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1
US10734534B2
Method of producing an optical sensor at wafer-level and optical sensor
Publication/Patent Number: US10734534B2 Publication Date: 2020-08-04 Application Number: 15/746,342 Filing Date: 2016-07-22 Inventor: Etschmaier, Harald   Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Assignee: ams AG   IPC: H01L31/0203 Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.
2
US10847664B2
Optical package and method of producing an optical package
Publication/Patent Number: US10847664B2 Publication Date: 2020-11-24 Application Number: 15/773,539 Filing Date: 2016-11-04 Inventor: Mehrl, David   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Schrank, Franz   Assignee: AMS AG   IPC: H01L31/0232 Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.
3
EP3471146B1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: EP3471146B1 Publication Date: 2020-09-09 Application Number: 17196609.6 Filing Date: 2017-10-16 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Labodi, Miklos   Siegert, Jörg   Schrems, Martin   Assignee: ams AG   IPC: H01L27/146
4
US2020313031A1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: US2020313031A1 Publication Date: 2020-10-01 Application Number: 16/756,025 Filing Date: 2018-10-15 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Labodi, Miklos   Siegert, Joerg   Schrems, Martin   Assignee: ams AG   IPC: H01L31/18 Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.
5
US2019165020A1
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
Publication/Patent Number: US2019165020A1 Publication Date: 2019-05-30 Application Number: 16/316,724 Filing Date: 2017-08-08 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Assignee: ams AG   IPC: H01L27/146 Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer is provided and has a main top surface and a main back surface. At or near the top surface of the wafer at least one integrated circuit is arranged having a light sensitive component. A first mold tool is placed over the at least one integrated circuit such that at least one channel remains between the first mold tool and the top surface to enter a first mold material. A first mold structure is formed by wafer-level molding the first mold material via the at least one channel. The first mold material creates at least one runner structure. A second mold tool is placed over the first mold structure and a second mold structure is formed by wafer-level molding a second mold material by means of the second mold tool. A light path blocking structure is arranged on the top surface to block light from entering via the at least one runner structure.
6
EP3166146B1
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
Publication/Patent Number: EP3166146B1 Publication Date: 2019-04-17 Application Number: 15198468.9 Filing Date: 2015-12-08 Inventor: Mehrl, David   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Schrank, Franz   Assignee: ams AG   IPC: H01L25/16 Abstract: An optical package is proposed comprising a carrier (4), an optoelectronic component (2), an aspheric lens (1), and a reflective layer (3). The carrier (4) comprises electrical interconnections (5) and the optoelectric component (2) is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component (2) is mounted on the carrier (4) or integrated into the carrier (4) and electrically connected to the electric interconnections (5). The aspheric lens (1) has an upper surface (11), a lateral surface (12), and a bottom surface (13) and the bottom surface (13) is arranged on or near the optoelectric component (2). The aspheric lens (1) comprises a material which is at least transparent in the specified wavelength range. The reflective layer (3) comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface (12) of the aspheric lens (1), and wherein the reflective material is at least partly reflective in the specified wavelength range.
7
EP3261122B1
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
Publication/Patent Number: EP3261122B1 Publication Date: 2019-10-30 Application Number: 16176222.4 Filing Date: 2016-06-24 Inventor: Enichlmair, Hubert   Schrems, Martin   Toschkoff, Gregor   Bodner, Thomas   Manninger, Mario   Assignee: ams AG   IPC: H01L27/146
8
US2019237500A1
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
Publication/Patent Number: US2019237500A1 Publication Date: 2019-08-01 Application Number: 16/312,145 Filing Date: 2017-06-02 Inventor: Manninger, Mario   Bodner, Thomas   Toschkoff, Gregor   Schrems, Martin   Enichlmair, Hubert   Assignee: ams AG   IPC: H01L27/146 Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer.
