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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
EP3329313B1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: EP3329313B1 Publication Date: 2021-02-17 Application Number: 16751016.3 Filing Date: 2016-07-15 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B13/00
2
US2020212087A1
IMAGING DEVICE, MANUFACTURING METHOD, AND SUBSTRATE DIVIDING METHOD
Publication/Patent Number: US2020212087A1 Publication Date: 2020-07-02 Application Number: 16/815,842 Filing Date: 2020-03-11 Inventor: Yamaguchi, Masanari   Takachi, Taizo   Furuse, Shunsuke   Oinoue, Takashi   Ikebe, Yuki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
3
US10622404B2
Imaging device, manufacturing method, and substrate dividing method
Publication/Patent Number: US10622404B2 Publication Date: 2020-04-14 Application Number: 15/740,958 Filing Date: 2016-07-19 Inventor: Yamaguchi, Masanari   Takachi, Taizo   Furuse, Shunsuke   Oinoue, Takashi   Ikebe, Yuki   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L27/146 Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.
4
EP3540776A3
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3540776A3 Publication Date: 2020-01-08 Application Number: 19173175.1 Filing Date: 2014-12-12 Inventor: Komai, Naoki   Sasaki, Naoto   Ogawa, Naoki   Oinoue, Takashi   Iwamoto, Hayato   Ooka, Yutaka   Nagata, Masaya   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: A semiconductor device (1) includes a first semiconductor substrate (12) in which a pixel region (21) where pixel portions performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate (11) in which a logic circuit (23) processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate (18) protecting an on-chip lens (16) is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin (17) interposed therebetween.
5
US2020083262A1
SOLID-STATE IMAGE SENSING DEVICE AND ELECTRONIC DEVICE
Publication/Patent Number: US2020083262A1 Publication Date: 2020-03-12 Application Number: 16/683,379 Filing Date: 2019-11-14 Inventor: Tayanaka, Hiroshi   Akiyama, Kentaro   Sakano, Yorito   Oinoue, Takashi   Hagimoto, Yoshiya   Matsumura, Yusuke   Sato, Naoyuki   Miyanami, Yuki   Ueda, Yoichi   Matsumoto, Ryosuke   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to a solid-state image sensing device and an electronic device for reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.
6
US202049959A1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: US202049959A1 Publication Date: 2020-02-13 Application Number: 20/191,650 Filing Date: 2019-07-10 Inventor: Ishida, Minoru   Iwasaki, Masanori   Hagimoto, Yoshiya   Shiraiwa, Toshiaki   Itou, Hiroyuki   Fujii, Nobutoshi   Matsugai, Hiroyasu   Moriya, Yusuke   Tazawa, Hiroshi   Oinoue, Takashi   Saito, Suguru   Ohshima, Keiji   Assignee: Sony Semiconductor Solutions Corporation   IPC: G02B27/00 Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
7
US2020049959A1
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: US2020049959A1 Publication Date: 2020-02-13 Application Number: 16/507,984 Filing Date: 2019-07-10 Inventor: Moriya, Yusuke   Iwasaki, Masanori   Oinoue, Takashi   Hagimoto, Yoshiya   Matsugai, Hiroyasu   Itou, Hiroyuki   Saito, Suguru   Ohshima, Keiji   Fujii, Nobutoshi   Tazawa, Hiroshi   Shiraiwa, Toshiaki   Ishida, Minoru   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G02B13/00 Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.