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No. Publication Number Title Publication/Patent Number Publication/Patent Number Publication Date Publication Date
Application Number Application Number Filing Date Filing Date
Inventor Inventor Assignee Assignee IPC IPC
1
EP2908335B1
Dicing method
Publication/Patent Number: EP2908335B1 Publication Date: 2020-04-15 Application Number: 14155240.6 Filing Date: 2014-02-14 Inventor: Schrank, Franz   Schrems, Martin   Stering, Bernhard   Assignee: ams AG   IPC: H01L21/768
2
EP2950338B1
Dicing method for wafer-level packaging
Publication/Patent Number: EP2950338B1 Publication Date: 2019-04-24 Application Number: 14170380.1 Filing Date: 2014-05-28 Inventor: Stering, Bernhard   Assignee: ams AG   IPC: H01L21/78
3
US10217715B2
Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device
Publication/Patent Number: US10217715B2 Publication Date: 2019-02-26 Application Number: 15/118,469 Filing Date: 2015-02-09 Inventor: Schrems, Martin   Stering, Bernhard   Etschmaier, Harald   Assignee: ams AG   IPC: H01L23/00 Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15′) of the cavity is provided to expose the cavity to the environment.
4
US2019267424A1
Method for Manufacturing Optical Sensor Arrangements And Housing For An Optical Sensor
Publication/Patent Number: US2019267424A1 Publication Date: 2019-08-29 Application Number: 16/346,273 Filing Date: 2017-10-19 Inventor: Koenig, Sonja   Stering, Bernhard   Etschmaier, Harald   Assignee: ams AG   IPC: H01L27/146 Abstract: A method for manufacturing optical sensor arrangements is provided. The method comprises providing at least two optical sensors on a carrier and providing a cover material on the side of the optical sensors facing away from the carrier. The method further comprises providing an aperture for each optical sensor on a top side of the cover material facing away from the carrier and forming at least one trench between the optical sensors from the carrier towards the top side of the cover material, the trench comprising inner walls. Moreover, the method comprises coating the inner walls with an opaque material, such that an inner volume of the trench is free of the opaque material, and singulating of the optical sensor arrangements along the at least one trench. Furthermore, a housing for an optical sensor is provided.
5
TWI666783B
Method for manufacturing optical sensor arrangements and housing for an optical sensor
Publication/Patent Number: TWI666783B Publication Date: 2019-07-21 Application Number: 106137579 Filing Date: 2017-10-31 Inventor: Stering, Bernhard   Etschmaier, Harald   Koenig, Sonja   Assignee: AMS AG   IPC: H05K5/06 Abstract: A method for manufacturing optical sensor arrangements (10) is provided. The method comprises providing at least two optical sensors (11) on a carrier (12) and providing a cover material (14) on the side of the optical sensors (11) facing away from the carrier (12). The method further comprises providing an aperture (13) for each optical sensor (11) on a top side (15) of the cover material (14) facing away from the carrier (12) and forming at least one trench (16) between the optical sensors (11) from the carrier (12) towards the top side (15) of the cover material (14), the trench (16) comprising inner walls (18). Moreover, the method comprises coating the inner walls (18) with an opaque material (19), such that an inner volume (20) of the trench (16) is free of the opaque material (19), and singulating of the optical sensor arrangements (10) along the at least one trench (16). Furthermore, a housing for an optical sensor is provided.
6
US10256147B2
Dicing method
Publication/Patent Number: US10256147B2 Publication Date: 2019-04-09 Application Number: 15/118,836 Filing Date: 2015-02-09 Inventor: Schrems, Martin   Stering, Bernhard   Schrank, Franz   Assignee: ams AG   IPC: H01L21/78 Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.
7
US9917012B2
Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging
Publication/Patent Number: US9917012B2 Publication Date: 2018-03-13 Application Number: 15/313,489 Filing Date: 2015-05-21 Inventor: Stering, Bernhard   Assignee: ams AG   IPC: H01L23/00 Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. The polyimide layer (8) is severed in sections (18) above the trenches (7) when the tape layer (14) is removed. The semiconductor chip is provided with a cover layer (11) laterally confining the polyimide layer (8) near the trenches (7), in particular for forming breaking delimitations (9).
