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1 | US2020346342A1 |
Exoskeleton System, Control Device, and Method
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Publication/Patent Number: US2020346342A1 | Publication Date: 2020-11-05 | Application Number: 16/870,962 | Filing Date: 2020-05-09 | Inventor： Siegert, Joerg Schneider, Urs | Assignee: Universitaet Stuttgart | IPC: B25J9/00 | Abstract: An exoskeleton system includes a first exoskeleton unit configured to support a first body part, a second exoskeleton unit configured to support a second body part, and a control device. The first exoskeleton unit and the second exoskeleton unit are mechanically decoupled from each other. The control device is configured to control, based on a control model, at least one of the first exoskeleton unit and the second exoskeleton unit. The control model is based on a multibody system that models the first exoskeleton unit, the second exoskeleton unit, and at least one of the first body part and the second body part. | |||
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2 | US10684412B2 |
Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device
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Publication/Patent Number: US10684412B2 | Publication Date: 2020-06-16 | Application Number: 15/757,645 | Filing Date: 2016-08-25 | Inventor： Kraft, Jochen Siegert, Joerg | Assignee: ams AG | IPC: G02B6/12 | Abstract: A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers. | |||
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3 | EP3678821A1 |
EXOSKELETON SYSTEM, CONTROL DEVICE AND METHOD
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Publication/Patent Number: EP3678821A1 | Publication Date: 2020-07-15 | Application Number: 18803902.8 | Filing Date: 2018-11-08 | Inventor： Siegert, Joerg Schneider, Urs | Assignee: Universität Stuttgart | IPC: B25J9/00 | ||||
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4 | US10644047B2 |
Optoelectronic device with a refractive element and a method of producing such an optoelectronic device
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Publication/Patent Number: US10644047B2 | Publication Date: 2020-05-05 | Application Number: 16/069,802 | Filing Date: 2016-12-15 | Inventor： Hofrichter, Jens Schrank, Franz Siegert, Joerg | Assignee: ams AG | IPC: H01L27/146 | Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element. | |||
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5 | US2020313031A1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: US2020313031A1 | Publication Date: 2020-10-01 | Application Number: 16/756,025 | Filing Date: 2018-10-15 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Joerg Schrems, Martin | Assignee: ams AG | IPC: H01L31/18 | Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided. | |||
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6 | EP3682210A1 |
CAPACITIVE PRESSURE SENSORS AND OTHER DEVICES HAVING A SUSPENDED MEMBRANE AND HAVING ROUNDED CORNERS AT AN ANCHOR EDGE
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Publication/Patent Number: EP3682210A1 | Publication Date: 2020-07-22 | Application Number: 18803980.4 | Filing Date: 2018-11-16 | Inventor： Besling, Willem Frederik Adrianus Van, Der Avoort Cas Pijnenburg, Remco Henricus Wilhelmus Wunnicke, Olaf Siegert, Joerg Faes, Alessandro | Assignee: Sciosense B.V. | IPC: G01L9/00 | ||||
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7 | US2019025505A1 |
SEMICONDUCTOR DEVICE WITH PHOTONIC AND ELECTRONIC FUNCTIONALITY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
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Publication/Patent Number: US2019025505A1 | Publication Date: 2019-01-24 | Application Number: 15/757,645 | Filing Date: 2016-08-25 | Inventor： Kraft, Jochen Siegert, Joerg | Assignee: ams AG | IPC: G02B6/12 | Abstract: A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers. | |||
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8 | US201925505A1 |
SEMICONDUCTOR DEVICE WITH PHOTONIC AND ELECTRONIC FUNCTIONALITY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
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Publication/Patent Number: US201925505A1 | Publication Date: 2019-01-24 | Application Number: 20/161,575 | Filing Date: 2016-08-25 | Inventor： Siegert, Joerg Kraft, Jochen | Assignee: ams AG | IPC: H01L23/522 | Abstract: A semiconductor device has a semiconductor substrate and a first metallization stack arranged on the substrate. The substrate has and/or carries a plurality of electronic circuit elements. The first metallization stack has electrically insulating layers and at least one metallization layer. The semiconductor device further has a second metallization stack arranged on the first metallization stack and comprising further electrically insulating layers and an optical waveguide layer. The optical waveguide layer has at least one optical waveguide structure. Furthermore, one of the electrically insulating layers and one of the further electrically insulating layers are in direct contact with each other and form a pair of directly bonded layers. | |||
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9 | WO2019092088A1 |
EXOSKELETON SYSTEM, CONTROL DEVICE AND METHOD
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Publication/Patent Number: WO2019092088A1 | Publication Date: 2019-05-16 | Application Number: 2018080578 | Filing Date: 2018-11-08 | Inventor： Schneider, Urs Siegert, Joerg | Assignee: Universitaet Stuttgart | IPC: B25J9/00 | Abstract: The invention relates to an exoskeleton system (1) comprising: a first exoskeleton unit (11) for supporting a first body part (21); a second exoskeleton unit (12) for supporting a second body part (22); and a control device (30); wherein the control device is designed to actuate the first exoskeleton unit (11) and/or the second exoskeleton unit (12) based on a control model (31), wherein the control model is based on a multi-body system (32) which models the first exoskeleton unit (11), the second exoskeleton unit (12) and the first and/or second body part (21, 22), and wherein the first exoskeleton unit (11) and the second exoskeleton unit (12) are mechanically decoupled from one another. The invention also relates to a control device (30) and a corresponding method (100) for actuating a first and/or second exoskeleton unit (11, 12). | |||
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10 | US10283541B2 |
