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1 | EP2908335B1 |
Dicing method
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Publication/Patent Number: EP2908335B1 | Publication Date: 2020-04-15 | Application Number: 14155240.6 | Filing Date: 2014-02-14 | Inventor： Schrank, Franz Schrems, Martin Stering, Bernhard | Assignee: ams AG | IPC: H01L21/768 | ||||
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2 | EP2950338B1 |
Dicing method for wafer-level packaging
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Publication/Patent Number: EP2950338B1 | Publication Date: 2019-04-24 | Application Number: 14170380.1 | Filing Date: 2014-05-28 | Inventor： Stering, Bernhard | Assignee: ams AG | IPC: H01L21/78 | ||||
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3 | US10217715B2 |
Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device
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Publication/Patent Number: US10217715B2 | Publication Date: 2019-02-26 | Application Number: 15/118,469 | Filing Date: 2015-02-09 | Inventor： Schrems, Martin Stering, Bernhard Etschmaier, Harald | Assignee: ams AG | IPC: H01L23/00 | Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15′) of the cavity is provided to expose the cavity to the environment. | |||
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4 | US2019267424A1 |
Method for Manufacturing Optical Sensor Arrangements And Housing For An Optical Sensor
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Publication/Patent Number: US2019267424A1 | Publication Date: 2019-08-29 | Application Number: 16/346,273 | Filing Date: 2017-10-19 | Inventor： Koenig, Sonja Stering, Bernhard Etschmaier, Harald | Assignee: ams AG | IPC: H01L27/146 | Abstract: A method for manufacturing optical sensor arrangements is provided. The method comprises providing at least two optical sensors on a carrier and providing a cover material on the side of the optical sensors facing away from the carrier. The method further comprises providing an aperture for each optical sensor on a top side of the cover material facing away from the carrier and forming at least one trench between the optical sensors from the carrier towards the top side of the cover material, the trench comprising inner walls. Moreover, the method comprises coating the inner walls with an opaque material, such that an inner volume of the trench is free of the opaque material, and singulating of the optical sensor arrangements along the at least one trench. Furthermore, a housing for an optical sensor is provided. | |||
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5 | TWI666783B |
Method for manufacturing optical sensor arrangements and housing for an optical sensor
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Publication/Patent Number: TWI666783B | Publication Date: 2019-07-21 | Application Number: 106137579 | Filing Date: 2017-10-31 | Inventor： Stering, Bernhard Etschmaier, Harald Koenig, Sonja | Assignee: AMS AG | IPC: H05K5/06 | Abstract: A method for manufacturing optical sensor arrangements (10) is provided. The method comprises providing at least two optical sensors (11) on a carrier (12) and providing a cover material (14) on the side of the optical sensors (11) facing away from the carrier (12). The method further comprises providing an aperture (13) for each optical sensor (11) on a top side (15) of the cover material (14) facing away from the carrier (12) and forming at least one trench (16) between the optical sensors (11) from the carrier (12) towards the top side (15) of the cover material (14), the trench (16) comprising inner walls (18). Moreover, the method comprises coating the inner walls (18) with an opaque material (19), such that an inner volume (20) of the trench (16) is free of the opaque material (19), and singulating of the optical sensor arrangements (10) along the at least one trench (16). Furthermore, a housing for an optical sensor is provided. | |||
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6 | US10256147B2 |
Dicing method
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Publication/Patent Number: US10256147B2 | Publication Date: 2019-04-09 | Application Number: 15/118,836 | Filing Date: 2015-02-09 | Inventor： Schrems, Martin Stering, Bernhard Schrank, Franz | Assignee: ams AG | IPC: H01L21/78 | Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned. | |||
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7 | US9917012B2 |
Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging
