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1 | US10734534B2 |
Method of producing an optical sensor at wafer-level and optical sensor
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Publication/Patent Number: US10734534B2 | Publication Date: 2020-08-04 | Application Number: 15/746,342 | Filing Date: 2016-07-22 | Inventor： Etschmaier, Harald Toschkoff, Gregor Bodner, Thomas Schrank, Franz | Assignee: ams AG | IPC: H01L31/0203 | Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure. | |||
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2 | US10847664B2 |
Optical package and method of producing an optical package
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Publication/Patent Number: US10847664B2 | Publication Date: 2020-11-24 | Application Number: 15/773,539 | Filing Date: 2016-11-04 | Inventor： Mehrl, David Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald Schrank, Franz | Assignee: AMS AG | IPC: H01L31/0232 | Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range. | |||
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3 | EP3471146B1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: EP3471146B1 | Publication Date: 2020-09-09 | Application Number: 17196609.6 | Filing Date: 2017-10-16 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Jörg Schrems, Martin | Assignee: ams AG | IPC: H01L27/146 | ||||
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4 | US2020313031A1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: US2020313031A1 | Publication Date: 2020-10-01 | Application Number: 16/756,025 | Filing Date: 2018-10-15 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Joerg Schrems, Martin | Assignee: ams AG | IPC: H01L31/18 | Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided. | |||
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5 | US2019165020A1 |
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
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Publication/Patent Number: US2019165020A1 | Publication Date: 2019-05-30 | Application Number: 16/316,724 | Filing Date: 2017-08-08 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz | Assignee: ams AG | IPC: H01L27/146 | Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer is provided and has a main top surface and a main back surface. At or near the top surface of the wafer at least one integrated circuit is arranged having a light sensitive component. A first mold tool is placed over the at least one integrated circuit such that at least one channel remains between the first mold tool and the top surface to enter a first mold material. A first mold structure is formed by wafer-level molding the first mold material via the at least one channel. The first mold material creates at least one runner structure. A second mold tool is placed over the first mold structure and a second mold structure is formed by wafer-level molding a second mold material by means of the second mold tool. A light path blocking structure is arranged on the top surface to block light from entering via the at least one runner structure. | |||
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6 | EP3166146B1 |
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
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Publication/Patent Number: EP3166146B1 | Publication Date: 2019-04-17 | Application Number: 15198468.9 | Filing Date: 2015-12-08 | Inventor： Mehrl, David Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald Schrank, Franz | Assignee: ams AG | IPC: H01L25/16 | Abstract: An optical package is proposed comprising a carrier (4), an optoelectronic component (2), an aspheric lens (1), and a reflective layer (3). The carrier (4) comprises electrical interconnections (5) and the optoelectric component (2) is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component (2) is mounted on the carrier (4) or integrated into the carrier (4) and electrically connected to the electric interconnections (5). The aspheric lens (1) has an upper surface (11), a lateral surface (12), and a bottom surface (13) and the bottom surface (13) is arranged on or near the optoelectric component (2). The aspheric lens (1) comprises a material which is at least transparent in the specified wavelength range. The reflective layer (3) comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface (12) of the aspheric lens (1), and wherein the reflective material is at least partly reflective in the specified wavelength range. | |||
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7 | EP3261122B1 |
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
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Publication/Patent Number: EP3261122B1 | Publication Date: 2019-10-30 | Application Number: 16176222.4 | Filing Date: 2016-06-24 | Inventor： Enichlmair, Hubert Schrems, Martin Toschkoff, Gregor Bodner, Thomas Manninger, Mario | Assignee: ams AG | IPC: H01L27/146 | ||||
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8 | US2019237500A1 |
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
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Publication/Patent Number: US2019237500A1 | Publication Date: 2019-08-01 | Application Number: 16/312,145 | Filing Date: 2017-06-02 | Inventor： Manninger, Mario Bodner, Thomas Toschkoff, Gregor Schrems, Martin Enichlmair, Hubert | Assignee: ams AG | IPC: H01L27/146 | Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer. | |||
