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1 | EP1868239B1 |
Method of manufacturing trenches in a semiconductor body
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Publication/Patent Number: EP1868239B1 | Publication Date: 2020-04-22 | Application Number: 06012076.3 | Filing Date: 2006-06-12 | Inventor： Park, Jong Mun Schrems martin | Assignee: ams AG | IPC: H01L21/762 | ||||
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2 | EP2802004B1 |
Method of structuring a device layer of a recessed semiconductor device and recessed semiconductor device comprising a structured device layer
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Publication/Patent Number: EP2802004B1 | Publication Date: 2020-11-04 | Application Number: 13167088.7 | Filing Date: 2013-05-08 | Inventor： Löffler, Bernhard Schrems martin | Assignee: ams AG | IPC: H01L21/311 | ||||
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3 | EP3024029B1 |
Method of producing a semiconductor device comprising an aperture array
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Publication/Patent Number: EP3024029B1 | Publication Date: 2020-04-22 | Application Number: 14193859.7 | Filing Date: 2014-11-19 | Inventor： Siegert, Jörg Schrank, Franz Schrems martin | Assignee: ams AG | IPC: H01L27/146 | ||||
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4 | EP3660902A1 |
SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY
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Publication/Patent Number: EP3660902A1 | Publication Date: 2020-06-03 | Application Number: 20152454.3 | Filing Date: 2014-11-19 | Inventor： Siegert, Jörg Schrank, Franz Schrems martin | Assignee: AMS AG | IPC: H01L27/146 | Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer. | |||
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5 | EP2908335B1 |
Dicing method
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Publication/Patent Number: EP2908335B1 | Publication Date: 2020-04-15 | Application Number: 14155240.6 | Filing Date: 2014-02-14 | Inventor： Schrank, Franz Schrems martin Stering, Bernhard | Assignee: ams AG | IPC: H01L21/768 | ||||
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6 | US10790234B2 |
Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure
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Publication/Patent Number: US10790234B2 | Publication Date: 2020-09-29 | Application Number: 16/185,283 | Filing Date: 2018-11-09 | Inventor： Gavagnin, Marco Leitgeb, Markus Schrems martin Winkler, Roland Anderson, Steve | Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft | IPC: H01L23/538 | Abstract: A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity. | |||
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7 | EP3471146B1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: EP3471146B1 | Publication Date: 2020-09-09 | Application Number: 17196609.6 | Filing Date: 2017-10-16 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Jörg Schrems martin | Assignee: ams AG | IPC: H01L27/146 | ||||
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8 | US2020313031A1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: US2020313031A1 | Publication Date: 2020-10-01 | Application Number: 16/756,025 | Filing Date: 2018-10-15 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Joerg Schrems martin | Assignee: ams AG | IPC: H01L31/18 | Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided. | |||
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9 | US2019312076A1 |
SYSTEM-ON-CHIP CAMERA WITH INTEGRATED LIGHT SENSOR(S) AND METHOD OF PRODUCING A SYSTEM-ON-CHIP CAMERA
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Publication/Patent Number: US2019312076A1 | Publication Date: 2019-10-10 | Application Number: 16/309,226 | Filing Date: 2017-06-13 | Inventor： Schrems martin Stockmeier, Thomas | Assignee: ams AG | IPC: H01L27/146 | Abstract: The system-on-chip camera comprises a semiconductor body (1) with an integrated circuit (40), a sensor substrate (2), sensor elements (3) arranged in the sensor substrate according to an array of pixels, a light sensor (4) in the sensor substrate apart from the sensor elements, and a lens or an array of lenses (15) on a surface of incidence (30). Filter elements (11, 12, 13), which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence. | |||
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10 | US10217715B2 |
Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device
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Publication/Patent Number: US10217715B2 | Publication Date: 2019-02-26 | Application Number: 15/118,469 | Filing Date: 2015-02-09 | Inventor： Schrems martin Stering, Bernhard Etschmaier, Harald | Assignee: ams AG | IPC: H01L23/00 | Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15′) of the cavity is provided to expose the cavity to the environment. | |||
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11 | US10340254B2 |
Method of producing an interposer-chip-arrangement for dense packaging of chips
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Publication/Patent Number: US10340254B2 | Publication Date: 2019-07-02 | Application Number: 15/726,905 | Filing Date: 2017-10-06 | Inventor： Kraft, Jochen Schrems martin Schrank, Franz | Assignee: ams AG | IPC: H01L21/00 | Abstract: The method of producing an interposer-chip-arrangement, comprises providing an interposer (1) with an integrated circuit (25), arranging a dielectric layer (2) with metal layers embedded in the dielectric layer above a main surface (10) of the interposer, connecting the integrated circuit with at least one of the metal layers, forming an interconnection (7) through the interposer, the interconnection contacting one of the metal layers, arranging a further dielectric layer (3) above a further main surface (11) of the interposer opposite the main surface and arranging a further metal layer in or on the further dielectric layer, the further metal layer being connected with the interconnection, arranging a chip provided with at least one contact pad at the main surface or at the further main surface, and electrically conductively connecting the contact pad with the interconnection. | |||