Semiconductor device comprising an aperture array and method of producing such a semiconductor device
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Publication/Patent Number: US10283541B2 | Publication Date: 2019-05-07 | Application Number: 15/528,089 | Filing Date: 2015-11-09 | Inventor： Siegert, Joerg Schrank, Franz Schrems, Martin | Assignee: ams AG | IPC: H01L27/146 | Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer. | |||
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11 | US10332931B2 |
Semiconductor device for wafer-scale integration
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Publication/Patent Number: US10332931B2 | Publication Date: 2019-06-25 | Application Number: 15/455,055 | Filing Date: 2017-03-09 | Inventor： Cassidy, Cathal Siegert, Joerg Schrank, Franz | Assignee: ams AG | IPC: H01L27/146 | Abstract: The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer. | |||
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12 | US201935835A1 |
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF PRODUCING SUCH AN OPTOELECTRONIC DEVICE
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Publication/Patent Number: US201935835A1 | Publication Date: 2019-01-31 | Application Number: 20/161,606 | Filing Date: 2016-12-15 | Inventor： Schrank, Franz Hofrichter, Jens Siegert, Joerg | Assignee: ams AG | IPC: H01L31/0232 | Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element. | |||
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13 | US2019035835A1 |
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF PRODUCING SUCH AN OPTOELECTRONIC DEVICE
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Publication/Patent Number: US2019035835A1 | Publication Date: 2019-01-31 | Application Number: 16/069,802 | Filing Date: 2016-12-15 | Inventor： Hofrichter, Jens Schrank, Franz Siegert, Joerg | Assignee: ams AG | IPC: H01L27/146 | Abstract: A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element. | |||
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14 | US2019265119A1 |
PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE
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Publication/Patent Number: US2019265119A1 | Publication Date: 2019-08-29 | Application Number: 16/333,671 | Filing Date: 2017-10-02 | Inventor： Siegert, Joerg Besling, Willem Frederik Adrianus Tak, Coenraad Cornelis Schrems, Martin Schrank, Franz | Assignee: ams International AG | IPC: G01L19/14 | Abstract: A pressure sensor device comprises a substrate body, a pressure sensor comprising a membrane, and a cap body comprising at least one opening. The pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to the main plane of extension of the substrate body, and the mass of the substrate body equals approximately the mass of the cap body. Furthermore, a method for forming a pressure sensor device is provided. | |||
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15 | WO2019096995A1 |
CAPACITIVE PRESSURE SENSORS AND OTHER DEVICES HAVING A SUSPENDED MEMBRANE AND HAVING ROUNDED CORNERS AT AN ANCHOR EDGE
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Publication/Patent Number: WO2019096995A1 | Publication Date: 2019-05-23 | Application Number: 2018081562 | Filing Date: 2018-11-16 | Inventor： Besling, Willem Frederik Adrianus Wunnicke, Olaf Pijnenburg, Remco Henricus Wilhelmus Van, Der Avoort Cas Siegert, Joerg Faes, Alessandro | Assignee: AMS INTERNATIONAL AG | IPC: G01L19/00 | Abstract: A semiconductor device includes an integrated circuit, and a capacitive pressure sensor disposed over and electrically connected to the integrated circuit. The capacitive pressure sensor includes a first electrode, a cavity over the first electrode, and a second electrode including a suspended membrane over the cavity. The second electrode further includes electrically conductive anchor trenches laterally surrounding the cavity. The anchor trenches include an inner anchor trench and an outer anchor trench, wherein the outer anchor trench has rounded corners. | |||
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16 | US9929035B2 |
Method of producing a removable wafer connection and carrier for wafer support
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Publication/Patent Number: US9929035B2 | Publication Date: 2018-03-27 | Application Number: 14/654,471 | Filing Date: 2013-12-19 | Inventor： Bodner, Thomas Siegert, Joerg Schrems, Martin | Assignee: ams AG | IPC: H01L21/683 | Abstract: A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the center of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier. | |||
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17 | US2018090393A1 |
METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
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Publication/Patent Number: US2018090393A1 | Publication Date: 2018-03-29 | Application Number: 15/826,480 | Filing Date: 2017-11-29 | Inventor： Siegert, Joerg Bodner, Thomas Gehles, Helene | Assignee: ams AG | IPC: G01N21/88 | Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy. | |||
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18 | US9991177B2 |
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
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Publication/Patent Number: US9991177B2 | Publication Date: 2018-06-05 | Application Number: 15/826,480 | Filing Date: 2017-11-29 | Inventor： Gehles, Helene Bodner, Thomas Siegert, Joerg | Assignee: ams AG | IPC: H01L21/00 | Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy. | |||
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19 | US2017133281A1 |
METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
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Publication/Patent Number: US2017133281A1 | Publication Date: 2017-05-11 | Application Number: 15/343,117 | Filing Date: 2016-11-03 | Inventor： Richter, Helene Bodner, Thomas Siegert, Joerg | Assignee: ams AG | IPC: H01L21/66 | Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy. | |||
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20 | US2017179183A1 |
SEMICONDUCTOR DEVICE FOR WAFER-SCALE INTEGRATION
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Publication/Patent Number: US2017179183A1 | Publication Date: 2017-06-22 | Application Number: 15/455,055 | Filing Date: 2017-03-09 | Inventor： Cassidy, Cathal Siegert, Joerg Schrank, Franz | Assignee: ams AG | IPC: H01L27/146 | Abstract: The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer. |
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