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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
181
EP2630653A1
APPARATUS FOR COATING A WAFER
Publication/Patent Number: EP2630653A1 Publication Date: 2013-08-28 Application Number: 10770723.4 Filing Date: 2010-10-19 Inventor: Bartel, Johanna   Holzleitner, Ronald   Hoffmann, Raimund   Schrank, Franz   Teva, Jordi   Assignee: EV Group GmbH   IPC: H01L21/00
182
SG188953A1
DEVICE FOR COATING A WAFER
Publication/Patent Number: SG188953A1 Publication Date: 2013-05-31 Application Number: 2013015789 Filing Date: 2010-10-19 Inventor: Schrank, Franz   Teva, Jordi   Bartel, Johanna   Holzleitner, Ronald   Hoffmann, Raimund   Assignee: EV GROUP GMBH   IPC: Abstract: 11 Device for Coating a Wafer AbstractThe invention relates to a device for coating a surface (2o) of a wafer (2)With a retaining system (16) for placing the wafer (2) on a retaining surface (19)
183
US2013160706A1
DEVICE FOR COATING A WAFER
Publication/Patent Number: US2013160706A1 Publication Date: 2013-06-27 Application Number: 13/820,331 Filing Date: 2010-10-19 Inventor: Bartel, Johanna   Holzleitner, Ronald   Hoffmann, Raimund   Schrank, Franz   Teva-meroño, Jordi   Assignee: Bartel, Johanna   Holzleitner, Ronald   Hoffmann, Raimund   Schrank, Franz   Teva-Meroño, Jordi   IPC: B05B13/02 Abstract: The invention relates to a device for coating a surface of a wafer. The device includes a retaining system for placing the wafer on a retaining surface, a nozzle system for coating the wafer in a Z-direction, and a ring having an inside periphery that surrounds a side periphery of the wafer (2), wherein the ring can be arranged for expanding a coating surface when coating the wafer.
184
EP2648214A1
Semiconductor device with interconnection via in the substrate and method of production
Publication/Patent Number: EP2648214A1 Publication Date: 2013-10-09 Application Number: 12163391.1 Filing Date: 2012-04-05 Inventor: Löffler, Bernhard   Rohracher, Karl   Schrank, Franz   Siegert, Jörg   Kraft, Jochen   Assignee: austriamicrosystems AG   IPC: H01L21/768 Abstract: The semiconductor device comprises a substrate (1) of semiconductor material with a main surface (11) and an opposite surface (12), an integrated circuit component (2) in the substrate at or near the main surface, a structured metal plane (3) at a distance from the substrate above the main surface, a dielectric layer (4) between the metal plane and the substrate, an electrical interconnect (5) between the metal plane and the integrated circuit component, the interconnect traversing the dielectric layer, and an interconnection via (6) comprising a metallization (7) leading through the substrate between the main surface and the opposite surface. The metallization is connected to the metal plane via a further electrical interconnect (8) traversing the dielectric layer.
185
US2013221539A1
METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH A THROUGH-CONTACT AND SEMICONDUCTOR COMPONENT WITH THROUGH-CONTACT
Publication/Patent Number: US2013221539A1 Publication Date: 2013-08-29 Application Number: 13/820,998 Filing Date: 2011-08-09 Inventor: Kraft, Jochen   Jessenig, Stefan   Koppitsch, Günther   Schrank, Franz   Teva, Jordi   Löffler, Bernhard   Siegert, Jörg   Assignee: ams AG   IPC: H01L23/48 Abstract: Through the intermetal dielectric (2) and the semiconductor material of the substrate (1) a contact hole is formed, and a contact area of a connection metal plane (3) that faces the substrate is exposed in the contact hole. A metallization (11) is applied, which forms a connection contact (12) on the contact area, a through-contact (13) in the contact hole and a connection contact (20) on a contact area facing away from the substrate and/or on a vertical conductive connection (15) of the upper metal plane (24).