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9 | EP3471146A1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: EP3471146A1 | Publication Date: 2019-04-17 | Application Number: 17196609.6 | Filing Date: 2017-10-16 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz Labodi, Miklos Siegert, Jörg Schrems, Martin | Assignee: ams AG | IPC: H01L27/146 | Abstract: A method for manufacturing an optical sensor (10) is provided. The method comprises providing an optical sensor arrangement (11) which comprises at least two optical sensor elements (12) on a carrier (13), where the optical sensor arrangement (11) comprises a light entrance surface (14) at the side of the optical sensor elements (12) facing away from the carrier (13). The method further comprises forming a trench (15) between two optical sensor elements (12) in a vertical direction (z) which is perpendicular to the main plane of extension of the carrier (13), where the trench (15) extends from the light entrance surface (14) of the sensor arrangement (11) at least to the carrier (13). Moreover, the method comprises coating the trench (15) with an opaque material (16), forming electrical contacts (17) for the at least two optical sensor elements (12) on a back side (18) of the carrier (13) facing away from the optical sensor elements (12), and forming at least one optical sensor (10) by dicing the optical sensor arrangement (11) along the trench (15). Each optical sensor (10) comprises an optical sensor element (12), and the light entrance surface (14) is free of electrical contacts (17) and at least partially free of the opaque material (16) above the optical sensor elements (12). Furthermore, an optical sensor (10) is provided. | |||
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10 | WO2019076806A1 |
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
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Publication/Patent Number: WO2019076806A1 | Publication Date: 2019-04-25 | Application Number: 2018078064 | Filing Date: 2018-10-15 | Inventor： Schrank, Franz Schrems, Martin Siegert, JÖrg Bodner, Thomas Toschkoff, Gregor Labodi, Miklos | Assignee: AMS AG | IPC: H01L27/146 | Abstract: A method for manufacturing an optical sensor (10) is provided. The method comprises providing an optical sensor arrangement (11) which comprises at least two optical sensor elements (12) on a carrier (13), where the optical sensor arrangement (11) comprises a light entrance surface (14) at the side of the optical sensor elements (12) facing away from the carrier (13). The method further comprises forming a trench (15) between two optical sensor elements (12) in a vertical direction (z) which is perpendicular to the main plane of extension of the carrier (13), where the trench (15) extends from the light entrance surface (14) of the sensor arrangement (11) at least to the carrier (13). Moreover, the method comprises coating the trench (15) with an opaque material (16), forming electrical contacts (17) for the at least two optical sensor elements (12) on a back side(18)of the carrier (13) facing away from the optical sensor elements (12), and forming at least one optical sensor (10) by dicing the optical sensor arrangement (11) along the trench (15). Each optical sensor (10) comprises an optical sensor element (12), and the light entrance surface (14) is free of electrical contacts (17) and at least partially free of the opaque material (16) above the optical sensor elements (12). Furthermore, an optical sensor (10) is provided. | |||
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11 | US2018226514A1 |
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
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Publication/Patent Number: US2018226514A1 | Publication Date: 2018-08-09 | Application Number: 15/746,342 | Filing Date: 2016-07-22 | Inventor： Schrank, Franz Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald | Assignee: ams AG | IPC: H01L23/00 | Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure. | |||
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12 | EP3282480A1 |
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
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Publication/Patent Number: EP3282480A1 | Publication Date: 2018-02-14 | Application Number: 16183205.0 | Filing Date: 2016-08-08 | Inventor： Toschkoff, Gregor Bodner, Thomas Schrank, Franz | Assignee: ams AG | IPC: H01L27/146 | Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer (10) is provided and has a main top surface (11) and a main back surface (12). At or near the top surface (11) of the wafer at least one integrated circuit (20) is arranged having a light sensitive component (21). A first mold tool (1) is placed over the at least one integrated circuit such that at least one channel (37) remains between the first mold tool (1) and the top surface (11) to enter a first mold material. A first mold structure (30) is formed by wafer-level molding the first mold material via the at least one channel (37). The first mold material creates at least one runner structure (35). A second mold tool (2) is placed over the first mold structure (30) and a second mold structure (40) is formed by wafer-level molding a second mold material by means of the second mold tool (2). A light path blocking structure (50) is arranged on the top surface (11) to block light from entering via the at least one runner structure (35). | |||
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13 | US2018323320A1 |
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
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Publication/Patent Number: US2018323320A1 | Publication Date: 2018-11-08 | Application Number: 15/773,539 | Filing Date: 2016-11-04 | Inventor： Mehrl, David Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald Schrank, Franz | Assignee: ams AG | IPC: H01L31/0232 | Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range. | |||
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14 | WO2017013256A1 |
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
