 2020-09-15 | Application Number: 16/085,415 | Filing Date: 2017-03-10 | Inventor： Miyazawa, Shinji Masuda, Yoshiaki | Assignee: Sony Corporation | IPC: H01L27/146 | Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like. | |||
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7 | US2020251511A1 |