8
US9961777B2
Method for cutting a carrier for electrical components
Publication/Patent Number: US9961777B2 Publication Date: 2018-05-01 Application Number: 14/112,233 Filing Date: 2012-04-17 Inventor: Stering, Bernhard   Assignee: ams AG   IPC: H01L21/56 Abstract: A trench (20) is introduced into a carrier (10) for electrical components (30) on a first surface (O10a) of the carrier into the material of the carrier (10). The carrier (10) is cut through by a cut (60) being introduced into the material of the carrier from a second surface (O10b) of the carrier (10), said second surface being situated opposite the first surface. The cut is implemented in such a way that the cut (60) runs through the trench (20) on the first surface (O10a) of the carrier. By providing a trench (20) in the material layers of the carrier (10) which are near the surface, it is possible to prevent material from breaking out of the carrier during the singulation of devices (1, 2).
9
TW201820645A
Method for manufacturing optical sensor arrangements and housing for an optical sensor
Publication/Patent Number: TW201820645A Publication Date: 2018-06-01 Application Number: 106137579 Filing Date: 2017-10-31 Inventor: Stering, Bernhard   Etschmaier, Harald   Koenig, Sonja   Assignee: AMS AG   IPC: H01L31/0236 Abstract: A method for manufacturing optical sensor arrangements (10) is provided. The method comprises providing at least two optical sensors (11) on a carrier (12) and providing a cover material (14) on the side of the optical sensors (11) facing away from the carrier (12). The method further comprises providing an aperture (13) for each optical sensor (11) on a top side (15) of the cover material (14) facing away from the carrier (12) and forming at least one trench (16) between the optical sensors (11) from the carrier (12) towards the top side (15) of the cover material (14), the trench (16) comprising inner walls (18). Moreover, the method comprises coating the inner walls (18) with an opaque material (19), such that an inner volume (20) of the trench (16) is free of the opaque material (19), and singulating of the optical sensor arrangements (10) along the at least one trench (16). Furthermore, a housing for an optical sensor is provided.
10
EP2955759B1
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
Publication/Patent Number: EP2955759B1 Publication Date: 2018-09-05 Application Number: 14171940.1 Filing Date: 2014-06-11 Inventor: Minixhofer, Rainer   Stering, Bernhard   Etschmaier, Harald   Assignee: ams AG   IPC: H01L31/0203
11
EP3319125A1
METHOD FOR MANUFACTURING OPTICAL SENSOR ARRANGEMENTS AND HOUSING FOR AN OPTICAL SENSOR
Publication/Patent Number: EP3319125A1 Publication Date: 2018-05-09 Application Number: 16197039.7 Filing Date: 2016-11-03 Inventor: König, Sonja   Stering, Bernhard   Etschmaier, Harald   Assignee: ams AG   IPC: H01L27/146 Abstract: A method for manufacturing optical sensor arrangements (10) is provided. The method comprises providing at least two optical sensors (11) on a carrier (12) and providing a cover material (14) on the side of the optical sensors (11) facing away from the carrier (12). The method further comprises providing an aperture (13) for each optical sensor (11) on a top side (15) of the cover material (14) facing away from the carrier (12) and forming at least one trench (16) between the optical sensors (11) from the carrier (12) towards the top side (15) of the cover material (14), the trench (16) comprising inner walls (18). Moreover, the method comprises coating the inner walls (18) with an opaque material (19), such that an inner volume (20) of the trench (16) is free of the opaque material (19), and singulating of the optical sensor arrangements (10) along the at least one trench (16). Furthermore, a housing for an optical sensor is provided.
