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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
EP3483937B1
SOLID-STATE IMAGING DEVICE, CORRECTION METHOD, AND ELECTRONIC DEVICE
Publication/Patent Number: EP3483937B1 Publication Date: 2021-01-13 Application Number: 17824015.6 Filing Date: 2017-06-22 Inventor: Tsuzuki, Takeru   Nishikori, Katsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146
2
US2021058577A1
SOLID-STATE IMAGE PICKUP APPARATUS, CORRECTION METHOD, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2021058577A1 Publication Date: 2021-02-25 Application Number: 17/090,666 Filing Date: 2020-11-05 Inventor: Tsuzuki, Takeru   Nishikori, Katsumi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
3
US10863124B2
Solid-state image pickup apparatus, correction method, and electronic apparatus
Publication/Patent Number: US10863124B2 Publication Date: 2020-12-08 Application Number: 16/312,417 Filing Date: 2017-06-22 Inventor: Tsuzuki, Takeru   Nishikori, Katsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/369 Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
4
EP3754710A1
SOLID-STATE IMAGE PICKUP APPARATUS, CORRECTION METHOD, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3754710A1 Publication Date: 2020-12-23 Application Number: 20187566.3 Filing Date: 2017-06-22 Inventor: Tsuzuki, Takeru   Nishikori, Katsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
5
EP3662513A1
IMAGING APPARATUS AND ELECTRONIC DEVICE
Publication/Patent Number: EP3662513A1 Publication Date: 2020-06-10 Application Number: 18760061.4 Filing Date: 2018-07-25 Inventor: Takahashi, Keiichiro   Kobayashi, Kazuhito   Nishikori, Katsumi   Tanaka, Shoyu   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146
6
US2020161352A1
IMAGING APPARATUS AND ELECTRONIC DEVICE
Publication/Patent Number: US2020161352A1 Publication Date: 2020-05-21 Application Number: 16/634,303 Filing Date: 2018-07-25 Inventor: Takahashi, Keiichiro   Kobayashi, Kazuhito   Nishikori, Katsumi   Tanaka, Shoyu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel, wherein the pixel array unit comprises at least one normal pixel group and at least one mixed pixel group. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.
7
US2019238773A1
SOLID-STATE IMAGE PICKUP APPARATUS, CORRECTION METHOD, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2019238773A1 Publication Date: 2019-08-01 Application Number: 16/312,417 Filing Date: 2017-06-22 Inventor: Nishikori, Katsumi   Tsuzuki, Takeru   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/232 Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
8
EP3483937A1
SOLID-STATE IMAGING DEVICE, CORRECTION METHOD, AND ELECTRONIC DEVICE
Publication/Patent Number: EP3483937A1 Publication Date: 2019-05-15 Application Number: 17824015.6 Filing Date: 2017-06-22 Inventor: Tsuzuki, Takeru   Nishikori, Katsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.
9
WO2019026718A1
IMAGING APPARATUS AND ELECTRONIC DEVICE
Publication/Patent Number: WO2019026718A1 Publication Date: 2019-02-07 Application Number: 2018027844 Filing Date: 2018-07-25 Inventor: Kobayashi, Kazuhito   Takahashi, Keiichiro   Nishikori, Katsumi   Tanaka, Shoyu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: An imaging apparatus includes a pixel array unit including a plurality of pixel groups, each of the plurality of pixel groups being one of i) a normal pixel group including only normal pixels, or ii) a mixed pixel group including at least one normal pixel and at least one phase difference detection pixel, wherein the pixel array unit comprises at least one normal pixel group and at least one mixed pixel group. For each normal pixel group, the normal pixels receive light transmitted through a same colored color filter. For each mixed pixel group, the at least one phase difference detection pixel shares an on-chip lens with at least one other phase difference detection pixel and receives light transmitted through a same colored color filter as the at least one other phase difference detection pixel.
10
WO2018008408A1
SOLID-STATE IMAGING DEVICE
Publication/Patent Number: WO2018008408A1 Publication Date: 2018-01-11 Application Number: 2017022986 Filing Date: 2017-06-22 Inventor: Tsuzuki, Takeru   Nishikori, Katsumi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: A61B1/045 Abstract: The present disclosure relates to a solid-state imaging device