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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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Inventor Inventor Assignee Assignee IPC IPC
1
EP3780103A1
IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE
Publication/Patent Number: EP3780103A1 Publication Date: 2021-02-17 Application Number: 19784705.6 Filing Date: 2019-01-17 Inventor: Moriya, Yusuke   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: To prevent the occurrence of a defect in an infrared-light attenuation filter (141) and prevent a reduction in image quality. An imaging device (1) includes a photoelectric converter (101), an on-chip lens (171), a color filter (161), the infrared-light attenuation filter, and a protective film (151). The photoelectric converter performs photoelectric conversion depending on incident light. The on-chip lens collects the incident light into the photoelectric converter. Infrared light and visible light of a specified wavelength from among the collected incident light are transmitted through the color filter. The infrared-light attenuation filter attenuates the infrared light from among the collected incident light, and visible light from among the collected incident light is transmitted through the infrared-light attenuation filter. The protective film is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter.
2
US2021005656A1
IMAGING ELEMENT AND METHOD OF MANUFACTURING IMAGING ELEMENT
Publication/Patent Number: US2021005656A1 Publication Date: 2021-01-07 Application Number: 16/976,749 Filing Date: 2019-01-21 Inventor: Shibayama, Toshikazu   Moriya, Yusuke   Mitsunaga, Nobuyuki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: To reduce reflection of incident light in an imaging element having a transparent resin arranged on a surface of a microlens. The imaging element includes a pixel, a microlens, a transparent resin layer, and a sealing glass. The pixel is formed on a semiconductor substrate and generates an image signal according to radiated light. The microlens is arranged adjacent to the pixel, collects incident light, irradiates the pixel with the incident light, and flattens a surface of the pixel. The transparent resin layer is arranged adjacent to the microlens and has a refractive index different from a refractive index of the microlens by a predetermined difference. The sealing glass is arranged adjacent to the transparent resin and seals the semiconductor substrate.
3
EP3329313B1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: EP3329313B1 Publication Date: 2021-02-17 Application Number: 16751016.3 Filing Date: 2016-07-15 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B13/00
4
US10539849B2
Color change member, light emitting device, display device and electronic apparatus
Publication/Patent Number: US10539849B2 Publication Date: 2020-01-21 Application Number: 14/640,548 Filing Date: 2015-03-06 Inventor: Moriya, Yusuke   Maeda, Kensaku   Assignee: JOLED INC.   IPC: G02F1/137 Abstract: A color change member includes: a color change layer that has a light incident surface, a light emission surface, and a side surface; a first protective layer that is provided on the light incident surface of the color change layer; and a second protective layer that is provided on at least a part of the side surface of the color change layer.
5
US2020273897A1
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
Publication/Patent Number: US2020273897A1 Publication Date: 2020-08-27 Application Number: 16/807,049 Filing Date: 2020-03-02 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
6
US10608028B2
Image sensor having improved dicing properties
Publication/Patent Number: US10608028B2 Publication Date: 2020-03-31 Application Number: 16/045,973 Filing Date: 2018-07-26 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka, Yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/00 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
7
US2020049959A1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: US2020049959A1 Publication Date: 2020-02-13 Application Number: 16/507,984 Filing Date: 2019-07-10 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G02B13/00 Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.