12
US2017200647A1
DICING METHOD FOR WAFER-LEVEL PACKAGING AND SEMICONDUCTOR CHIP WITH DICING STRUCTURE ADAPTED FOR WAFER-LEVEL PACKAGING
Publication/Patent Number: US2017200647A1 Publication Date: 2017-07-13 Application Number: 15/313,489 Filing Date: 2015-05-21 Inventor: Stering, Bernhard   Assignee: ams AG   IPC: H01L21/78 Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. The polyimide layer (8) is severed in sections (18) above the trenches (7) when the tape layer (14) is removed. The semiconductor chip is provided with a cover layer (11) laterally confining the polyimide layer (8) near the trenches (7), in particular for forming breaking delimitations (9).
13
US9842946B2
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
Publication/Patent Number: US9842946B2 Publication Date: 2017-12-12 Application Number: 15/317,641 Filing Date: 2015-05-22 Inventor: Minixhofer, Rainer   Stering, Bernhard   Etschmaier, Harald   Assignee: AMS AG   IPC: H01L31/02 Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2).
14
US2017179056A1
SEMICONDUCTOR DEVICE WITH A BUMP CONTACT ON A TSV COMPRISING A CAVITY AND METHOD OF PRODUCING SUCH A SEMICONDUCTOR DEVICE
Publication/Patent Number: US2017179056A1 Publication Date: 2017-06-22 Application Number: 15/118,469 Filing Date: 2015-02-09 Inventor: Schrems, Martin   Stering, Bernhard   Etschmaier, Harald   Assignee: Ams AG   IPC: H01L23/00 Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15′) of the cavity is provided to expose the cavity to the environment.
15
US2017062277A1
DICING METHOD
Publication/Patent Number: US2017062277A1 Publication Date: 2017-03-02 Application Number: 15/118,836 Filing Date: 2015-02-09 Inventor: Schrems, Martin   Stering, Bernhard   Schrank, Franz   Assignee: ams AG   IPC: H01L21/78 Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.
16
US2017125613A1
SEMICONDUCTOR DEVICE COMPRISING AN EMITTER OF RADIATION AND A PHOTOSENSOR AND APPERTAINING PRODUCTION METHOD
Publication/Patent Number: US2017125613A1 Publication Date: 2017-05-04 Application Number: 15/317,641 Filing Date: 2015-05-22 Inventor: Minixhofer, Rainer   Stering, Bernhard   Etschmaier, Harald   Assignee: ams AG   IPC: H01L31/0216 Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2).
17
EP2950338A1
Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging
Publication/Patent Number: EP2950338A1 Publication Date: 2015-12-02 Application Number: 14170380.1 Filing Date: 2014-05-28 Inventor: Stering, Bernhard   Assignee: ams AG   IPC: H01L23/31 Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. The polyimide layer (8) is severed in sections (18) above the trenches (7) when the tape layer (14) is removed. The semiconductor chip is provided with a cover layer (11) laterally confining the polyimide layer (8) near the trenches (7), in particular for forming breaking delimitations (9).
18
WO2015181050A1
DICING METHOD FOR WAFER-LEVEL PACKAGING AND SEMICONDUCTOR CHIP WITH DICING STRUCTURE ADAPTED FOR WAFER-LEVEL PACKAGING
Publication/Patent Number: WO2015181050A1 Publication Date: 2015-12-03 Application Number: 2015061302 Filing Date: 2015-05-21 Inventor: Stering, Bernhard   Assignee: AMS AG   IPC: H01L21/56 Abstract: A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits
19
EP2955759A1
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
Publication/Patent Number: EP2955759A1 Publication Date: 2015-12-16 Application Number: 14171940.1 Filing Date: 2014-06-11 Inventor: Minixhofer, Rainer   Etschmaier, Harald   Stering, Bernhard   Assignee: ams AG   IPC: H01L27/146 Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2).
20
EP2908335A1
Dicing method
Publication/Patent Number: EP2908335A1 Publication Date: 2015-08-19 Application Number: 14155240.6 Filing Date: 2014-02-14 Inventor: Schrank, Franz   Schrems, Martin   Stering, Bernhard   Assignee: ams AG   IPC: H01L21/768 Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.
Total 2 pages