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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
JP2018120115A
AF MODULE, CAMERA MODULE, AND ELECTRONIC APPARATUS
Publication/Patent Number: JP2018120115A Publication Date: 2018-08-02 Application Number: 2017011993 Filing Date: 2017-01-26 Inventor: Fukuyama, Munekatsu   Ishida, Minoru   Ito, Hiroyuki   Iwasaki, Masanori   Matsutani, Hiroyasu   Fujii, Nobutoshi   Moriya, Yusuke   Hayashi, Toshihiko   Oshima, Keiji   Tazawa, Hiroshi   Saito, Taku   Shiraiwa, Toshiaki   Sato, Shuzo   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G03B15/00 Abstract: PROBLEM TO BE SOLVED: To provide a camera module that can be applied for various uses.SOLUTION: An AF module has a stacked lens structure in which lens-attached substrates are directly bonded together for stacking, where each lens-attached substrate has a lens inside a through-hole formed on a substrate, and an AF driving part that adjusts the distance between the stacked lens structure and a light receiving element. The technique is applicable, for example, to a camera module and the like.SELECTED DRAWING: Figure 94
2
JP2017032796A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032796A Publication Date: 2017-02-09 Application Number: 2015152918 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Kurobe, Toshihiro   Saito, Sotetsu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C39/10 Abstract: PROBLEM TO BE SOLVED: To suppress occurrence of contamination of damage of a lens.SOLUTION: A manufacturing apparatus makes a lens resin portion stick a spacer thicker than the height projecting from a substrate onto the substrate. The manufacturing apparatus includes: molding a lens resin portion inside of a through hole formed on a substrate using a die formed of two layers of a mold; molding the lens resin portion; and then releasing the lens resin portion from the other mold substrate in a state in which one mold is stuck onto the substrate. The present technology can be applied
3
JP2017032799A
SEMICONDUCTOR DEVICE
Publication/Patent Number: JP2017032799A Publication Date: 2017-02-09 Application Number: 2015152922 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Okamoto, Masaki   Matsutani, Hiroyasu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B3/00 Abstract: PROBLEM TO BE SOLVED: To reduce chipping effect when a plurality of laminated substrates are singulated.SOLUTION: A semiconductor device comprises laminated substrates on which a groove is formed for surrounding a pattern composed of predetermined circuits or components. This technique is applicable for a laminated lens structure in which an open hole is formed on each layer and a lens is arranged inside the open hole
4
JP2017032800A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032800A Publication Date: 2017-02-09 Application Number: 2015152923 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Yoshioka, Hirotaka   Matsutani, Hiroyasu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C39/10 Abstract: PROBLEM TO BE SOLVED: To reduce an influence of air in a void portion between lenses of adjacent layers of a laminated lens structure.SOLUTION: A substrate with a lens has a plurality of through holes formed therein
5
JP2017032797A
LAMINATED LENS STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication/Patent Number: JP2017032797A Publication Date: 2017-02-09 Application Number: 2015152919 Filing Date: 2015-07-31 Inventor: Yamamoto, Atsushi   Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Takeuchi, Koichi   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Kurobe, Toshihiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B7/02 Abstract: PROBLEM TO BE SOLVED: To align substrates with lenses in which lenses are arranged with high precision.SOLUTION: A laminated lens structure is laminated by joining substrates with lenses where lenses are arranged inside of a through hole formed on the substrate based on an alignment mark by direct joint. The through hole and the alignment mark are simultaneously formed. The present technology can be applied to a camera module integrated with a laminated lens structure formed by laminating at least three substrates with first to third lenses that are a substrate with a lense where a through hole is formed on the substrate and the lens is formed inside of the through hole