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Publication/Patent Number: US9917012B2 | Publication Date: 2018-03-13 | Application Number: 15/313,489 | Filing Date: 2015-05-21 | Inventor： Stering, Bernhard | Assignee: ams AG | IPC: H01L23/00 | Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. The polyimide layer (8) is severed in sections (18) above the trenches (7) when the tape layer (14) is removed. The semiconductor chip is provided with a cover layer (11) laterally confining the polyimide layer (8) near the trenches (7), in particular for forming breaking delimitations (9). | |||
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8 | US9961777B2 |
Method for cutting a carrier for electrical components
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Publication/Patent Number: US9961777B2 | Publication Date: 2018-05-01 | Application Number: 14/112,233 | Filing Date: 2012-04-17 | Inventor： Stering, Bernhard | Assignee: ams AG | IPC: H01L21/56 | Abstract: A trench (20) is introduced into a carrier (10) for electrical components (30) on a first surface (O10a) of the carrier into the material of the carrier (10). The carrier (10) is cut through by a cut (60) being introduced into the material of the carrier from a second surface (O10b) of the carrier (10), said second surface being situated opposite the first surface. The cut is implemented in such a way that the cut (60) runs through the trench (20) on the first surface (O10a) of the carrier. By providing a trench (20) in the material layers of the carrier (10) which are near the surface, it is possible to prevent material from breaking out of the carrier during the singulation of devices (1, 2). | |||
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9 | TW201820645A |
Method for manufacturing optical sensor arrangements and housing for an optical sensor
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Publication/Patent Number: TW201820645A | Publication Date: 2018-06-01 | Application Number: 106137579 | Filing Date: 2017-10-31 | Inventor： Stering, Bernhard Etschmaier, Harald Koenig, Sonja | Assignee: AMS AG | IPC: H01L31/0236 | Abstract: A method for manufacturing optical sensor arrangements (10) is provided. The method comprises providing at least two optical sensors (11) on a carrier (12) and providing a cover material (14) on the side of the optical sensors (11) facing away from the carrier (12). The method further comprises providing an aperture (13) for each optical sensor (11) on a top side (15) of the cover material (14) facing away from the carrier (12) and forming at least one trench (16) between the optical sensors (11) from the carrier (12) towards the top side (15) of the cover material (14), the trench (16) comprising inner walls (18). Moreover, the method comprises coating the inner walls (18) with an opaque material (19), such that an inner volume (20) of the trench (16) is free of the opaque material (19), and singulating of the optical sensor arrangements (10) along the at least one trench (16). Furthermore, a housing for an optical sensor is provided. | |||
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10 | EP2955759B1 |
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
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Publication/Patent Number: EP2955759B1 | Publication Date: 2018-09-05 | Application Number: 14171940.1 | Filing Date: 2014-06-11 | Inventor： Minixhofer, Rainer Stering, Bernhard Etschmaier, Harald | Assignee: ams AG | IPC: H01L31/0203 | ||||
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11 | EP3319125A1 |
METHOD FOR MANUFACTURING OPTICAL SENSOR ARRANGEMENTS AND HOUSING FOR AN OPTICAL SENSOR
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Publication/Patent Number: EP3319125A1 | Publication Date: 2018-05-09 | Application Number: 16197039.7 | Filing Date: 2016-11-03 | Inventor： König, Sonja Stering, Bernhard Etschmaier, Harald | Assignee: ams AG | IPC: H01L27/146 | Abstract: A method for manufacturing optical sensor arrangements (10) is provided. The method comprises providing at least two optical sensors (11) on a carrier (12) and providing a cover material (14) on the side of the optical sensors (11) facing away from the carrier (12). The method further comprises providing an aperture (13) for each optical sensor (11) on a top side (15) of the cover material (14) facing away from the carrier (12) and forming at least one trench (16) between the optical sensors (11) from the carrier (12) towards the top side (15) of the cover material (14), the trench (16) comprising inner walls (18). Moreover, the method comprises coating the inner walls (18) with an opaque material (19), such that an inner volume (20) of the trench (16) is free of the opaque material (19), and singulating of the optical sensor arrangements (10) along the at least one trench (16). Furthermore, a housing for an optical sensor is provided. | |||
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12 | US2017200647A1 |
DICING METHOD FOR WAFER-LEVEL PACKAGING AND SEMICONDUCTOR CHIP WITH DICING STRUCTURE ADAPTED FOR WAFER-LEVEL PACKAGING