186
DE102009049102B4
Halbleiterbauelement mit Durchkontaktierung und Verfahren zur Herstellung einer Durchkontaktierung in einem Halbleiterbauelement
Title (English): The claimant also alleges that, in the United States and Regulation No. 4,
Publication/Patent Number: DE102009049102B4 Publication Date: 2012-10-04 Application Number: 102009049102 Filing Date: 2009-10-13 Inventor: Schrank, Franz   Assignee: Austriamicrosystems AG   IPC: H01L21/283 Abstract: Halbleiterbauelement mit Durchkontaktierung
187
US8199963B2
Microphone arrangement and method for production thereof
Publication/Patent Number: US8199963B2 Publication Date: 2012-06-12 Application Number: 11/973,224 Filing Date: 2007-10-05 Inventor: Schrank, Franz   Assignee: austriamicrosystems AG   IPC: H04R11/02 Abstract: A microphone arrangement comprises a stack arrangement (1) which comprises a first semiconductor body (10) having a microphone structure (13) and a second semiconductor body (80). The second semiconductor body (80) comprises a first main face (81) on which an integrated circuit (83) is arranged and a second main face (82) which faces the first semiconductor body (10).
188
US2012280392A1
Semiconductor Component Havin a Plated Through-Hole and method for the Production Thereof
Publication/Patent Number: US2012280392A1 Publication Date: 2012-11-08 Application Number: 13/501,399 Filing Date: 2010-09-22 Inventor: Schrank, Franz   Assignee: Schrank, Franz   IPC: H01L23/48 Abstract: A connection contact layer (4) is disposed between semiconductor bodies (1,2). In the second semiconductor body (2), a recess is provided. A connection layer (7) on the top face extends as far as the recess, in which a metallization (10) is present that conductively connects the connection contact layer (4) to the connection layer (7) in an electrical manner. A polymer (8) or a further metallization is present in the recess.
189
DE102010061848A1
LED-Modul mit vorgefertigtem Element
Title (English): Led module with prefabricated elements.
Publication/Patent Number: DE102010061848A1 Publication Date: 2012-05-24 Application Number: 102010061848 Filing Date: 2010-11-24 Inventor: Pachler, Peter   Schrank, Franz Dr   Assignee: LUMITECH PRODUKTION UND ENTWICKLUNG GMBH   TRIDONIC JENNERSDORF GMBH   IPC: H01L25/075 Abstract: Die Erfindung bezieht sich auf ein LED-Modul
190
DE102011009373A1
Fotodiodenbauelement
Title (English): Photoelectric component
Publication/Patent Number: DE102011009373A1 Publication Date: 2012-07-26 Application Number: 102011009373 Filing Date: 2011-01-25 Inventor: Schrank, Franz   Teva, Jordi Dr   Assignee: Austriamicrosystems AG   IPC: H01L27/146 Abstract: Fotodiodenbauelement mit – einer elektrisch leitfähigen Kathodenschicht (3) an einer Fotodiodenschicht (4) aus einem Halbleitermaterial
191
WO2012069519A3
LED MODULE WITH PREFABRICATED WAVELENGTH CONVERSION ELEMENT
Publication/Patent Number: WO2012069519A3 Publication Date: 2012-07-19 Application Number: 2011070770 Filing Date: 2011-11-23 Inventor: Schrank, Franz   Pachler, Peter   Assignee: SCHRANK, FRANZ   LUMITECH PRODUKTION UND ENTWICKLUNG GMBH   PACHLER, PETER   TRIDONIC JENNERSDORF GMBH   IPC: H01L33/50 Abstract: The invention relates to an LED module
192
US8338898B2
Micro electro mechanical system (MEMS) microphone having a thin-film construction
Publication/Patent Number: US8338898B2 Publication Date: 2012-12-25 Application Number: 11/792,515 Filing Date: 2005-10-12 Inventor: Schrank, Franz   Schrems, Martin   Assignee: Austriamicrosystems AG   IPC: H01L29/82 Abstract: An MEMS microphone is bonded onto the surface of an IC component containing at least one integrated circuit suitable for the conditioning and processing of the electrical signal supplied by the MEMS microphone. The entire component is simple to produce and has a compact and space-saving construction. Production is accomplished in a simple and reliable manner.
193
WO2012069519A2
LED MODULE WITH PREFABRICATED WAVELENGTH CONVERSION ELEMENT
Publication/Patent Number: WO2012069519A2 Publication Date: 2012-05-31 Application Number: 2011070770 Filing Date: 2011-11-23 Inventor: Schrank, Franz   Pachler, Peter   Assignee: SCHRANK, FRANZ   LUMITECH PRODUKTION UND ENTWICKLUNG GMBH   PACHLER, PETER   TRIDONIC JENNERSDORF GMBH   IPC: H01L33/50 Abstract: The invention relates to an LED module
194
WO2012101116A1
PHOTODIODE COMPONENT AND METHOD FOR PRODUCING IT
Publication/Patent Number: WO2012101116A1 Publication Date: 2012-08-02 Application Number: 2012051033 Filing Date: 2012-01-24 Inventor: Schrank, Franz   Teva, Jordi   Assignee: Austriamicrosystems AG   SCHRANK, FRANZ   TEVA, JORDI   IPC: H01L27/146 Abstract: The photodiode component has an electrically conductive cathode layer (3) at a photodiode layer (4) composed of a semiconductor material. Doped anode regions (5) are situated at a top side of the photodiode layer facing away from the cathode layer. A trench (14) subdivides the photodiode layer. A conductor layer (7) is arranged in or at the trench and electrically conductively connects the cathode layer to a cathode connection (11). Anode connections (12) are electrically conductively connected to the anode regions.