6
JP2017030252A
STACKED LENS STRUCTURE
Publication/Patent Number: JP2017030252A Publication Date: 2017-02-09 Application Number: 2015152917 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Takeuchi, Koichi   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Hikichi, Kunihiko   Matsutani, Hiroyasu   Kurobe, Toshihiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C33/12 Abstract: PROBLEM TO BE SOLVED: To reduce a positional shift of a lens in a stacked lens structure.SOLUTION: A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift which occurs in the position of each of the through-holes during manufacturing processes. A lens is formed on an inner side of each of the through-holes by using: a first mold in which a plurality of first transfer surfaces used for forming a first surface of each of the lenses is disposed at a position shifted from a second target position according to a second shift which occurs in the position of the first surface of each of the lenses during the manufacturing processes; and a second mold in which a plurality of second transfer surfaces used for forming a second surface of each of the lenses is disposed at a position shifted from a third target position according to a third shift which occurs in the position of the second surface of each of the lenses. The plurality of substrates having the lenses formed therein is formed by direct bonding
7
JP2017032798A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032798A Publication Date: 2017-02-09 Application Number: 2015152920 Filing Date: 2015-07-31 Inventor: Iwasaki, Masanori   Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Hagimoto, Masaya   Oikami, Takashi   Moriya, Yusuke   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: G02B1/111 Abstract: PROBLEM TO BE SOLVED: To suppress reduction of an image quality.SOLUTION: A through hole is formed on
8
JP5846809B2
FILM COMPRISED OF ACRYLIC RESIN COMPOSITION
Publication/Patent Number: JP5846809B2 Publication Date: 2016-01-20 Application Number: 2011184656 Filing Date: 2011-08-26 Inventor: Nanba, Michiyuki   Oshima, Keiji   Maeda, Kaori   Kurihara, Toyoaki   Assignee: KURARAY CO LTD   IPC: C08J5/18 Abstract: PROBLEM TO BE SOLVED: To provide a film which is obtained by melt-extruding an acrylic resin composition having excellent film-forming properties
9
JP5642610B2
ACRYLIC MULTILAYER BODY
Publication/Patent Number: JP5642610B2 Publication Date: 2014-12-17 Application Number: 2011080636 Filing Date: 2011-03-31 Inventor: Ito, Toshiyuki   Hamada, Kenichi   Oshima, Keiji   Kurihara, Toyoaki   Assignee: KURARAY CO LTD   IPC: B32B27/30 Abstract: PROBLEM TO BE SOLVED: To provide an acrylic multilayer body having excellent dimension stability
10
JP2013028156A
CONTROL METHOD FOR ELECTRIC PRESS MOLDING MACHINE
Publication/Patent Number: JP2013028156A Publication Date: 2013-02-07 Application Number: 2012134127 Filing Date: 2012-06-13 Inventor: Saito, Atsushi   Kobayashi, Yoshitaka   Oshima, Keiji   Assignee: SUMITOMO CHEMICAL CO LTD   SATO TEKKOSHO:KK   IPC: B29C43/02 Abstract: PROBLEM TO BE SOLVED: To restrain the occurrence of bounding after mold closing is completed even when mold closing speed is fast or mold clamping force is weak.SOLUTION: A control method for an electric press molding machine 1 includes a shaping process for shaping thermoplastic resin by using the straight-hydraulic electric press molding machine 1 having servo motors 7
11
JP2013036019A
RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
Publication/Patent Number: JP2013036019A Publication Date: 2013-02-21 Application Number: 2011238507 Filing Date: 2011-10-31 Inventor: Oshima, Keiji   Kurihara, Toyoaki   Kawahara, Moe   Assignee: KURARAY CO LTD   IPC: C08L53/00 Abstract: PROBLEM TO BE SOLVED: To provide a resin composition having excellent flowability and impact strength
12
JP2013028157A
CONTROL METHOD FOR ELECTRIC PRESS MOLDING MACHINE
