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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
EP3813356A1
SOLID-STATE IMAGING DEVICE
Publication/Patent Number: EP3813356A1 Publication Date: 2021-04-28 Application Number: 20210491.5 Filing Date: 2018-07-17 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/3745 Abstract: To a mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
2
EP3780583A1
SOLID-STATE IMAGING ELEMENT, TEST SYSTEM, AND CONTROL METHOD FOR SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: EP3780583A1 Publication Date: 2021-02-17 Application Number: 19777234.6 Filing Date: 2019-02-07 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/378 Abstract: Presence or absence of an abnormality is easily determined in a solid-state imaging element that detects an address event. The solid-state imaging element includes a photoelectric conversion element, a test signal supply unit, a selection unit, and a comparator. The photoelectric conversion element converts incident light into an electric signal by photoelectric conversion. The test signal supply unit supplies, as a test signal, a signal that fluctuates with time. The selection unit selects either the electric signal or the test signal. The comparator compares a predetermined threshold value with the signal selected by the selection unit, and outputs a result of the comparison.
3
EP3780579A1
SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, AND CONTROL METHOD FOR SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: EP3780579A1 Publication Date: 2021-02-17 Application Number: 19776305.5 Filing Date: 2019-02-07 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/367 Abstract: A defective pixel is easily identified in a solid-state imaging element that detects an address event. An address event detecting unit detects, as an address event, a fact that an absolute value of a change amount of luminance exceeds a predetermined threshold value with regard to each of a plurality of pixels, and outputs a detection signal indicating a result of the detection. A detection frequency acquisition unit acquires a detection frequency of the address event with regard to each of the plurality of pixels. A defective pixel identification unit identifies, on the basis of a statistic of the detection frequency, a defective pixel where an abnormality has occurred among the plurality of pixels.
4
US2021058575A1
SOLID-STATE IMAGING ELEMENT, TEST SYSTEM, AND CONTROL METHOD FOR SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: US2021058575A1 Publication Date: 2021-02-25 Application Number: 16/982,875 Filing Date: 2019-02-07 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/367 Abstract: Presence or absence of an abnormality is easily determined in a solid-state imaging element that detects an address event. The solid-state imaging element includes a photoelectric conversion element, a test signal supply unit, a selection unit, and a comparator. The photoelectric conversion element converts incident light into an electric signal by photoelectric conversion. The test signal supply unit supplies, as a test signal, a signal that fluctuates with time. The selection unit selects either the electric signal or the test signal. The comparator compares a predetermined threshold value with the signal selected by the selection unit, and outputs a result of the comparison.
5
US2021051288A1
SOLID-STATE IMAGING DEVICE
Publication/Patent Number: US2021051288A1 Publication Date: 2021-02-18 Application Number: 17/084,583 Filing Date: 2020-10-29 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/369 Abstract: A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
6
US2021075990A1
SOLID-STATE IMAGING ELEMENT, ELECTRONIC DEVICE, AND METHOD FOR CONTROLLING SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: US2021075990A1 Publication Date: 2021-03-11 Application Number: 17/102,327 Filing Date: 2020-11-23 Inventor: Niwa, Atsumi   Matsumoto, Shizunori   Hirata, Eiji   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/3745 Abstract: The present technology is provided to accurately correct uneven luminance while suppressing an increase in the size of the solid-state imaging element. A pixel array unit includes a plurality of lines each including a predetermined number of pixels each being arrayed in a predetermined direction. An analog-to-digital conversion unit includes more than the predetermined number of analog-to-digital converters that convert analog signals into digital signals. A scanning circuit controls to sequentially select the plurality of lines and output more than the predetermined number of analog signals to the analog-to-digital conversion unit every time the line is selected. A correction unit performs black level correction processing on the digital signal.
7
US2021099660A1
IMAGING ELEMENT, IMAGING METHOD AND ELECTRONIC APPARATUS
Publication/Patent Number: US2021099660A1 Publication Date: 2021-04-01 Application Number: 17/119,084 Filing Date: 2020-12-11 Inventor: Niwa, Atsumi   Ueno, Yosuke   Teshima, Shimon   Anai, Daijiro   Furusawa, Yoshinobu   Yoshida, Taishin   Uchimura, Takahiro   Hirata, Eiji   Assignee: SONY CORPORATION   IPC: H04N5/378 Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
8
US10911707B2
Imaging element, imaging method and electronic apparatus
Publication/Patent Number: US10911707B2 Publication Date: 2021-02-02 Application Number: 16/840,077 Filing Date: 2020-04-03 Inventor: Niwa, Atsumi   Ueno, Yosuke   Teshima, Shimon   Anai, Daijiro   Furusawa, Yoshinobu   Yoshida, Taishin   Uchimura, Takahiro   Hirata, Eiji   Assignee: Sony Corporation   IPC: H04N5/378 Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
9
US2020260032A1
SOLID-STATE IMAGE PICKUP ELEMENT AND IMAGE PICKUP APPARATUS
Publication/Patent Number: US2020260032A1 Publication Date: 2020-08-13 Application Number: 16/490,339 Filing Date: 2019-03-13 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solution Corporation   IPC: H04N5/378 Abstract: There is provided a solid-state image pickup element including: a photodiode configured to convert incident light into a photocurrent; an amplification transistor configured to amplify a voltage between a gate having a potential depending on the photocurrent and a source having a predetermined reference potential and output the amplified voltage from a drain; and a potential supply section configured to supply an anode of the photodiode and a back-gate of the amplification transistor with a predetermined potential lower than the reference potential.
