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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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Inventor Inventor Assignee Assignee IPC IPC
1
US10756130B2
Solid-state image sensor and electronic device
Publication/Patent Number: US10756130B2 Publication Date: 2020-08-25 Application Number: 15/912,186 Filing Date: 2018-03-05 Inventor: Miyazawa, Shinji   Ooka yutaka   Assignee: Sony Corporation   IPC: H01L27/00 Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
2
US2020279883A1
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
Publication/Patent Number: US2020279883A1 Publication Date: 2020-09-03 Application Number: 16/874,442 Filing Date: 2020-05-14 Inventor: Miyazawa, Shinji   Ooka yutaka   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
3
EP3540776A3
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3540776A3 Publication Date: 2020-01-08 Application Number: 19173175.1 Filing Date: 2014-12-12 Inventor: Komai, Naoki   Sasaki, Naoto   Ogawa, Naoki   Oinoue, Takashi   Iwamoto, Hayato   Ooka yutaka   Nagata, Masaya   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: A semiconductor device (1) includes a first semiconductor substrate (12) in which a pixel region (21) where pixel portions performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate (11) in which a logic circuit (23) processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate (18) protecting an on-chip lens (16) is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin (17) interposed therebetween.
4
US10608028B2
Image sensor having improved dicing properties
Publication/Patent Number: US10608028B2 Publication Date: 2020-03-31 Application Number: 16/045,973 Filing Date: 2018-07-26 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/00 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
5
WO2020017205A1
IMAGING ELEMENT AND ELECTRONIC DEVICE
Publication/Patent Number: WO2020017205A1 Publication Date: 2020-01-23 Application Number: 2019023618 Filing Date: 2019-06-14 Inventor: Yoshida, Hirokazu   Ishii, Wataru   Matsuoka, Shinichi   Kamei, Takahiro   Ooka yutaka   Masuda, Yoshiaki   Saito, Sotetsu   Sato, Naoki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: An imaging element according to one embodiment of the present invention includes: a sensor substrate which has a light-receiving region in which a plurality of light-receiving elements is arranged and a surrounding region provided around the light-receiving region; a sealing member that is disposed facing one side of the sensor substrate; a resin layer that bonds together the sensor substrate and the sealing member; and a recessed part which is provided in the surrounding region on the one side of the sensor substrate and which has the resin layer embedded therein. The resin layer has one or a plurality of voids on the inside of the recessed part in plan view.
6
US2020273897A1
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME
Publication/Patent Number: US2020273897A1 Publication Date: 2020-08-27 Application Number: 16/807,049 Filing Date: 2020-03-02 Inventor: Yamamoto, Atsushi   Miyazawa, Shinji   Ooka yutaka   Maeda, Kensaku   Moriya, Yusuke   Ogawa, Naoki   Fujii, Nobutoshi   Furuse, Shunsuke   Nagata, Masaya   Yamamoto, Yuichi   Assignee: SONY CORPORATION   IPC: H01L27/146 Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
7
US2019214418A1
SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE
Publication/Patent Number: US2019214418A1 Publication Date: 2019-07-11 Application Number: 16/328,717 Filing Date: 2017-08-04 Inventor: Sasaki, Naoto   Ooka yutaka   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The height of a solid-state imaging element is further reduced as compared to the related art. A solid-state imaging element that is a wafer-level chip size package, including: an optical sensor chip; a protective layer that is stacked on a light receiving surface of the optical sensor chip; and a rewiring layer that is stacked on a surface opposite to the light receiving surface of the optical sensor chip, in which a connection terminal of the rewiring layer is a copper flat pad without a solder ball, an alloy layer of tin and copper is not formed on a front surface of the flat pad, and a thermal expansion coefficient of the protective layer is substantially balanced with a thermal expansion coefficient of the rewiring layer.
8
US10236315B2
Solid-state image pickup element, image pickup apparatus, electronic apparatus, and production method
Publication/Patent Number: US10236315B2 Publication Date: 2019-03-19 Application Number: 14/775,879 Filing Date: 2014-03-14 Inventor: Ooka yutaka   Miyazawa, Shinji   Maeda, Kensaku   Yamamoto, Atsushi   Assignee: Sony Corporation   IPC: H01L27/14 Abstract: Provided is a solid-state image pickup element including: a sensor unit configured to generate an electrical signal in response to incident light; a color filter covering the sensor unit; and a lens configured to concentrate the incident light into the sensor unit via the color filter and formed by a laminated film made of a predetermined lens material. The lens is formed on the color filter without providing a planarization layer for removing a difference in level in the color filter.