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Publication/Patent Number: US2017200647A1 | Publication Date: 2017-07-13 | Application Number: 15/313,489 | Filing Date: 2015-05-21 | Inventor： Stering, Bernhard | Assignee: ams AG | IPC: H01L21/78 | Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. The polyimide layer (8) is severed in sections (18) above the trenches (7) when the tape layer (14) is removed. The semiconductor chip is provided with a cover layer (11) laterally confining the polyimide layer (8) near the trenches (7), in particular for forming breaking delimitations (9). | |||
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13 | US9842946B2 |
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
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Publication/Patent Number: US9842946B2 | Publication Date: 2017-12-12 | Application Number: 15/317,641 | Filing Date: 2015-05-22 | Inventor： Minixhofer, Rainer Stering, Bernhard Etschmaier, Harald | Assignee: AMS AG | IPC: H01L31/02 | Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2). | |||
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14 | US2017179056A1 |
SEMICONDUCTOR DEVICE WITH A BUMP CONTACT ON A TSV COMPRISING A CAVITY AND METHOD OF PRODUCING SUCH A SEMICONDUCTOR DEVICE
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Publication/Patent Number: US2017179056A1 | Publication Date: 2017-06-22 | Application Number: 15/118,469 | Filing Date: 2015-02-09 | Inventor： Schrems, Martin Stering, Bernhard Etschmaier, Harald | Assignee: Ams AG | IPC: H01L23/00 | Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15′) of the cavity is provided to expose the cavity to the environment. | |||
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15 | US2017062277A1 |
DICING METHOD
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Publication/Patent Number: US2017062277A1 | Publication Date: 2017-03-02 | Application Number: 15/118,836 | Filing Date: 2015-02-09 | Inventor： Schrems, Martin Stering, Bernhard Schrank, Franz | Assignee: ams AG | IPC: H01L21/78 | Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned. | |||
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16 | US2017125613A1 |
SEMICONDUCTOR DEVICE COMPRISING AN EMITTER OF RADIATION AND A PHOTOSENSOR AND APPERTAINING PRODUCTION METHOD
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Publication/Patent Number: US2017125613A1 | Publication Date: 2017-05-04 | Application Number: 15/317,641 | Filing Date: 2015-05-22 | Inventor： Minixhofer, Rainer Stering, Bernhard Etschmaier, Harald | Assignee: ams AG | IPC: H01L31/0216 | Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2). | |||
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17 | EP2950338A1 |
Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging
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Publication/Patent Number: EP2950338A1 | Publication Date: 2015-12-02 | Application Number: 14170380.1 | Filing Date: 2014-05-28 | Inventor： Stering, Bernhard | Assignee: ams AG | IPC: H01L23/31 | Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. The polyimide layer (8) is severed in sections (18) above the trenches (7) when the tape layer (14) is removed. The semiconductor chip is provided with a cover layer (11) laterally confining the polyimide layer (8) near the trenches (7), in particular for forming breaking delimitations (9). | |||
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18 | WO2015181050A1 |
DICING METHOD FOR WAFER-LEVEL PACKAGING AND SEMICONDUCTOR CHIP WITH DICING STRUCTURE ADAPTED FOR WAFER-LEVEL PACKAGING
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Publication/Patent Number: WO2015181050A1 | Publication Date: 2015-12-03 | Application Number: 2015061302 | Filing Date: 2015-05-21 | Inventor： Stering, Bernhard | Assignee: AMS AG | IPC: H01L21/56 | Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits | |||
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19 | EP2955759A1 |
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
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Publication/Patent Number: EP2955759A1 | Publication Date: 2015-12-16 | Application Number: 14171940.1 | Filing Date: 2014-06-11 | Inventor： Minixhofer, Rainer Etschmaier, Harald Stering, Bernhard | Assignee: ams AG | IPC: H01L27/146 | Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2). | |||
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20 | EP2908335A1 |
Dicing method
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Publication/Patent Number: EP2908335A1 | Publication Date: 2015-08-19 | Application Number: 14155240.6 | Filing Date: 2014-02-14 | Inventor： Schrank, Franz Schrems, Martin Stering, Bernhard | Assignee: ams AG | IPC: H01L21/768 | Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned. |
3.Current Quota