9
EP3471146A1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: EP3471146A1 Publication Date: 2019-04-17 Application Number: 17196609.6 Filing Date: 2017-10-16 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Labodi, Miklos   Siegert, Jörg   Schrems, Martin   Assignee: ams AG   IPC: H01L27/146 Abstract: A method for manufacturing an optical sensor (10) is provided. The method comprises providing an optical sensor arrangement (11) which comprises at least two optical sensor elements (12) on a carrier (13), where the optical sensor arrangement (11) comprises a light entrance surface (14) at the side of the optical sensor elements (12) facing away from the carrier (13). The method further comprises forming a trench (15) between two optical sensor elements (12) in a vertical direction (z) which is perpendicular to the main plane of extension of the carrier (13), where the trench (15) extends from the light entrance surface (14) of the sensor arrangement (11) at least to the carrier (13). Moreover, the method comprises coating the trench (15) with an opaque material (16), forming electrical contacts (17) for the at least two optical sensor elements (12) on a back side (18) of the carrier (13) facing away from the optical sensor elements (12), and forming at least one optical sensor (10) by dicing the optical sensor arrangement (11) along the trench (15). Each optical sensor (10) comprises an optical sensor element (12), and the light entrance surface (14) is free of electrical contacts (17) and at least partially free of the opaque material (16) above the optical sensor elements (12). Furthermore, an optical sensor (10) is provided.
10
WO2019076806A1
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
Publication/Patent Number: WO2019076806A1 Publication Date: 2019-04-25 Application Number: 2018078064 Filing Date: 2018-10-15 Inventor: Schrank, Franz   Schrems, Martin   Siegert, JÖrg   Bodner, Thomas   Toschkoff, Gregor   Labodi, Miklos   Assignee: AMS AG   IPC: H01L27/146 Abstract: A method for manufacturing an optical sensor (10) is provided. The method comprises providing an optical sensor arrangement (11) which comprises at least two optical sensor elements (12) on a carrier (13), where the optical sensor arrangement (11) comprises a light entrance surface (14) at the side of the optical sensor elements (12) facing away from the carrier (13). The method further comprises forming a trench (15) between two optical sensor elements (12) in a vertical direction (z) which is perpendicular to the main plane of extension of the carrier (13), where the trench (15) extends from the light entrance surface (14) of the sensor arrangement (11) at least to the carrier (13). Moreover, the method comprises coating the trench (15) with an opaque material (16), forming electrical contacts (17) for the at least two optical sensor elements (12) on a back side(18)of the carrier (13) facing away from the optical sensor elements (12), and forming at least one optical sensor (10) by dicing the optical sensor arrangement (11) along the trench (15). Each optical sensor (10) comprises an optical sensor element (12), and the light entrance surface (14) is free of electrical contacts (17) and at least partially free of the opaque material (16) above the optical sensor elements (12). Furthermore, an optical sensor (10) is provided.
11
US2018226514A1
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
Publication/Patent Number: US2018226514A1 Publication Date: 2018-08-09 Application Number: 15/746,342 Filing Date: 2016-07-22 Inventor: Schrank, Franz   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Assignee: ams AG   IPC: H01L23/00 Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.
12
EP3282480A1
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
Publication/Patent Number: EP3282480A1 Publication Date: 2018-02-14 Application Number: 16183205.0 Filing Date: 2016-08-08 Inventor: Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Assignee: ams AG   IPC: H01L27/146 Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer (10) is provided and has a main top surface (11) and a main back surface (12). At or near the top surface (11) of the wafer at least one integrated circuit (20) is arranged having a light sensitive component (21). A first mold tool (1) is placed over the at least one integrated circuit such that at least one channel (37) remains between the first mold tool (1) and the top surface (11) to enter a first mold material. A first mold structure (30) is formed by wafer-level molding the first mold material via the at least one channel (37). The first mold material creates at least one runner structure (35). A second mold tool (2) is placed over the first mold structure (30) and a second mold structure (40) is formed by wafer-level molding a second mold material by means of the second mold tool (2). A light path blocking structure (50) is arranged on the top surface (11) to block light from entering via the at least one runner structure (35).
13
US2018323320A1
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
Publication/Patent Number: US2018323320A1 Publication Date: 2018-11-08 Application Number: 15/773,539 Filing Date: 2016-11-04 Inventor: Mehrl, David   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Schrank, Franz   Assignee: ams AG   IPC: H01L31/0232 Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.
