Country
Full text data for US,EP,CN
Type
Legal Validity
Legal Status
Filing Date
Publication Date
Inventor
Assignee
Click to expand
IPC(Section)
IPC(Class)
IPC(Subclass)
IPC(Group)
IPC(Subgroup)
Agent
Agency
Claims Number
Figures Number
Citation Number of Times
Assignee Number
No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
US10748947B2
Imaging device, manufacturing method, and electronic apparatus
Publication/Patent Number: US10748947B2 Publication Date: 2020-08-18 Application Number: 16/322,307 Filing Date: 2017-07-25 Inventor: Masuda, Yoshiaki   Ando, Atsuhiro   Kubo, Norihiro   Arai, Chihiro   Saito, Sotetsu   Tada, Masahiro   Miyazawa, Shinji   Assignee: Sony Semiconductor Solutions Corporation   IPC: H01L31/0203 Abstract: The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus. An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.
2
WO2020017205A1
IMAGING ELEMENT AND ELECTRONIC DEVICE
Publication/Patent Number: WO2020017205A1 Publication Date: 2020-01-23 Application Number: 2019023618 Filing Date: 2019-06-14 Inventor: Yoshida, Hirokazu   Ishii, Wataru   Matsuoka, Shinichi   Kamei, Takahiro   Ooka, Yutaka   Masuda, Yoshiaki   Saito, Sotetsu   Sato, Naoki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: An imaging element according to one embodiment of the present invention includes: a sensor substrate which has a light-receiving region in which a plurality of light-receiving elements is arranged and a surrounding region provided around the light-receiving region; a sealing member that is disposed facing one side of the sensor substrate; a resin layer that bonds together the sensor substrate and the sealing member; and a recessed part which is provided in the surrounding region on the one side of the sensor substrate and which has the resin layer embedded therein. The resin layer has one or a plurality of voids on the inside of the recessed part in plan view.
3
US2019172863A1
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Publication/Patent Number: US2019172863A1 Publication Date: 2019-06-06 Application Number: 16/322,307 Filing Date: 2017-07-25 Inventor: Masuda, Yoshiaki   Ando, Atsuhiro   Kubo, Norihiro   Arai, Chihiro   Saito, Sotetsu   Tada, Masahiro   Miyazawa, Shinji   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H01L27/146 Abstract: The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus—An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.
4
KR20190034553A
촬상 소자, 제조 방법, 및 전자 기기
Publication/Patent Number: KR20190034553A Publication Date: 2019-04-02 Application Number: 20197003594 Filing Date: 2017-07-25 Inventor: Miyazawa, Shinji   Arai, Chihiro   Ando, Atsuhiro   Saito, Sotetsu   Kubo, Norihiro   Masuda, Yoshiaki   Tada, Masahiro   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: H04N5/369 Abstract: 본 개시는, 보다 양호한 특성을 구비할 수 있도록 하는 촬상 소자, 제조 방법, 및 전자 기기에 관한 것이다. 촬상 소자는, 복수의 화소가 어레이 형상으로 배치된 유효 화소 영역이 설치되는 센서 기판과, 센서 기판의 유효 화소 영역측의 면을 봉지하는 투명한 봉지 부재와, 적어도 유효 화소 영역을 포함하는 영역에 있어서 센서 기판 및 봉지 부재를 접착하는 시일 수지와, 평면적으로 보았을 때에 유효 화소 영역보다 외측이 되는 외주 영역에 있어서 센서 기판 및 봉지 부재를 접착하며, 시일 수지보다 강성이 높은 보강 수지를 구비한다. 그리고, 외주 영역에 있어서의 시일 수지 및 보강 수지에 의한 단위면적당의 접착력과, 외주 영역에 있어서 접착되는 접착 면적과의 적이, 유효 화소 영역에 있어서의 시일 수지에 의한 단위면적당의 접착력과, 유효 화소 영역에 있어서 접착되는 접착 면적과의 적보다 크게 설정된다. 본 기술은, 예를 들어, WCSP의 CMOS 이미지 센서에 적용할 수 있다.
5
US2018196170A1
LENS-ATTACHED SUBSTRATE, STACKED LENS STRUCTURE, CAMERA MODULE, AND MANUFACTURING APPARATUS AND METHOD
Publication/Patent Number: US2018196170A1 Publication Date: 2018-07-12 Application Number: 15/741,335 Filing Date: 2016-07-15 Inventor: Ishida, Minoru   Shiraiwa, Toshiaki   Fujii, Nobutoshi   Ohshima, Keiji   Saito, Suguru   Itou, Hiroyuki   Matsugai, Hiroyasu   Saito, Sotetsu   Kurobe, Toshihiro   Tazawa, Hiroshi   Assignee: Sony Semiconductor Solutions Corporation   IPC: B29C43/50 Abstract: To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.
6
WO2017022190A1
MANUFACTURING METHOD FOR LENS SUBSTRATE
Publication/Patent Number: WO2017022190A1 Publication Date: 2017-02-09 Application Number: 2016003352 Filing Date: 2016-07-15 Inventor: Fujii, Nobutoshi   Itou, Hiroyuki   Kurobe, Toshihiro   Saito, Sotetsu   Ishida, Minoru   Matsugai, Hiroyasu   Ohshima, Keiji   Tazawa, Hiroshi   Saito, Suguru   Shiraiwa, Toshiaki   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION   IPC: B29D11/00 Abstract: To suppress occurrence of contamination or damage to a lens. In the present technology
7
JP2017032796A
SUBSTRATE WITH LENS
Publication/Patent Number: JP2017032796A Publication Date: 2017-02-09 Application Number: 2015152918 Filing Date: 2015-07-31 Inventor: Ito, Hiroyuki   Fujii, Nobutoshi   Ishida, Minoru   Saito, Taku   Shiraiwa, Toshiaki   Oshima, Keiji   Tazawa, Hiroshi   Matsutani, Hiroyasu   Kurobe, Toshihiro   Saito, Sotetsu   Assignee: SONY SEMICONDUCTOR SOLUTIONS CORP   IPC: B29C39/10 Abstract: PROBLEM TO BE SOLVED: To suppress occurrence of contamination of damage of a lens.SOLUTION: A manufacturing apparatus makes a lens resin portion stick a spacer thicker than the height projecting from a substrate onto the substrate. The manufacturing apparatus includes: molding a lens resin portion inside of a through hole formed on a substrate using a die formed of two layers of a mold; molding the lens resin portion; and then releasing the lens resin portion from the other mold substrate in a state in which one mold is stuck onto the substrate. The present technology can be applied