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1 | EP2573829B1 |
Light emitting diode module
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Publication/Patent Number: EP2573829B1 | Publication Date: 2020-04-22 | Application Number: 12198155.9 | Filing Date: 2007-10-16 | Inventor： Schrank, Franz Hoschopf, Hans | Assignee: Tridonic Jennersdorf GmbH Lumitech Patentverwertung GmbH | IPC: H01L33/48 | ||||
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2 | EP2573829B8 |
Light emitting diode module
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Publication/Patent Number: EP2573829B8 | Publication Date: 2020-06-10 | Application Number: 12198155.9 | Filing Date: 2007-10-16 | Inventor： Schrank, Franz Hoschopf, Hans | Assignee: Tridonic GmbH & Co. KG Lumitech Patentverwertung GmbH | IPC: H01L33/48 | ||||
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3 | US10734534B2 |
Method of producing an optical sensor at wafer-level and optical sensor
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Publication/Patent Number: US10734534B2 | Publication Date: 2020-08-04 | Application Number: 15/746,342 | Filing Date: 2016-07-22 | Inventor： Etschmaier, Harald Toschkoff, Gregor Bodner, Thomas Schrank, Franz | Assignee: ams AG | IPC: H01L31/0203 | Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure. | |||
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4 | US2020243387A1 |
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
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Publication/Patent Number: US2020243387A1 | Publication Date: 2020-07-30 | Application Number: 16/754,323 | Filing Date: 2018-10-11 | Inventor： Bodner, Thomas Jessenig, Stefan Schrank, Franz | Assignee: ams AG | IPC: H01L21/768 | Abstract: A method for manufacturing a semiconductor device comprises the steps of providing a semiconductor body with a main plane of extension, and forming a trench in the semiconductor body from a top side of the semiconductor body in a vertical direction which is perpendicular to the main plane of extension of the semiconductor body. The method further comprises the steps of coating inner walls of the trench with an isolation layer, depositing a metallization layer within the trench, and depositing a passivation layer within the trench such that an inner volume of the trench is free of any material, wherein inner surfaces that are adjacent to the inner volume are treated to be hydrophobic at least in places. Furthermore, a semiconductor device is provided. | |||
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5 | US10644047B2 |
Optoelectronic device with a refractive element and a method of producing such an optoelectronic device
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Publication/Patent Number: US10644047B2 | Publication Date: 2020-05-05 | Application Number: 16/069,802 | Filing Date: 2016-12-15 | Inventor： Hofrichter, Jens Schrank, Franz Siegert, Joerg | Assignee: ams AG | IPC: H01L27/146 | Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element. | |||
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6 | EP3193368B1 |
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF PRODUCING SUCH AN OPTOELECTRONIC DEVICE
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Publication/Patent Number: EP3193368B1 | Publication Date: 2020-03-18 | Application Number: 16151134.0 | Filing Date: 2016-01-13 | Inventor： Hofrichter, Jens Schrank, Franz Siegert, Jörg | Assignee: ams AG | IPC: H01L27/146 | ||||
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7 | EP2665096B1 |
A METHOD OF WAFER-SCALE INTEGRATION OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
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Publication/Patent Number: EP2665096B1 | Publication Date: 2020-04-22 | Application Number: 12168069.8 | Filing Date: 2012-05-15 | Inventor： Cassidy, Cathal Siegert, Jörg Schrank, Franz | Assignee: ams AG | IPC: H01L27/146 | ||||
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8 | EP3471132B1 |
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
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Publication/Patent Number: EP3471132B1 | Publication Date: 2020-02-26 | Application Number: 17196160.0 | Filing Date: 2017-10-12 | Inventor： Bodner, Thomas Jessenig, Stefan Schrank, Franz | Assignee: ams AG | IPC: H01L21/768 | ||||
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9 | EP2908335B1 |
Dicing method
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Publication/Patent Number: EP2908335B1 | Publication Date: 2020-04-15 | Application Number: 14155240.6 | Filing Date: 2014-02-14 | Inventor： Schrank, Franz Schrems, Martin Stering, Bernhard | Assignee: ams AG | IPC: H01L21/768 | ||||
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10 | EP3024029B1 |
Method of producing a semiconductor device comprising an aperture array
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Publication/Patent Number: EP3024029B1 | Publication Date: 2020-04-22 | Application Number: 14193859.7 | Filing Date: 2014-11-19 | Inventor： Siegert, Jörg Schrank, Franz Schrems, Martin | Assignee: ams AG | IPC: H01L27/146 | ||||
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11 | EP3660902A1 |
SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY
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Publication/Patent Number: EP3660902A1 | Publication Date: 2020-06-03 | Application Number: 20152454.3 | Filing Date: 2014-11-19 | Inventor： Siegert, Jörg Schrank, Franz Schrems, Martin | Assignee: AMS AG | IPC: H01L27/146 | Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer. | |||
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12 | US2020168772A1 |
LED/LD ILLUMINATION DEVICE WITH SEPARATE LUMINOPHORE CONFIGURATION, AND METHOD FOR PRODUCING SAME
