Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
US10923517B2
Solid-state imaging apparatus having output circuit unit for outputting a pixel signal
Publication/Patent Number: US10923517B2 Publication Date: 2021-02-16 Application Number: 16/854,344 Filing Date: 2020-04-21 Inventor: Tanaka, Harumi   Masuda, Yoshiaki   Miyazawa, Shinji   Ishida, Minoru   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.
2
US2020357839A1
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: US2020357839A1 Publication Date: 2020-11-12 Application Number: 16/938,324 Filing Date: 2020-07-24 Inventor: Miyazawa, Shinji   Masuda, Yoshiaki   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.
3
EP3435414B1
IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3435414B1 Publication Date: 2020-12-16 Application Number: 17769970.9 Filing Date: 2017-03-10 Inventor: Miyazawa, Shinji   Masuda, Yoshiaki   Assignee: Sony Corporation   IPC: H01L27/146
4
US10756130B2
Solid-state image sensor and electronic device
Publication/Patent Number: US10756130B2 Publication Date: 2020-08-25 Application Number: 15/912,186 Filing Date: 2018-03-05 Inventor: Miyazawa, Shinji   Ooka, Yutaka   Assignee: Sony Corporation   IPC: H01L27/00 Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
5
US2020279883A1
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
Publication/Patent Number: US2020279883A1 Publication Date: 2020-09-03 Application Number: 16/874,442 Filing Date: 2020-05-14 Inventor: Miyazawa, Shinji   Ooka, Yutaka   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
6
US10777598B2
Image pickup device and electronic apparatus
Publication/Patent Number: US10777598B2 Publication Date: 2020-09-15 Application Number: 16/085,415 Filing Date: 2017-03-10 Inventor: Miyazawa, Shinji   Masuda, Yoshiaki   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.
7
US2020251511A1