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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
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1
US2020346342A1
Exoskeleton System, Control Device, and Method
Publication/Patent Number: US2020346342A1 Publication Date: 2020-11-05 Application Number: 16/870,962 Filing Date: 2020-05-09 Inventor: Siegert, Joerg   Schneider, Urs   Assignee: Universitaet Stuttgart   IPC: B25J9/00 Abstract: An exoskeleton system includes a first exoskeleton unit configured to support a first body part, a second exoskeleton unit configured to support a second body part, and a control device. The first exoskeleton unit and the second exoskeleton unit are mechanically decoupled from each other. The control device is configured to control, based on a control model, at least one of the first exoskeleton unit and the second exoskeleton unit. The control model is based on a multibody system that models the first exoskeleton unit, the second exoskeleton unit, and at least one of the first body part and the second body part.
2
US10684412B2
Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device
Publication/Patent Number: US10684412B2 Publication Date: 2020-06-16 Application Number: 15/757,645 Filing Date: 2016-08-25 Inventor: Kraft, Jochen   Siegert, Joerg   Assignee: ams AG   IPC: G02B6/12 Abstract: A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers.
3
EP3678821A1
EXOSKELETON SYSTEM, CONTROL DEVICE AND METHOD
Publication/Patent Number: EP3678821A1 Publication Date: 2020-07-15 Application Number: 18803902.8 Filing Date: 2018-11-08 Inventor: Siegert, Joerg   Schneider, Urs   Assignee: Universität Stuttgart   IPC: B25J9/00
4
US10644047B2
Optoelectronic device with a refractive element and a method of producing such an optoelectronic device
Publication/Patent Number: US10644047B2 Publication Date: 2020-05-05 Application Number: 16/069,802 Filing Date: 2016-12-15 Inventor: Hofrichter, Jens   Schrank, Franz   Siegert, Joerg   Assignee: ams AG   IPC: H01L27/146 Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element.
5
US2020313031A1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: US2020313031A1 Publication Date: 2020-10-01 Application Number: 16/756,025 Filing Date: 2018-10-15 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Labodi, Miklos   Siegert, Joerg   Schrems, Martin   Assignee: ams AG   IPC: H01L31/18 Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.
6
EP3682210A1
CAPACITIVE PRESSURE SENSORS AND OTHER DEVICES HAVING A SUSPENDED MEMBRANE AND HAVING ROUNDED CORNERS AT AN ANCHOR EDGE
Publication/Patent Number: EP3682210A1 Publication Date: 2020-07-22 Application Number: 18803980.4 Filing Date: 2018-11-16 Inventor: Besling, Willem Frederik Adrianus   Van, Der Avoort Cas   Pijnenburg, Remco Henricus Wilhelmus   Wunnicke, Olaf   Siegert, Joerg   Faes, Alessandro   Assignee: Sciosense B.V.   IPC: G01L9/00
7
US2019025505A1
SEMICONDUCTOR DEVICE WITH PHOTONIC AND ELECTRONIC FUNCTIONALITY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication/Patent Number: US2019025505A1 Publication Date: 2019-01-24 Application Number: 15/757,645 Filing Date: 2016-08-25 Inventor: Kraft, Jochen   Siegert, Joerg   Assignee: ams AG   IPC: G02B6/12 Abstract: A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers.
8
US201925505A1
SEMICONDUCTOR DEVICE WITH PHOTONIC AND ELECTRONIC FUNCTIONALITY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication/Patent Number: US201925505A1 Publication Date: 2019-01-24 Application Number: 20/161,575 Filing Date: 2016-08-25 Inventor: Siegert, Joerg   Kraft, Jochen   Assignee: ams AG   IPC: H01L23/522 Abstract: A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers.
9
WO2019092088A1
EXOSKELETON SYSTEM, CONTROL DEVICE AND METHOD
Publication/Patent Number: WO2019092088A1 Publication Date: 2019-05-16 Application Number: 2018080578 Filing Date: 2018-11-08 Inventor: Schneider, Urs   Siegert, Joerg   Assignee: Universitaet Stuttgart   IPC: B25J9/00 Abstract: The invention relates to an exoskeleton system (1) comprising: a first exoskeleton unit (11) for supporting a first body part (21); a second exoskeleton unit (12) for supporting a second body part (22); and a control device (30); wherein the control device is designed to actuate the first exoskeleton unit (11) and/or the second exoskeleton unit (12) based on a control model (31), wherein the control model is based on a multi-body system (32) which models the first exoskeleton unit (11), the second exoskeleton unit (12) and the first and/or second body part (21, 22), and wherein the first exoskeleton unit (11) and the second exoskeleton unit (12) are mechanically decoupled from one another. The invention also relates to a control device (30) and a corresponding method (100) for actuating a first and/or second exoskeleton unit (11, 12).