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Publication/Patent Number: US2020168772A1 | Publication Date: 2020-05-28 | Application Number: 16/627,823 | Filing Date: 2018-05-24 | Inventor： Riemer, Steffen Schrank, Franz Uitz, Patrick Brugger, Wilhelm Irran, Thomas | Assignee: Tridonic Jennersdorf GmbH W&H Dentalwerk Bürmoos GmbH | IPC: H01L33/50 | Abstract: The invention relates to an illuminating device (1) comprising a substrate (2), a non-transparent spacer (4) which is connected to the substrate (2) so as to be hermetically sealed, an opening in the spacer (4), opposite said substrate (2), and an illumination element (3) positioned beneath the spacer (4) and beneath the opening, which element is connected to the substrate (2) so as to be hermetically sealed, characterized in that the opening in the spacer (4) is closed, so as to be hermetically sealed, by an optical element (5) consisting of a glass material the volume of which comprises at least one luminophore and thus constitutes a luminescent composite glass material. | |||
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13 | US10847664B2 |
Optical package and method of producing an optical package
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Publication/Patent Number: US10847664B2 | Publication Date: 2020-11-24 | Application Number: 15/773,539 | Filing Date: 2016-11-04 | Inventor： Mehrl, David Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald Schrank, Franz | Assignee: AMS AG | IPC: H01L31/0232 | Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range. | |||
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14 | US202020611A1 |
Semiconductor Device
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Publication/Patent Number: US202020611A1 | Publication Date: 2020-01-16 | Application Number: 20/181,648 | Filing Date: 2018-02-14 | Inventor： Singulani, Anderson Kraft, Jochen Parteder, Georg Coppeta, Raffaele Schrank, Franz | Assignee: ams AG | IPC: H01L23/528 | Abstract: A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via. Furthermore, the etch-stop layer is arranged between the electrically conductive via and the contact layer in the vertical direction. | |||
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15 | EP3651680A1 |
LED/LD ILLUMINATION DEVICE WITH SEPARATE LUMINOPHORE CONFIGURATION, AND METHOD FOR PRODUCING SAME
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Publication/Patent Number: EP3651680A1 | Publication Date: 2020-05-20 | Application Number: 18727772.8 | Filing Date: 2018-05-24 | Inventor： Riemer, Steffen Schrank, Franz Uitz, Patrick Brugger, Wilhelm Irran, Thomas | Assignee: Tridonic Jennersdorf GmbH W & H Dentalwerk Bürmoos GmbH | IPC: A61C1/08 | ||||
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16 | US2020020611A1 |
Semiconductor Device
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Publication/Patent Number: US2020020611A1 | Publication Date: 2020-01-16 | Application Number: 16/483,884 | Filing Date: 2018-02-14 | Inventor： Kraft, Jochen Parteder, Georg Singulani, Anderson Coppeta, Raffaele Schrank, Franz | Assignee: ams AG | IPC: H01L23/48 | Abstract: A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via. Furthermore, the etch-stop layer is arranged between the electrically conductive via and the contact layer in the vertical direction. | |||
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17 | EP3471146B1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: EP3471146B1 | Publication Date: 2020-09-09 | Application Number: 17196609.6 | Filing Date: 2017-10-16 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Jörg Schrems, Martin | Assignee: ams AG | IPC: H01L27/146 | ||||
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18 | EP3550600B1 |
METHOD OF FORMING A THROUGH-SUBSTRATE VIA AND SEMICONDUCTOR DEVICE COMPRISING THE THROUGH-SUBSTRATE VIA
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Publication/Patent Number: EP3550600B1 | Publication Date: 2020-08-05 | Application Number: 18165692.7 | Filing Date: 2018-04-04 | Inventor： Kraft, Jochen Parteder, Georg Jessenig, Stefan Schrank, Franz Siegert, Jörg | Assignee: ams AG | IPC: H01L21/768 | ||||
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19 | US2020313031A1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: US2020313031A1 | Publication Date: 2020-10-01 | Application Number: 16/756,025 | Filing Date: 2018-10-15 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Joerg Schrems, Martin | Assignee: ams AG | IPC: H01L31/18 | Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided. | |||
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20 | DE102017211727A1 |
Gebondete LED-Chips in einer Polymermatrix
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Publication/Patent Number: DE102017211727A1 | Publication Date: 2019-01-10 | Application Number: 102017211727 | Filing Date: 2017-07-10 | Inventor： Schrank, Franz | Assignee: TRIDONIC JENNERSDORF GMBH | IPC: H01L33/56 | Abstract: Beleuchtungsvorrichtung (1) aufweisend- einen Träger (2);- zumindest zwei LED-Chips (3) die mit dem Träger (2) mechanisch verbunden und über Bonddrähte (4) mit dem Träger und/oder mit einem benachbarten LED-Chip (3) elektrisch kontaktiert sind;- ein im Bereich der LED-Chips (3) vergossener und ausgehärteter Verguss (7), aufweisend eine Matrix, in die vorzugsweise Farbkonversionspartikel und/oder Streupartikel eingebettet sind.Die Beleuchtungsvorrichtung (1) ist dadurch gekennzeichnet, dass zwischen dem Verguss (7) und den Oberflächen der Komponenten- Träger (2)- Bonddrähte (4) und- LED-Chips (3) eine im Wesentlichem zusammenhängende Pufferschicht (8) existiert, die das Vergussmaterial (7) von den Oberflächen der genannten Komponenten (2),(4),(3) mechanisch entkoppelt und die mechanische Belastung der Bonddrähte verringert. |
3.Current Quota