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Publication/Patent Number: WO2017013256A1 | Publication Date: 2017-01-26 | Application Number: 2016067563 | Filing Date: 2016-07-22 | Inventor： Schrank, Franz Toschkoff, Gregor Etschmaier, Harald Bodner, Thomas | Assignee: AMS AG | IPC: H01L31/0203 | Abstract: A method of producing an optical sensor at wafer-level | |||
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15 | EP3121853A1 |
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SENSOR
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Publication/Patent Number: EP3121853A1 | Publication Date: 2017-01-25 | Application Number: 15178053.3 | Filing Date: 2015-07-23 | Inventor： Etschmaier, Harald Toschkoff, Gregor Bodner, Thomas Schrank, Franz | Assignee: ams AG | IPC: H01L31/0203 | Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer (1) having a main top surface (10) and a main back surface (13) and arrange at or near the top surface (10) of the wafer at least one first integrated circuit (11) having at least one light sensitive component (12). Furthermore, providing in the wafer (1) at least one through-substrate via (14) for electrically contacting the at least one first integrated circuit (11) via the back surface (13) and forming a transparent first mold structure (2) by wafer-level molding a first mold material over the top surface (10) of the wafer (1), such that the first mold structure (2) at least partly encloses the first integrated circuit (11). Finally, forming an opaque second mold structure (3) by wafer-level molding a second mold material over the first mold structure (2), such that the second mold structure (3) at least partly encloses the first mold structure (2), leaving an aperture (30) open on top of the at least one top surface (21) of the transparent first mold structure (2). | |||
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16 | EP3166146A1 |
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
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Publication/Patent Number: EP3166146A1 | Publication Date: 2017-05-10 | Application Number: 15198468.9 | Filing Date: 2015-12-08 | Inventor： Mehrl, David Bodner, Thomas Toschkoff, Gregor Etschmaier, Harald Schrank, Franz | Assignee: ams AG | IPC: H01L25/16 | Abstract: An optical package is proposed comprising a carrier (4), an optoelectronic component (2), an aspheric lens (1), and a reflective layer (3). The carrier (4) comprises electrical interconnections (5) and the optoelectric component (2) is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component (2) is mounted on the carrier (4) or integrated into the carrier (4) and electrically connected to the electric interconnections (5). The aspheric lens (1) has an upper surface (11), a lateral surface (12), and a bottom surface (13) and the bottom surface (13) is arranged on or near the optoelectric component (2). The aspheric lens (1) comprises a material which is at least transparent in the specified wavelength range. The reflective layer (3) comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface (12) of the aspheric lens (1), and wherein the reflective material is at least partly reflective in the specified wavelength range. | |||
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17 | EP3261122A1 |
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
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Publication/Patent Number: EP3261122A1 | Publication Date: 2017-12-27 | Application Number: 16176222.4 | Filing Date: 2016-06-24 | Inventor： Schrems, Martin Manninger, Mario Enichlmair, Hubert Bodner, Thomas Toschkoff, Gregor | Assignee: ams AG | IPC: H01L27/146 | Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate (100), an integrated circuit (200), a wiring (300), a filter layer (400), a transparent spacer layer (500), and an on-chip diffuser (600). The semiconductor substrate (100) has a main surface (110). The integrated circuit (200) comprises at least one light sensitive area (210) and is arranged in the substrate (100) at or near the main surface (110). The wiring (300) provides an electrical connection to the integrated circuit (200) and is connected to the integrated circuit (200), The wiring (300) is arranged on or in the semiconductor substrate (100). The filter layer (400) has a direction dependent transmission characteristic and is arranged on the integrated circuit (200). In fact, the filter layer (400) at least covers the light sensitive area (210). The transparent spacer layer (500) is arranged on the main surface (110) and, at least partly, encloses the filter layer (400). A spacer thickness is arranged to limit a spectral shift of the filter layer (400). The on-chip diffuser (600) is arranged on the transparent spacer layer (500). | |||
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18 | WO2017077051A1 |
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
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Publication/Patent Number: WO2017077051A1 | Publication Date: 2017-05-11 | Application Number: 2016076695 | Filing Date: 2016-11-04 | Inventor： Schrank, Franz Mehrl, David Bodner, Thomas Etschmaier, Harald Toschkoff, Gregor | Assignee: AMS AG | IPC: H01L25/16 | Abstract: An optical package is proposed comprising a carrier (4) | |||
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19 | WO2017220316A1 |
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
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Publication/Patent Number: WO2017220316A1 | Publication Date: 2017-12-28 | Application Number: 2017063557 | Filing Date: 2017-06-02 | Inventor： Manninger, Mario Schrems, Martin Enichlmair, Hubert Bodner, Thomas Toschkoff, Gregor | Assignee: AMS AG | IPC: H01L27/146 | Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate (100) |
3.Current Quota