195
TWI361501B
Optoelectronic component with adhesion agent
Publication/Patent Number: TWI361501B Publication Date: 2012-04-01 Application Number: 95122606 Filing Date: 2006-06-23 Inventor: Schrank, Franz   Pachler, Peter   Assignee: Tridonic Optoelectronics GmbH   LUMITECH PRODUKTION UND ENTWICKLUNG GMBH   IPC: H01L31/0203 Abstract: SiO2 layers are put to use as adhesion layers in the case of optoelectronic components. There can be produced with silicone rubbers permanent adhesive connections. These materials usually have only an inadequate adhesiveness on materials such as are frequently put to use for optoelectronic components
196
WO2012136849A1
COLOR CONVERSION ELEMENT AND LAMP
Publication/Patent Number: WO2012136849A1 Publication Date: 2012-10-11 Application Number: 2012056463 Filing Date: 2012-04-10 Inventor: Tasch, Stefan   Schrank, Franz   Assignee: Tasch, Stefan   SCHRANK, FRANZ   LUMITECH PRODUKTION UND ENTWICKLUNG GMBH   IPC: H01L33/50 Abstract: The invention relates to a color conversion element (20) for use in an LED bulb or LED lamp
197
DE102009015306B4
Method for manufacturing micro-electro-mechanical system components
Publication/Patent Number: DE102009015306B4 Publication Date: 2012-02-23 Application Number: 102009015306 Filing Date: 2009-03-27 Inventor: Schrank, Franz   Koppitsch, Guenther Dr   Assignee: Austriamicrosystems AG   IPC: B81B1/00 Abstract: The method involves producing a perforated layer (2) on an upper side of a wafer (1) from a semiconductor material
198
DE102008060275B4
Bonded wafer structuring method for manufacturing integrated components
Publication/Patent Number: DE102008060275B4 Publication Date: 2012-10-31 Application Number: 102008060275 Filing Date: 2008-12-03 Inventor: Schrank, Franz   Koppitsch, Guenther Dr   Assignee: Austriamicrosystems AG   IPC: H01L21/306 Abstract: The method involves coating a handling-wafer (1) with a protective layer (2) such that the protective layer covers an edge (4) of the handling-wafer. A device-wafer (5) is bonded on an upper side of the handling-wafer. A mask (8) is applied on an upper side of the device-wafer
199
DE102009036033B4
Interlayer connection for semiconductor wafers
Publication/Patent Number: DE102009036033B4 Publication Date: 2012-11-15 Application Number: 102009036033 Filing Date: 2009-08-04 Inventor: Schrank, Franz   Rohracher, Karl   Assignee: Austriamicrosystems AG   IPC: B81C3/00 Abstract: The interlayer connection has a base wafer (1) with a connection pad (3) and a cover wafer (2) arranged on the base wafer. The cover wafer has a continuous opening (25) over the connection pad. A solder ball (5) is arranged in the opening and is connected with the connection pad in an electrically conductive manner. The solder ball overlaps the cover wafer. An independent claim is also included for a method for manufacturing an interlayer connection for semiconductor wafers.
200
US8110886B2
Photodiode with integrated semiconductor circuit and method for the production thereof
Publication/Patent Number: US8110886B2 Publication Date: 2012-02-07 Application Number: 11/921,834 Filing Date: 2006-05-23 Inventor: Meinhardt, Gerald   Schrank, Franz   Vescoli, Verena   Assignee: austriamicrosystems AG   IPC: H01L27/146 Abstract: A semiconductor circuit in a semiconductor body and a wafer bonding method for connecting the semiconductor circuit to another substrate, in which a diode is realized in a laminar structure. The semiconductor circuit is connected to the terminals of the diode by means of feedthroughs that extend through the semiconductor body.
Total 19 pages