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12 | US10283541B2 |
Semiconductor device comprising an aperture array and method of producing such a semiconductor device
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Publication/Patent Number: US10283541B2 | Publication Date: 2019-05-07 | Application Number: 15/528,089 | Filing Date: 2015-11-09 | Inventor： Siegert, Joerg Schrank, Franz Schrems martin | Assignee: ams AG | IPC: H01L27/146 | Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer. | |||
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13 | US2019378801A1 |
RF Functionality and Electromagnetic Radiation Shielding in a Component Carrier
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Publication/Patent Number: US2019378801A1 | Publication Date: 2019-12-12 | Application Number: 16/001,831 | Filing Date: 2018-06-06 | Inventor： Leitgeb, Markus Schrems martin Schlaffer, Erich Anderson, Steve | Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | IPC: H01L23/552 | Abstract: A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component. | |||
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14 | EP2881753B1 |
Optical sensor arrangement and method of producing an optical sensor arrangement
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Publication/Patent Number: EP2881753B1 | Publication Date: 2019-03-06 | Application Number: 13199086.3 | Filing Date: 2013-12-20 | Inventor： Schrank, Franz Dierschke, Eugene G. Schrems martin | Assignee: ams AG | IPC: G01S7/481 | ||||
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15 | US10256147B2 |
Dicing method
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Publication/Patent Number: US10256147B2 | Publication Date: 2019-04-09 | Application Number: 15/118,836 | Filing Date: 2015-02-09 | Inventor： Schrems martin Stering, Bernhard Schrank, Franz | Assignee: ams AG | IPC: H01L21/78 | Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned. | |||
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16 | EP3579334A1 |
RF FUNCTIONALITY AND ELECTROMAGNETIC RADIATION SHIELDING IN A COMPONENT CARRIER
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Publication/Patent Number: EP3579334A1 | Publication Date: 2019-12-11 | Application Number: 19177885.1 | Filing Date: 2019-06-03 | Inventor： Leitgeb, Markus Schrems martin Schlaffer, Erich Anderson, Steve | Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | IPC: H01Q1/22 | Abstract: A component carrier (100) comprising i) an electronic component (110) embedded in the component carrier (100), ii) an antenna structure (120) arranged at a region of a first main surface (102) of the component carrier (100), iii) a shielding structure (130) made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure (120) and the electronic component (110). Hereby, the shielding structure (130) is arranged at least partially between the antenna structure (120) and the electronic component (110). Furthermore, the component carrier (100) comprises an electrically conductive structure (150) to electrically connect the electronic component (110) and the antenna structure (120) through the shielding structure (130). The shielding structure (130) is non-perforated at least in a plane (P) between the antenna structure (120) and the electronic component (110). | |||
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17 | EP2881983B1 |
Interposer-chip-arrangement for dense packaging of chips
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Publication/Patent Number: EP2881983B1 | Publication Date: 2019-09-18 | Application Number: 13198854.5 | Filing Date: 2013-12-20 | Inventor： Kraft, Jochen Schrank, Franz Schrems martin | Assignee: ams AG | IPC: H01L21/60 | ||||
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18 | US2019237500A1 |
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
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Publication/Patent Number: US2019237500A1 | Publication Date: 2019-08-01 | Application Number: 16/312,145 | Filing Date: 2017-06-02 | Inventor： Manninger, Mario Bodner, Thomas Toschkoff, Gregor Schrems martin Enichlmair, Hubert | Assignee: ams AG | IPC: H01L27/146 | Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer. | |||
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19 | EP3483921A1 |
EMBEDDING KNOWN-GOOD COMPONENT IN KNOWN-GOOD CAVITY OF KNOWN-GOOD COMPONENT CARRIER MATERIAL WITH PRE-FORMED ELECTRIC CONNECTION STRUCTURE
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Publication/Patent Number: EP3483921A1 | Publication Date: 2019-05-15 | Application Number: 17201225.4 | Filing Date: 2017-11-11 | Inventor： Gavagnin, Marco Leitgeb, Markus Schrems martin Winkler, Roland Anderson, Steve | Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | IPC: H01L21/66 | Abstract: A method of manufacturing a component carrier (100), wherein the method comprises providing a known-good layer stack (102) comprising an already formed electrically conductive connection structure (104) and a known-good cavity (106), and mounting a known-good component (108) on the already formed electrically conductive connection structure (104) in the cavity (106). | |||
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20 | US2019148304A1 |
Embedding Known-Good Component in Known-Good Cavity of Known-Good Component Carrier Material With Pre-formed Electric Connection Structure
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Publication/Patent Number: US2019148304A1 | Publication Date: 2019-05-16 | Application Number: 16/185,283 | Filing Date: 2018-11-09 | Inventor： Gavagnin, Marco Leitgeb, Markus Schrems martin Winkler, Roland Anderson, Steve | Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft | IPC: H01L23/538 | Abstract: A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity. |
3.Current Quota