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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
EP2573829B1
Light emitting diode module
Publication/Patent Number: EP2573829B1 Publication Date: 2020-04-22 Application Number: 12198155.9 Filing Date: 2007-10-16 Inventor: Schrank, Franz   Hoschopf, Hans   Assignee: Tridonic Jennersdorf GmbH   Lumitech Patentverwertung GmbH   IPC: H01L33/48
2
EP2573829B8
Light emitting diode module
Publication/Patent Number: EP2573829B8 Publication Date: 2020-06-10 Application Number: 12198155.9 Filing Date: 2007-10-16 Inventor: Schrank, Franz   Hoschopf, Hans   Assignee: Tridonic GmbH & Co. KG   Lumitech Patentverwertung GmbH   IPC: H01L33/48
3
US10734534B2
Method of producing an optical sensor at wafer-level and optical sensor
Publication/Patent Number: US10734534B2 Publication Date: 2020-08-04 Application Number: 15/746,342 Filing Date: 2016-07-22 Inventor: Etschmaier, Harald   Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Assignee: ams AG   IPC: H01L31/0203 Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.
4
US2020243387A1
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication/Patent Number: US2020243387A1 Publication Date: 2020-07-30 Application Number: 16/754,323 Filing Date: 2018-10-11 Inventor: Bodner, Thomas   Jessenig, Stefan   Schrank, Franz   Assignee: ams AG   IPC: H01L21/768 Abstract: A method for manufacturing a semiconductor device comprises the steps of providing a semiconductor body with a main plane of extension, and forming a trench in the semiconductor body from a top side of the semiconductor body in a vertical direction which is perpendicular to the main plane of extension of the semiconductor body. The method further comprises the steps of coating inner walls of the trench with an isolation layer, depositing a metallization layer within the trench, and depositing a passivation layer within the trench such that an inner volume of the trench is free of any material, wherein inner surfaces that are adjacent to the inner volume are treated to be hydrophobic at least in places. Furthermore, a semiconductor device is provided.
5
US10644047B2
Optoelectronic device with a refractive element and a method of producing such an optoelectronic device
Publication/Patent Number: US10644047B2 Publication Date: 2020-05-05 Application Number: 16/069,802 Filing Date: 2016-12-15 Inventor: Hofrichter, Jens   Schrank, Franz   Siegert, Joerg   Assignee: ams AG   IPC: H01L27/146 Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element.
6
EP3193368B1
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF PRODUCING SUCH AN OPTOELECTRONIC DEVICE
Publication/Patent Number: EP3193368B1 Publication Date: 2020-03-18 Application Number: 16151134.0 Filing Date: 2016-01-13 Inventor: Hofrichter, Jens   Schrank, Franz   Siegert, Jörg   Assignee: ams AG   IPC: H01L27/146
7
EP2665096B1
A METHOD OF WAFER-SCALE INTEGRATION OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
Publication/Patent Number: EP2665096B1 Publication Date: 2020-04-22 Application Number: 12168069.8 Filing Date: 2012-05-15 Inventor: Cassidy, Cathal   Siegert, Jörg   Schrank, Franz   Assignee: ams AG   IPC: H01L27/146
8
EP3471132B1
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication/Patent Number: EP3471132B1 Publication Date: 2020-02-26 Application Number: 17196160.0 Filing Date: 2017-10-12 Inventor: Bodner, Thomas   Jessenig, Stefan   Schrank, Franz   Assignee: ams AG   IPC: H01L21/768
9
EP2908335B1
Dicing method
Publication/Patent Number: EP2908335B1 Publication Date: 2020-04-15 Application Number: 14155240.6 Filing Date: 2014-02-14 Inventor: Schrank, Franz   Schrems, Martin   Stering, Bernhard   Assignee: ams AG   IPC: H01L21/768
10
EP3024029B1
Method of producing a semiconductor device comprising an aperture array
Publication/Patent Number: EP3024029B1 Publication Date: 2020-04-22 Application Number: 14193859.7 Filing Date: 2014-11-19 Inventor: Siegert, Jörg   Schrank, Franz   Schrems, Martin   Assignee: ams AG   IPC: H01L27/146
11
EP3660902A1
SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY
Publication/Patent Number: EP3660902A1 Publication Date: 2020-06-03 Application Number: 20152454.3 Filing Date: 2014-11-19 Inventor: Siegert, Jörg   Schrank, Franz   Schrems, Martin   Assignee: AMS AG   IPC: H01L27/146 Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer.