10
US10283541B2
Semiconductor device comprising an aperture array and method of producing such a semiconductor device
Publication/Patent Number: US10283541B2 Publication Date: 2019-05-07 Application Number: 15/528,089 Filing Date: 2015-11-09 Inventor: Siegert, Joerg   Schrank, Franz   Schrems, Martin   Assignee: ams AG   IPC: H01L27/146 Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer.
11
US10332931B2
Semiconductor device for wafer-scale integration
Publication/Patent Number: US10332931B2 Publication Date: 2019-06-25 Application Number: 15/455,055 Filing Date: 2017-03-09 Inventor: Cassidy, Cathal   Siegert, Joerg   Schrank, Franz   Assignee: ams AG   IPC: H01L27/146 Abstract: The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer.
12
US201935835A1
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF PRODUCING SUCH AN OPTOELECTRONIC DEVICE
Publication/Patent Number: US201935835A1 Publication Date: 2019-01-31 Application Number: 20/161,606 Filing Date: 2016-12-15 Inventor: Schrank, Franz   Hofrichter, Jens   Siegert, Joerg   Assignee: ams AG   IPC: H01L31/0232 Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element.
13
US2019035835A1
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF PRODUCING SUCH AN OPTOELECTRONIC DEVICE
Publication/Patent Number: US2019035835A1 Publication Date: 2019-01-31 Application Number: 16/069,802 Filing Date: 2016-12-15 Inventor: Hofrichter, Jens   Schrank, Franz   Siegert, Joerg   Assignee: ams AG   IPC: H01L27/146 Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element.
14
US2019265119A1
PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE
Publication/Patent Number: US2019265119A1 Publication Date: 2019-08-29 Application Number: 16/333,671 Filing Date: 2017-10-02 Inventor: Siegert, Joerg   Besling, Willem Frederik Adrianus   Tak, Coenraad Cornelis   Schrems, Martin   Schrank, Franz   Assignee: ams International AG   IPC: G01L19/14 Abstract: A pressure sensor device comprises a substrate body, a pressure sensor comprising a membrane, and a cap body comprising at least one opening. The pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to the main plane of extension of the substrate body, and the mass of the substrate body equals approximately the mass of the cap body. Furthermore, a method for forming a pressure sensor device is provided.
15
WO2019096995A1
CAPACITIVE PRESSURE SENSORS AND OTHER DEVICES HAVING A SUSPENDED MEMBRANE AND HAVING ROUNDED CORNERS AT AN ANCHOR EDGE
Publication/Patent Number: WO2019096995A1 Publication Date: 2019-05-23 Application Number: 2018081562 Filing Date: 2018-11-16 Inventor: Besling, Willem Frederik Adrianus   Wunnicke, Olaf   Pijnenburg, Remco Henricus Wilhelmus   Van, Der Avoort Cas   Siegert, Joerg   Faes, Alessandro   Assignee: AMS INTERNATIONAL AG   IPC: G01L19/00 Abstract: A semiconductor device includes an integrated circuit, and a capacitive pressure sensor disposed over and electrically connected to the integrated circuit. The capacitive pressure sensor includes a first electrode, a cavity over the first electrode, and a second electrode including a suspended membrane over the cavity. The second electrode further includes electrically conductive anchor trenches laterally surrounding the cavity. The anchor trenches include an inner anchor trench and an outer anchor trench, wherein the outer anchor trench has rounded corners.
16
US9929035B2
Method of producing a removable wafer connection and carrier for wafer support
Publication/Patent Number: US9929035B2 Publication Date: 2018-03-27 Application Number: 14/654,471 Filing Date: 2013-12-19 Inventor: Bodner, Thomas   Siegert, Joerg   Schrems, Martin   Assignee: ams AG   IPC: H01L21/683 Abstract: A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the center of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.
17
US2018090393A1
METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
Publication/Patent Number: US2018090393A1 Publication Date: 2018-03-29 Application Number: 15/826,480 Filing Date: 2017-11-29 Inventor: Siegert, Joerg   Bodner, Thomas   Gehles, Helene   Assignee: ams AG   IPC: G01N21/88 Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
18
US9991177B2
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
Publication/Patent Number: US9991177B2 Publication Date: 2018-06-05 Application Number: 15/826,480 Filing Date: 2017-11-29 Inventor: Gehles, Helene   Bodner, Thomas   Siegert, Joerg   Assignee: ams AG   IPC: H01L21/00 Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
19
US2017133281A1
METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
Publication/Patent Number: US2017133281A1 Publication Date: 2017-05-11 Application Number: 15/343,117 Filing Date: 2016-11-03 Inventor: Richter, Helene   Bodner, Thomas   Siegert, Joerg   Assignee: ams AG   IPC: H01L21/66 Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
20
US2017179183A1
SEMICONDUCTOR DEVICE FOR WAFER-SCALE INTEGRATION
Publication/Patent Number: US2017179183A1 Publication Date: 2017-06-22 Application Number: 15/455,055 Filing Date: 2017-03-09 Inventor: Cassidy, Cathal   Siegert, Joerg   Schrank, Franz   Assignee: ams AG   IPC: H01L27/146 Abstract: The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer.
Total 3 pages