9
WO2019065294A1
IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE
Publication/Patent Number: WO2019065294A1 Publication Date: 2019-04-04 Application Number: 2018034126 Filing Date: 2018-09-14 Inventor: Ooka yutaka   Yamamoto, Atsushi   Takimoto, Kaori   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: G03B17/02 Abstract: The present technology pertains to: an imaging element configured so as to be capable of precisely controlling the installation height of a lens; a method for manufacturing the imaging element; and an electronic device. The imaging element comprises: a laminated lens structure in which lens-attached substrates each having a lens disposed inside a through hole formed in the substrate are pasted together by direct bonding such that a plurality of lenses are laminated in the optical axis direction; an imaging unit which photoelectrically converts incident light condensed by the plurality of lenses of the laminated lens structure; a protective substrate which protects the imaging unit; and a spacer which is disposed between the protective substrate and the laminated lens structure. The present technology can be applied to a camera module or the like, for example.
10
JP2019067868A
IMAGE SENSOR, MANUFACTURING METHOD OF IMAGE SENSOR, AND ELECTRONIC DEVICE
Publication/Patent Number: JP2019067868A Publication Date: 2019-04-25 Application Number: 2017190421 Filing Date: 2017-09-29 Inventor: Ooka yutaka   Takimoto, Kaori   Yamamoto, Atsushi   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B1/115 Abstract: To control lens installation height with high precision.SOLUTION: An image sensor includes a laminated lens structure in which lens-equipped substrates in which lenses are arranged inside through holes formed on a substrate are directly bonded to each other and the plurality of lenses are laminated in the optical axis direction, an imaging unit that photoelectrically converts incident light collected by the plurality of lenses of the laminated lens structure, a protection substrate that protects the imaging unit, and a spacer disposed between the protection substrate and the laminated lens structure. The present technology can be applied to, for example, a camera module and the like.SELECTED DRAWING: Figure 143
11
EP2980849B1
SEMICONDUCTOR IMAGE PICKUP ELEMENT, IMAGE PICKUP APPARATUS, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD
Publication/Patent Number: EP2980849B1 Publication Date: 2019-09-11 Application Number: 14773969.2 Filing Date: 2014-03-14 Inventor: Ooka yutaka   Miyazawa, Shinji   Maeda, Kensaku   Yamamoto, Atsushi   Assignee: Sony Corporation   IPC: H01L27/146
12
TW201933599A
Solid-state image pickup element, image pickup apparatus, electronic apparatus, and manufacturing method
Publication/Patent Number: TW201933599A Publication Date: 2019-08-16 Application Number: 108116424 Filing Date: 2014-03-03 Inventor: Maeda, Kensaku   Yamamoto, Atsushi   Miyazawa, Shinji   Ooka yutaka   Assignee: Sony Corporation   IPC: H01L27/146 Abstract: The present disclosure relates to: a solid-state image pickup element wherein sensitivity deterioration of the solid-state image pickup element is suppressed; an image pickup apparatus; an electronic apparatus; and a manufacturing method. According to one aspect of the present disclosure, a solid-state image pickup element is provided with: a sensor section that generates electric signals corresponding to inputted light; a color filter with which the sensor section is covered; and a lens for collecting the inputted light to the sensor section through the color filter, said lens being formed of a laminated film that is formed of a predetermined lens material. The lens is formed on an upper layer of the color filter without being provided with a planarizing layer for eliminating a step of the color filter. The present disclosure is applicable to solid-state image pickup elements, and also to image pickup apparatuses, and electronic apparatuses having an image pickup section.
13
EP3084831B1
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
Publication/Patent Number: EP3084831B1 Publication Date: 2019-05-08 Application Number: 14821306.9 Filing Date: 2014-12-12 Inventor: Komai, Naoki   Sasaki, Naoto   Ogawa, Naoki   Oinoue, Takashi   Iwamoto, Hayato   Ooka yutaka   Nagata, Masaya   Assignee: Sony Corporation   IPC: H01L27/146