12
US2020168772A1
LED/LD ILLUMINATION DEVICE WITH SEPARATE LUMINOPHORE CONFIGURATION, AND METHOD FOR PRODUCING SAME
Publication/Patent Number: US2020168772A1 Publication Date: 2020-05-28 Application Number: 16/627,823 Filing Date: 2018-05-24 Inventor: Riemer, Steffen   Schrank, Franz   Uitz, Patrick   Brugger, Wilhelm   Irran, Thomas   Assignee: Tridonic Jennersdorf GmbH   W&H Dentalwerk Bürmoos GmbH   IPC: H01L33/50 Abstract: The invention relates to an illuminating device (1) comprising a substrate (2), a non-transparent spacer (4) which is connected to the substrate (2) so as to be hermetically sealed, an opening in the spacer (4), opposite said substrate (2), and an illumination element (3) positioned beneath the spacer (4) and beneath the opening, which element is connected to the substrate (2) so as to be hermetically sealed, characterized in that the opening in the spacer (4) is closed, so as to be hermetically sealed, by an optical element (5) consisting of a glass material the volume of which comprises at least one luminophore and thus constitutes a luminescent composite glass material.
13
US10847664B2
Optical package and method of producing an optical package
Publication/Patent Number: US10847664B2 Publication Date: 2020-11-24 Application Number: 15/773,539 Filing Date: 2016-11-04 Inventor: Mehrl, David   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Schrank, Franz   Assignee: AMS AG   IPC: H01L31/0232 Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.
14
US202020611A1
Semiconductor Device
Publication/Patent Number: US202020611A1 Publication Date: 2020-01-16 Application Number: 20/181,648 Filing Date: 2018-02-14 Inventor: Singulani, Anderson   Kraft, Jochen   Parteder, Georg   Coppeta, Raffaele   Schrank, Franz   Assignee: ams AG   IPC: H01L23/528 Abstract: A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via. Furthermore, the etch-stop layer is arranged between the electrically conductive via and the contact layer in the vertical direction.
15
EP3651680A1
LED/LD ILLUMINATION DEVICE WITH SEPARATE LUMINOPHORE CONFIGURATION, AND METHOD FOR PRODUCING SAME
Publication/Patent Number: EP3651680A1 Publication Date: 2020-05-20 Application Number: 18727772.8 Filing Date: 2018-05-24 Inventor: Riemer, Steffen   Schrank, Franz   Uitz, Patrick   Brugger, Wilhelm   Irran, Thomas   Assignee: Tridonic Jennersdorf GmbH   W & H Dentalwerk Bürmoos GmbH   IPC: A61C1/08
16
US2020020611A1
Semiconductor Device
Publication/Patent Number: US2020020611A1 Publication Date: 2020-01-16 Application Number: 16/483,884 Filing Date: 2018-02-14 Inventor: Kraft, Jochen   Parteder, Georg   Singulani, Anderson   Coppeta, Raffaele   Schrank, Franz   Assignee: ams AG   IPC: H01L23/48 Abstract: A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via. Furthermore, the etch-stop layer is arranged between the electrically conductive via and the contact layer in the vertical direction.
17
EP3471146B1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: EP3471146B1 Publication Date: 2020-09-09 Application Number: 17196609.6 Filing Date: 2017-10-16 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Labodi, Miklos   Siegert, Jörg   Schrems, Martin   Assignee: ams AG   IPC: H01L27/146
18
EP3550600B1
METHOD OF FORMING A THROUGH-SUBSTRATE VIA AND SEMICONDUCTOR DEVICE COMPRISING THE THROUGH-SUBSTRATE VIA
Publication/Patent Number: EP3550600B1 Publication Date: 2020-08-05 Application Number: 18165692.7 Filing Date: 2018-04-04 Inventor: Kraft, Jochen   Parteder, Georg   Jessenig, Stefan   Schrank, Franz   Siegert, Jörg   Assignee: ams AG   IPC: H01L21/768
19
US2020313031A1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: US2020313031A1 Publication Date: 2020-10-01 Application Number: 16/756,025 Filing Date: 2018-10-15 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Labodi, Miklos   Siegert, Joerg   Schrems, Martin   Assignee: ams AG   IPC: H01L31/18 Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.
20
DE102017211727A1
Gebondete LED-Chips in einer Polymermatrix
Publication/Patent Number: DE102017211727A1 Publication Date: 2019-01-10 Application Number: 102017211727 Filing Date: 2017-07-10 Inventor: Schrank, Franz   Assignee: TRIDONIC JENNERSDORF GMBH   IPC: H01L33/56 Abstract: Beleuchtungsvorrichtung (1) aufweisend- einen Träger (2);- zumindest zwei LED-Chips (3) die mit dem Träger (2) mechanisch verbunden und über Bonddrähte (4) mit dem Träger und/oder mit einem benachbarten LED-Chip (3) elektrisch kontaktiert sind;- ein im Bereich der LED-Chips (3) vergossener und ausgehärteter Verguss (7), aufweisend eine Matrix, in die vorzugsweise Farbkonversionspartikel und/oder Streupartikel eingebettet sind.Die Beleuchtungsvorrichtung (1) ist dadurch gekennzeichnet, dass zwischen dem Verguss (7) und den Oberflächen der Komponenten- Träger (2)- Bonddrähte (4) und- LED-Chips (3) eine im Wesentlichem zusammenhängende Pufferschicht (8) existiert, die das Vergussmaterial (7) von den Oberflächen der genannten Komponenten (2),(4),(3) mechanisch entkoppelt und die mechanische Belastung der Bonddrähte verringert.