10
US2020260039A1
SOLID-STATE IMAGING DEVICE
Publication/Patent Number: US2020260039A1 Publication Date: 2020-08-13 Application Number: 16/484,946 Filing Date: 2018-07-17 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/369 Abstract: To a mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
11
US2020351455A1
SOLID-STATE IMAGE SENSOR, IMAGING DEVICE, AND METHOD OF CONTROLLING SOLID-STATE IMAGE SENSOR
Publication/Patent Number: US2020351455A1 Publication Date: 2020-11-05 Application Number: 16/964,676 Filing Date: 2018-12-14 Inventor: Niwa, Atsumi   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/353 Abstract: In a solid-state image sensor that detects an address event, the detection sensitivity for the address event is controlled to an appropriate value. The solid-state image sensor includes a pixel array unit and a control unit. In the solid-state image sensor, multiple pixel circuits are arranged in the pixel array unit, each detecting a change in luminance of incident light occurring outside a predetermined dead band as the address event. The control unit controls the width of the dead band according to the number of times the address event is detected in the pixel array unit within a fixed unit cycle.
12
US10666284B2
Solid-state imaging apparatus and electronic equipment
Publication/Patent Number: US10666284B2 Publication Date: 2020-05-26 Application Number: 16/315,343 Filing Date: 2017-07-07 Inventor: Niwa, Atsumi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H03M1/12 Abstract: The present disclosure relates to a solid-state imaging apparatus and electronic equipment which can realize operation with lower power consumption in a sensing mode. A solid-state imaging apparatus has an A/D conversion unit that A/D converts a pixel signal and an oscillator that generates a second internal clock with a frequency lower than that of a first internal clock obtained by multiplying an external clock, in which the A/D conversion unit is configured to operate, when operating by the second internal clock, with resolution lower than resolution of A/D conversion when operating by the first internal clock. The present disclosure can be applied to, for example, a CMOS image sensor.
13
US2020358977A1
SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, AND CONTROL METHOD OF SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: US2020358977A1 Publication Date: 2020-11-12 Application Number: 16/962,783 Filing Date: 2019-01-18 Inventor: Niwa, Atsumi   Oike, Yusuke   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/3745 Abstract: An object is to reduce a circuit scale in a solid-state imaging element that detects an address event. The solid-state imaging element is provided with a plurality of photoelectric conversion elements, a signal supply unit, and a detection unit. In this solid-state imaging element, each of the plurality of photoelectric conversion elements photoelectrically converts incident light to generate a first electric signal. Furthermore, in the solid-state imaging element, the detection unit detects whether or not a change amount of the first electric signal of each of the plurality of photoelectric conversion elements exceeds a predetermined threshold and outputs a detection signal indicating a result of the detection result.
14
EP3745710A1
SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, AND CONTROL METHOD FOR SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: EP3745710A1 Publication Date: 2020-12-02 Application Number: 19744505.9 Filing Date: 2019-01-18 Inventor: Niwa, Atsumi   Oike, Yusuke   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/3745 Abstract: An object is to reduce a circuit scale in a solid-state imaging element that detects an address event. The solid-state imaging element is provided with a plurality of photoelectric conversion elements, a signal supply unit, and a detection unit. In this solid-state imaging element, each of the plurality of photoelectric conversion elements photoelectrically converts incident light to generate a first electric signal. Furthermore, in the solid-state imaging element, the detection unit detects whether or not a change amount of the first electric signal of each of the plurality of photoelectric conversion elements exceeds a predetermined threshold and outputs a detection signal indicating a result of the detection result.
15
US202053308A1
IMAGE SENSOR, METHOD OF CONTROLLING IMAGE SENSOR, AND ELECTRONIC DEVICE
Publication/Patent Number: US202053308A1 Publication Date: 2020-02-13 Application Number: 20/181,648 Filing Date: 2018-02-19 Inventor: Ueno, Yosuke   Niwa, Atsumi   Moue, Takashi   Yamashita, Tomonori   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/378 Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
16
EP3590254A1
IMAGE SENSOR, METHOD OF CONTROLLING IMAGE SENSOR, AND ELECTRONIC DEVICE
Publication/Patent Number: EP3590254A1 Publication Date: 2020-01-08 Application Number: 18708227.6 Filing Date: 2018-02-19 Inventor: Niwa, Atsumi   Yamashita, Tomonori   Moue, Takashi   Ueno, Yosuke   Assignee: Sony Semiconductor Solutions Corporation   IPC: H04N5/378
17
US2020021769A1
SOLID-STATE IMAGING ELEMENT, ELECTRONIC DEVICE, AND METHOD FOR CONTROLLING SOLID-STATE IMAGING ELEMENT
Publication/Patent Number: US2020021769A1 Publication Date: 2020-01-16 Application Number: 16/464,956 Filing Date: 2017-10-27 Inventor: Niwa, Atsumi   Matsumoto, Shizunori   Hirata, Eiji   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/3745 Abstract: The present technology is provided to accurately correct uneven luminance while suppressing an increase in the size of the solid-state imaging element. A pixel array unit includes a plurality of lines each including a predetermined number of pixels each being arrayed in a predetermined direction. An analog-to-digital conversion unit includes more than the predetermined number of analog-to-digital converters that convert analog signals into digital signals. A scanning circuit controls to sequentially select the plurality of lines and output more than the predetermined number of analog signals to the analog-to-digital conversion unit every time the line is selected. A correction unit performs black level correction processing on the digital signal.