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1 | EP3780103A1 |
IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE
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Publication/Patent Number: EP3780103A1 | Publication Date: 2021-02-17 | Application Number: 19784705.6 | Filing Date: 2019-01-17 | Inventor： Moriya, Yusuke | Assignee: Sony Semiconductor Solutions Corporation | IPC: H01L27/146 | Abstract: To prevent the occurrence of a defect in an infrared-light attenuation filter (141) and prevent a reduction in image quality. An imaging device (1) includes a photoelectric converter (101), an on-chip lens (171), a color filter (161), the infrared-light attenuation filter, and a protective film (151). The photoelectric converter performs photoelectric conversion depending on incident light. The on-chip lens collects the incident light into the photoelectric converter. Infrared light and visible light of a specified wavelength from among the collected incident light are transmitted through the color filter. The infrared-light attenuation filter attenuates the infrared light from among the collected incident light, and visible light from among the collected incident light is transmitted through the infrared-light attenuation filter. The protective film is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter. | |||
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2 | US2021005656A1 |
IMAGING ELEMENT AND METHOD OF MANUFACTURING IMAGING ELEMENT
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Publication/Patent Number: US2021005656A1 | Publication Date: 2021-01-07 | Application Number: 16/976,749 | Filing Date: 2019-01-21 | Inventor： Shibayama, Toshikazu Moriya, Yusuke Mitsunaga, Nobuyuki | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: H01L27/146 | Abstract: To reduce reflection of incident light in an imaging element having a transparent resin arranged on a surface of a microlens. The imaging element includes a pixel, a microlens, a transparent resin layer, and a sealing glass. The pixel is formed on a semiconductor substrate and generates an image signal according to radiated light. The microlens is arranged adjacent to the pixel, collects incident light, irradiates the pixel with the incident light, and flattens a surface of the pixel. The transparent resin layer is arranged adjacent to the microlens and has a refractive index different from a refractive index of the microlens by a predetermined difference. The sealing glass is arranged adjacent to the transparent resin and seals the semiconductor substrate. | |||
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3 | EP3329313B1 |
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
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Publication/Patent Number: EP3329313B1 | Publication Date: 2021-02-17 | Application Number: 16751016.3 | Filing Date: 2016-07-15 | Inventor： Moriya, Yusuke Iwasaki, Masanori Oinoue, Takashi Hagimoto, Yoshiya Matsugai, Hiroyasu Itou, Hiroyuki Saito, Suguru Ohshima, Keiji Fujii, Nobutoshi Tazawa, Hiroshi Shiraiwa, Toshiaki Ishida, Minoru | Assignee: Sony Semiconductor Solutions Corporation | IPC: G02B13/00 | ||||
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4 | US10539849B2 |
Color change member, light emitting device, display device and electronic apparatus
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Publication/Patent Number: US10539849B2 | Publication Date: 2020-01-21 | Application Number: 14/640,548 | Filing Date: 2015-03-06 | Inventor： Moriya, Yusuke Maeda, Kensaku | Assignee: JOLED INC. | IPC: G02F1/137 | Abstract: A color change member includes: a color change layer that has a light incident surface, a light emission surface, and a side surface; a first protective layer that is provided on the light incident surface of the color change layer; and a second protective layer that is provided on at least a part of the side surface of the color change layer. | |||
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5 | US2020273897A1 |
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
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Publication/Patent Number: US2020273897A1 | Publication Date: 2020-08-27 | Application Number: 16/807,049 | Filing Date: 2020-03-02 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/146 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. | |||
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6 | US10608028B2 |
Image sensor having improved dicing properties
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Publication/Patent Number: US10608028B2 | Publication Date: 2020-03-31 | Application Number: 16/045,973 | Filing Date: 2018-07-26 | Inventor： Yamamoto, Atsushi Miyazawa, Shinji Ooka, Yutaka Maeda, Kensaku Moriya, Yusuke Ogawa, Naoki Fujii, Nobutoshi Furuse, Shunsuke Nagata, Masaya Yamamoto, Yuichi | Assignee: SONY CORPORATION | IPC: H01L27/00 | Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor. | |||
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7 | US2020049959A1 |
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
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Publication/Patent Number: US2020049959A1 | Publication Date: 2020-02-13 | Application Number: 16/507,984 | Filing Date: 2019-07-10 | Inventor： Moriya, Yusuke Iwasaki, Masanori Oinoue, Takashi Hagimoto, Yoshiya Matsugai, Hiroyasu Itou, Hiroyuki Saito, Suguru Ohshima, Keiji Fujii, Nobutoshi Tazawa, Hiroshi Shiraiwa, Toshiaki Ishida, Minoru | Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION | IPC: G02B13/00 | Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like. |