Publication/Patent Number: JP2013028157A Publication Date: 2013-02-07 Application Number: 2012134128 Filing Date: 2012-06-13 Inventor: Saito, Atsushi   Kobayashi, Yoshitaka   Oshima, Keiji   Assignee: SUMITOMO CHEMICAL CO LTD   SATO TEKKOSHO:KK   IPC: B29C43/02 Abstract: PROBLEM TO BE SOLVED: To stabilize the mold closing speed of molds even when a set mold clamping force is weak.SOLUTION: A control method for an electric press molding machine 1 includes a shaping process for shaping thermoplastic resin by using the straight-hydraulic electric press molding machine 1 with servo motors 7
13
JP2013043964A
FILM COMPRISED OF ACRYLIC RESIN COMPOSITION
Publication/Patent Number: JP2013043964A Publication Date: 2013-03-04 Application Number: 2011184656 Filing Date: 2011-08-26 Inventor: Nanba, Michiyuki   Oshima, Keiji   Maeda, Kaori   Kurihara, Toyoaki   Assignee: KURARAY CO LTD   IPC: C08J5/18 Abstract: PROBLEM TO BE SOLVED: To provide a film which is obtained by melt-extruding an acrylic resin composition having excellent film-forming properties
14
JP2013053241A
LAMINATE
Publication/Patent Number: JP2013053241A Publication Date: 2013-03-21 Application Number: 2011192527 Filing Date: 2011-09-05 Inventor: Matsuki, Hiroshi   Hamada, Kenichi   Oshima, Keiji   Assignee: KURARAY CO LTD   IPC: B32B18/00 Abstract: PROBLEM TO BE SOLVED: To provide a laminate in which the production process can be simplified
15
JP2013159099A
METHOD OF MANUFACTURING OPTICAL MEMBER
Publication/Patent Number: JP2013159099A Publication Date: 2013-08-19 Application Number: 2012025376 Filing Date: 2012-02-08 Inventor: Ito, Toshiyuki   Hamada, Kenichi   Nanba, Michiyuki   Oshima, Keiji   Kurihara, Toyoaki   Assignee: KURARAY CO LTD   IPC: B29B11/10 Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical member which has superior processability and light guide performance through a roll-to-roll process.SOLUTION: A method of manufacturing an optical member includes the steps of: continuously paying out a laminate sheet from an optical sheet roll body 30 formed by winding the laminate sheet
16
JP4862810B2
NOX SENSOR ABNORMALITY DETECTION DEVICE AND EXHAUST EMISSION CONTROL SYSTEM USING IT
Publication/Patent Number: JP4862810B2 Publication Date: 2012-01-25 Application Number: 2007311537 Filing Date: 2007-11-30 Inventor: Kariya, Yasuhiro   Oshima, Keiji   Assignee: DENSO CORP   IPC: B01D53/86 Abstract: PROBLEM TO BE SOLVED: To provide an NOx sensor abnormality detection device for detecting abnormality of an NOx sensor at high accuracy
17
JP4911193B2
EXHAUST EMISSION CONTROL SYSTEM FOR INTERNAL COMBUSTION ENGINE
Publication/Patent Number: JP4911193B2 Publication Date: 2012-04-04 Application Number: 2009109670 Filing Date: 2009-04-28 Inventor: Nishijima, Yoshiaki   Oshima, Keiji   Assignee: DENSO CORP   IPC: B01D53/94 Abstract: PROBLEM TO BE SOLVED: To provide an exhaust emission control device for an internal combustion engine
18
JP2012213912A
ACRYLIC MULTILAYER BODY
Publication/Patent Number: JP2012213912A Publication Date: 2012-11-08 Application Number: 2011080636 Filing Date: 2011-03-31 Inventor: Ito, Toshiyuki   Hamada, Kenichi   Oshima, Keiji   Kurihara, Toyoaki   Assignee: KURARAY CO LTD   IPC: B32B27/30 Abstract: PROBLEM TO BE SOLVED: To provide an acrylic multilayer body having excellent dimension stability
19
JP4895029B2
VACUUM HEAT INSULATING MATERIAL
Publication/Patent Number: JP4895029B2 Publication Date: 2012-03-14 Application Number: 2007097310 Filing Date: 2007-04-03 Inventor: Oshima, Keiji   Matsushita, Satoyuki   Matsumoto, Shin   Assignee: FUJI ELECTRIC SYSTEMS CO LTD   IPC: B32B7/02 Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive vacuum heat insulating material capable of increasing thermal resistance in a peripheral direction without hardly exerting an influence on thermal resistance in the radial direction of each layer such as a heat reflecting layer and a heat insulating layer which are laminated on a rodlike heat insulating target
20
JP4962040B2
OSCILLATION TYPE MOTOR
Publication/Patent Number: JP4962040B2 Publication Date: 2012-06-27 Application Number: 2007040998 Filing Date: 2007-02-21 Inventor: Oshima, Keiji   Matsumoto, Shin   Mizoguchi, Yoshinori   Assignee: FUJI ELECTRIC SYSTEMS CO LTD   IPC: H02K33/02 Abstract: PROBLEM TO BE SOLVED: To achieve miniaturization
Total 13 pages