14
WO2017013256A1
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
Publication/Patent Number: WO2017013256A1 Publication Date: 2017-01-26 Application Number: 2016067563 Filing Date: 2016-07-22 Inventor: Schrank, Franz   Toschkoff, Gregor   Etschmaier, Harald   Bodner, Thomas   Assignee: AMS AG   IPC: H01L31/0203 Abstract: A method of producing an optical sensor at wafer-level
15
EP3121853A1
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
Publication/Patent Number: EP3121853A1 Publication Date: 2017-01-25 Application Number: 15178053.3 Filing Date: 2015-07-23 Inventor: Etschmaier, Harald   Toschkoff, Gregor   Bodner, Thomas   Schrank, Franz   Assignee: ams AG   IPC: H01L31/0203 Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer (1) having a main top surface (10) and a main back surface (13) and arrange at or near the top surface (10) of the wafer at least one first integrated circuit (11) having at least one light sensitive component (12). Furthermore, providing in the wafer (1) at least one through-substrate via (14) for electrically contacting the at least one first integrated circuit (11) via the back surface (13) and forming a transparent first mold structure (2) by wafer-level molding a first mold material over the top surface (10) of the wafer (1), such that the first mold structure (2) at least partly encloses the first integrated circuit (11). Finally, forming an opaque second mold structure (3) by wafer-level molding a second mold material over the first mold structure (2), such that the second mold structure (3) at least partly encloses the first mold structure (2), leaving an aperture (30) open on top of the at least one top surface (21) of the transparent first mold structure (2).
16
EP3166146A1
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
Publication/Patent Number: EP3166146A1 Publication Date: 2017-05-10 Application Number: 15198468.9 Filing Date: 2015-12-08 Inventor: Mehrl, David   Bodner, Thomas   Toschkoff, Gregor   Etschmaier, Harald   Schrank, Franz   Assignee: ams AG   IPC: H01L25/16 Abstract: An optical package is proposed comprising a carrier (4), an optoelectronic component (2), an aspheric lens (1), and a reflective layer (3). The carrier (4) comprises electrical interconnections (5) and the optoelectric component (2) is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component (2) is mounted on the carrier (4) or integrated into the carrier (4) and electrically connected to the electric interconnections (5). The aspheric lens (1) has an upper surface (11), a lateral surface (12), and a bottom surface (13) and the bottom surface (13) is arranged on or near the optoelectric component (2). The aspheric lens (1) comprises a material which is at least transparent in the specified wavelength range. The reflective layer (3) comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface (12) of the aspheric lens (1), and wherein the reflective material is at least partly reflective in the specified wavelength range.
17
EP3261122A1
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
Publication/Patent Number: EP3261122A1 Publication Date: 2017-12-27 Application Number: 16176222.4 Filing Date: 2016-06-24 Inventor: Schrems, Martin   Manninger, Mario   Enichlmair, Hubert   Bodner, Thomas   Toschkoff, Gregor   Assignee: ams AG   IPC: H01L27/146 Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate (100), an integrated circuit (200), a wiring (300), a filter layer (400), a transparent spacer layer (500), and an on-chip diffuser (600). The semiconductor substrate (100) has a main surface (110). The integrated circuit (200) comprises at least one light sensitive area (210) and is arranged in the substrate (100) at or near the main surface (110). The wiring (300) provides an electrical connection to the integrated circuit (200) and is connected to the integrated circuit (200), The wiring (300) is arranged on or in the semiconductor substrate (100). The filter layer (400) has a direction dependent transmission characteristic and is arranged on the integrated circuit (200). In fact, the filter layer (400) at least covers the light sensitive area (210). The transparent spacer layer (500) is arranged on the main surface (110) and, at least partly, encloses the filter layer (400). A spacer thickness is arranged to limit a spectral shift of the filter layer (400). The on-chip diffuser (600) is arranged on the transparent spacer layer (500).
18
WO2017077051A1
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
Publication/Patent Number: WO2017077051A1 Publication Date: 2017-05-11 Application Number: 2016076695 Filing Date: 2016-11-04 Inventor: Schrank, Franz   Mehrl, David   Bodner, Thomas   Etschmaier, Harald   Toschkoff, Gregor   Assignee: AMS AG   IPC: H01L25/16 Abstract: An optical package is proposed comprising a carrier (4)
19
WO2017220316A1
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
Publication/Patent Number: WO2017220316A1 Publication Date: 2017-12-28 Application Number: 2017063557 Filing Date: 2017-06-02 Inventor: Manninger, Mario   Schrems, Martin   Enichlmair, Hubert   Bodner, Thomas   Toschkoff, Gregor   Assignee: AMS AG   IPC: H01L27/146 Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate (100)